5G - Page 71 of 74

Disinformation: 15 EU countries complain about growing anti-5G movement

The EU Commission is to start an awareness campaign about electromagnetic radiation and the new generation of mobile communications 5G this year. 15 member states are pushing for this in a fire letter published on Monday to the Brussels government institution, with reference to “increasing activities of the anti-5G movement” in the community. Vandalism against the telecommunications infrastructure and “skyrocketing false reports” about the dangers of wireless technologies threatened the economy in the affected countries and the rollout of 5G.

“The increasing distrust of mobile communications equipment” could have negative effects on the expansion of relevant antennas and the infrastructure for small-cell 5G access points, suggest Bulgaria, Estonia, Finland, Greece, Croatia, Latvia, Lithuania, Luxembourg, Austria, Poland, Portugal, the Czech Republic, Slovakia, Sweden and Cyprus in the letter Alarm published by “Euractiv”. They also fear that approval procedures for the construction of radio masts could be delayed further.

The advantages of 5G show “It It is important to act now to educate the public about the benefits of 5G, “it says. The technology could help with the planned digital and green transformation, for example. A unified communication strategy that provides EU citizens with reliable information from trustworthy sources was urgently needed. Scientific research into the health effects of radiation must continue. Telecom companies have reportedly in the first half of the year – also due to Corona conspiracy myths

Upcoming Hardware Launches 2020 (Updated Oct 2020)

Introduction

In this article, which our team will regularly update, we will maintain a growing list of information pertaining to upcoming hardware releases based on leaks and official announcements as we spot them. There will obviously be a ton of rumors on unreleased hardware, and it is our goal to—based on our years of industry experience—exclude the crazy ones. In addition to these upcoming hardware release news, we will regularly adjust the structure of this article to better organize information. Each time an important change is made to this article, it will re-appear on our front page with a “new” banner, and the additions will be documented in the forum comments thread. This article will not leak information we signed an NDA for.

Feel free to share your opinions and tips in the forum comments thread and subscribe to the same thread for updates.

Last Update (Oct 19th):

Added AMD Lucienne APU
Updated AMD Cézanne / Ryzen 5000 APU
Update AMD Ryzen 5000
Updated Intel Alder Lake
Updated Intel Ice Lake Server
Added Intel Grand Ridge
Updated Intel Meteor Lake
Updated Intel Jasper Lake
Updated AMD Big Navi
Updated AMD RDNA2
Updated NVIDIA RTX 3070
Added NVIDIA RTX 3060 Ti
Added NVIDIA Ampere Mobile
Added AMD Radeon RX 6500
Updated AMD Radeon RX 5300 XT
Updated Intel Xe Graphics
Updated AMD CDNA / CDNA2
Updated Intel 500-Series chipsets
Updated HBM2E memory
Added HBMNext memory
Updated DDR5 memory
Updated TSMC 5 nanometer, 4 nanometer, 3 nanometer, 2 nanometer
Removed launched products: Intel Comet Lake KA, Tiger Lake, NVIDIA RTX 3080 / 3090, Ampere, MX450

Processors

AMD Lucienne Zen 2 APUs / Ryzen 5000 [added]

Release Date: Probably 2021
Successor to “Renoir”
Built on Zen 2 CPU cores, but still branded “Ryzen 5000”
Uses Vega iGPU
Built on slightly refined 7 nm process, but not N7P or N7+
Ryzen 3 5300U: 4c/8t, 2.6 GHz base, 3.85 GHz boost, 4 MB L3, 10-25 W TDP, 6 CU @ 1.5 GHz
Ryzen 5 5500U: 6c/12t, 2.1 GHz base, 4.0 GHz boost, 8 MB L3, 10-25 W TDP, 7 CU @ 1.8 GHz
Ryzen 7 5700U: 8c/16t, 1.8 GHz base, 4.3 GHz boost, 8 MB L3, 10-25 W TDP, 8 CU @ 1.9 GHz
Built on TSMC 7 nm process, N7

AMD Cézanne Zen 3 APUs / Ryzen 5000 [updated]

Release Date: Probably 2021
Successor to “Renoir”
Built on Zen 3 CPU cores, paired with Vega iGPU
Ryzen 3 5400U: 4c/8t, 2.6 GHz base, 4.0 GHz boost, 8 MB L3, 10-25 W TDP, 6 CU @ 1.6 GHz
Ryzen 5 5600U: 6c/12t, 2.3 GHz base, 4.2 GHz boost, 12 MB L3, 10-25 W TDP, 7 CU @ 1.8 GHz
Ryzen 7 5800U: 8c/16t, 2.0 GHz base, 4.4 GHz boost, 16 MB L3, 10-25 W TDP, 8 CU @ 2.0 GHz
Built on slightly refined 7 nm process, but not N7P or N7+
Similar core counts as predecessors
19% IPC uplift on Zen 3 models
Comes in 15 W and 45 W SKUs
“Van Gogh” APU is based on Zen 3, too, but uses RDNA2 iGPU, for ultra-low-end

AMD Ryzen 5000 Desktop / Zen 3 [announced]

Announced: Oct 8, 2020
Market availability: Nov 5
Reviews: Nov 5
Design completed as of Aug 2019
Codename: Vermeer (CPU)
CCX removed, so that all cores on the CCD share a single large L3 cache
Continues to use Socket AM4 for desktop
Redesigned chiplets with 32+ MB shared L3 on each chiplet, as opposed to 2x 16 MB shared between CCX groups
Zen 3 processors are compatible with B450, X470, B550 and X570 motherboards (after BIOS flash)
Ryzen 5 5600X: 6c/12t, 3.7 GHz base, 4.6 GHz boost, 65 W TDP, 32 MB cache, $299
Ryzen 7 5800X: 8c/16t, 3.8 GHz base, 4.7 GHz boost, 105 W TDP, 32 MB cache, $449
Ryzen 7 5900X: 12c/24t, 3.7 GHz base, 4.8 GHz boost, 105 W TDP, 64 MB cache, $549
Ryzen 9 5950X: 16c/32t, 3.4 GHz base, 4.9 GHz boost, 105 W TDP, 64 MB cache, $799
Ryzen 5 5600: Launches 2021 at $220
Far Cry 6 game bundle included (in select markets)
PCIe Gen 4
Up to 19% IPC improvement
24% better energy efficiency, 2.8x efficiency vs. Core i9-10900K
Up to 50% faster floating point
New CPU core

AMD Zen 3 [announced]

Release date: 2021 (Server / Threadripper)
Design completed as of Aug 2019
Codename: Vermeer (CPU), Dali (APU w/ IGP), Milan (Server), Grey Hawk (Embedded), Genesis Peak (Threadripper)
Zen 3 refresh, possibly based on improved tech called “Warhol”
CCX removed, so that all cores on the CCD share a single large L3 cache
Redesigned chiplets with 32+ MB shared L3 on each chiplet, as opposed to 2x 16 MB shared between CCX groups
Server platform codename “Genesis SP3”
Up to 64-cores (128-threads) across eight 8-core chiplets
120 – 225 W TDP
Clock frequencies: up to 3.8 GHz base, up to 4.9 GHz boost
64-core EPYC Milan clocked at 3.0 GHz
PCIe Gen 4
8-channel DDR4 memory
New process tech: 7 nm Plus (probably not 7 nm+ EUV)
20% increase in transistor density, 10% lower power consumption
Up to 15% IPC improvement + more from higher clock frequencies
Up to 50% faster floating point
Possibly support for AVX-512
New CPU core

AMD Zen 4

Release Date: 2021
“In Design” as of Nov 2018
“On Track” for 2021 launch as of Dec 9, 2019
5 nm TSMC process
DDR5 memory support
Improves IPC
Server platform codenamed “Genoa”
PCI-Express Gen 5
More cores per chiplet
Uses 3rd generation Infinity Fabric, which adds cache-coherent unified memory
Uses Socket SP5 for EPYC, new mainstream socket expected (AMD Socket AM5)

AMD Zen 5

Release Date: 2022
5 nm or 3 nm TSMC process
DDR5 memory support
PCI-Express Gen 5
Desktop codename: “Raphael”
APU codename: “Rembrandt”
Uses Socket SP5 for server, desktop uses Socket AM5

Intel Ice Lake Server [updated]

Release date: late 2020, re-confirmed as of Q2 2020
Ice Lake mobile was launched in late 2019
Ice Lake desktop was scrapped because it wasn’t competitive with Comet Lake
Xeon codename “Whitley”
Uses new 4189-pin LGA socket
8-channel DDR4 interface
10 nanometer DUV (deep-ultraviolet) process
Brand-new CPU core design codenamed “Sunny Cove”
PCI-Express Gen 4.0
“GenuineIntel Family 6 Model 106 Stepping 4” processor: 24c/48t, 2.2 GHz base, 2.9 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 36 MB
“GenuineIntel Family 6 Model 106 Stepping 5” processor: 28c/56t, 1.5 GHz base, 3.5 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 42 MB
2x 28c CPU Geekbench SP = 3424, MP = 38079, EPYC 7742: SP = 4398, MP = 35492
Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI
20-30% broadening of various number crunching resources, wider execution window, more AGUs
18% IPC gains vs Cascade Lake
SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. “Skylake”
Supports unganged memory mode
Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance
Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support
Gen11 also features tile-based rendering, one of NVIDIA’s secret-sauce features
Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this
Ice Lake introduces Intel TME (Total Memory Encryption), also Intel Platform Firmware Resilience (Intel PFR)

Intel Core i9-10990XE

Release Date: unknown, originally early 2020, seems cancelled now
22-cores + HyperThreading
Uses Cascade Lake-X architecture
LGA2066 Socket
1 MB L2 cache per core, 30.25 MB shared L3 cache
4 GHz base, up to 5 GHz boost
Roughly matches Threadripper 3960X in Cinebench

Intel Rocket Lake [updated]

Release Date: Q1 2021
Succeeds “Comet Lake”
Variants: Rocket Lake-“S” (mainstream desktop), -“H” (mainstream notebook), -“U” (ultrabook), and -“Y” (low power portable)
14 nanometer production process
Seems to be limited to eight cores (2 less than 10-core Comet Lake)
Some indication of mixed HyperThreading configurations, for example 8-core, 12-thread
Uses “Cypress Cove” core, which seems to be a backport of “Willow Cove” to 14 nm process
Up to 10% IPC improvement over Skylake
No FIVR, uses SVID VRM architecture
125 W maximum TDP
Compatible with 400-series chipsets
Possible they release 500-series chipsets with added features
Socket LGA1200 (just like Comet Lake)
Supports PCI-Express 4.0
20 PCIe lanes
Intel Xe integrated graphics, based on Gen 12 with HDMI 2.0b and DisplayPort 1.4a
Xe EU count only 32, Tiger Lake will have 96
2.5 Gb/s Ethernet, Thunderbolt 4, USB 3.2 20G
iGPU with up to 32 EUs
Memory support: DDR4-2933
32 KB L1I cache, 48 KB L1D cache, 512 KB per core L2 cache, and 16 MB shared L3 cache (8-core chip)
Engineering Sample: Family 6, Model 167, Stepping 0, 8c/16t, 3.4 GHz base, 5.0 GHz boost
Engineering Sample: Family 6, Model 167, Stepping 0, 8c/16t, 3.2 GHz base, 4.3 GHz boost

Intel Willow Cove and Golden Cove Cores

Release Date: 2021
Succeeds “Sunny Cove”
Willow Cove improves on-die caches, adds more security features, and takes advantage of 10 nm+ process improvements to increase clock speeds versus Sunny Cove
Golden Cove will add significant single-thread (IPC) increases over Sunny Cove, add on-die matrix multiplication hardware, improved 5G network-stack HSP performance, and more security features than Willow Cove

Intel Alder Lake [updated]

Release Date: H2 2021
Mixes CPU cores of various processing power (and energy consumption), similar to the Big.Little-like designs for mobile devices
Combines up to eight Golden Cove with up to eight Gracemont (Atom) cores
These cores have two different instruction sets, for example Golden Cove has AVX-512, TSX-NI and FP16, which Gracemont lacks
10 nm process
Uses Socket LGA1700
Alder Lake for desktop: 37.5 mm x 45 mm package
Desktop CPUs come in 125 W and 80 W
Could use Foveros 3D Stacking technology
Possible CPU configurations 8+8+1 (8 big cores, 8 small cores, GT1 integrated), and 6+0+1 (6 big cores, no small cores and GT1 integrated)
Includes Gen12 Xe iGPU
DDR5 memory support
PCI-Express 5.0 support
Includes CLDEMOTE instruction, to invalidate cache lines

Intel Sapphire Rapids

Release Date: H2 2021
Successor to Cooper Lake
8-channel DDR5
Uses Socket LGA4677
For enterprise / data center
10 nm+ production process
Willow Cove CPU cores
PCIe 5.0
Probably 7 nm process
Platform name: Eagle Stream
Includes CLDEMOTE instruction, to invalidate cache lines

Intel Grand Ridge [added]

Release Date: 2022 or later
Produced on 7 nm HLL+ process
Successor to Atom “Snow Ridge”
24 cores across 6 clusters with 4 cours each
4 MB L2 per cluster, plus L3 cache
Uses Gracemont CPU core
Dual-channel DDR5
PCI-Expres Gen 4 with 16 lanes

Intel Elkhart Lake

Release Date: Unknown
Produced on 10 nm process
Designed for next-gen Pentium Silver and Celeron processors
CPU cores use Tremont architecture
GPU uses Gen 11
Dual-core and Quad-core configurations
Single-channel memory controller with DDR4 and LPDDR4/x support
Engineering sample: 1.9 GHz, 5/9/12 W TDP

Intel Meteor Lake [updated]

Release Date: 2022 or 2023
Succeeds “Alder Lake”
New microarchitecture, more advanced than “Willow Cove”, possibly “Golden Cove”
As of late 2020 Intel is adding support for Meteor Lake to the Linux Kernel
Produced on 7 nm EUV Intel process

Intel Jasper Lake [updated]

Release Date: Unknown
Uses Tremont architecture
10 nm production process
Successor to Gemini Lake
ES: 4c/4t, 1.1 GHz Base, 1.12 GHz Boost
DDR4 memory support
Pentium Silver J6005: 4c/4t, 2 GHz base, 3 GHz boost, 4 MB L2
Celeron J5105: 2 Ghz vase, 2.8 GHz boost, 4 MB L2
Celeron J4505: 2c/2t, 2 GHz base, 2.9 GHz boost 4 MB L2
Pentium Silver N6000 Mobile: 4c/4t, 1.1 GHz base, 3.1 GHz boost, 4 MB L2
Celeron N5100 Mobile: 1.1 GHz base, 2.8 GHz boost
Celeron N4500 Mobile: 2c/2t, 1.1 GHz base, 2.8 GHz boost

Intel Granite Rapids

Release Date: 2022
Successor to Sapphire Rapids
8-channel DDR5
For enterprise / data center
PCIe 5.0
Probably 7 nm+ process
Platform name: Eagle Stream

VIA CenTaur / Zhaoxin KaiXian

Release Date: H2 2020
Eight-core 64-bit CPU, 2.5 GHz
AVX-512 supported
16 nm FinFET TSMC
195 mm² die size
Use LGA socket
Codename: “CHA”, pronounced “C-H-A”
Separate AI co-processor “NCORE”
All cores + NCORE connected using a ring bus
Integrated VIA S3 graphics with DirectX 11.1
16 MB shared L3 cache
Four-channel DDR4-3200 memory support
44 PCI-Express 3.0 lanes
Sold as Zhaoxin KaiXian KX-6780A in China (end of Jan 2020): 8 core, 8 threads, 2.7 GHz, 8 MB cache, dual-channel DDR4-3200
Southbridge integrated
Multi-socket capable

Graphics / GPUs

NVIDIA RTX 3070 [updated]

Release Date: Oct 29 2020
Based on GA104 GPU
GA104-400 for RTX 3070, 5888 CUDA cores, 1.5 GHz base, 1.73 GHz boost, 256-bit GDDR6 memory, $499
RTX 3070 Ti rumored with 16 GB, GDDR6X, GA104-300

NVIDIA RTX 3060 [added]

Release Date: 2020 or 2021
8 GB GDDR6
Matches RTX 2080 performance

NVIDIA RTX 3060 Ti [added]

Release Date: 2020 or 2021
GA104 GPU, same as RTX 3070
4864 shaders, 38 RT cores, 152 tensor cores, 152 TMUs
8 GB GDDR6, 256-bit
180 – 200 W TDP, 1x 8-pin power
Gigabyte GeForce RTX 3060 Ti Aorus Master 8G (GV-N306TAORUS M-8GD), Gigabyte GeForce RTX 3060 Ti Gaming OC 8G (GV-N306TGAMING OC-8GD), Gigabyte GeForce RTX 3060 Ti Eagle OC 8G (GV-N306TEAGLE OC-8GD), and the Gigabyte GeForce RTX 3060 Ti Eagle 8G (GV-N306TEAGLE-8GD)

NVIDIA Ampere with more VRAM

Release Date: December 2020
RTX 3080 with 20 GB memory (instead of 10 GB)
RTX 3070 with 16 GB memory (instead of 8 GB)

NVIDIA RTX 3000 Mobile Ampere [added]

Release Date: 2021
RTX 3070 Mobile (Max Q), H56C8H24AIR GDDR6 memory

NVIDIA Ampere Refresh

Release Date: unknown
NVIDIA is moving their existing designs from Samsung 8 nm to TSMC 7 nm

NVIDIA Hopper

Release Date: unknown
Successor to “Ampere” architecture
MCM (multi-chip module) GPU packages
Seems to be for workstation/compute only

AMD Radeon RX 5300 XT [updated]

Release date: unknown
Non-XT version has launched on Aug 31, 2020 (1408 cores, 3 GB GDDR6, 96-bit, 1448 MHz game clock, 1645 MHz boost, 100 W TDP)
24 Compute Units / 1536 Stream Processors
3 GB GDDR6 memory, 96-bit
7 nanometer production process
Probably based on Navi 14 GPU

AMD Radeon RX 5600M and RX 5700M

Release date: unknown
Based on Navi 10 silicon
7 nanometer production process
RX 5700M: 2304 shaders, 144 TMUs, 64 ROPS, 8 GB GDDR6 memory, 256-bit, 1620-1720 MHz
RX 5600M: 2304 shaders, 144 TMUs, 64 ROPS, 6 GB GDDR6 memory, 192-bit, 1190-1265 MHz

Big Navi / Navi 20 / Navi 21 / Radeon RX 6000 Series [updated]

Release Date: Late 2020
Announcement: October 28
Uses RDNA2 graphics architecture
7 nanometer, possibly 7 nm+ EUV
Codename could be “Sienna Cichlid”
Goes up against NVIDIA high-end Ampere
Radeon RX 6000 Series: Radeon RX 6900, RX 6900 XT, RX 6900 XTX
Navi 21: 2x Navi 10, 80 CU, 5120 Stream Processors, 16 GB GDDR6, 255 W TGP, 2.4 GHz Game Clock, 536 mm² die size, dual 8-pin power inputs, 2x DP, 1x HDMI, 1x USB-C
4K performance slightly below RTX 3080, Borderlands 3: 61 FPS, COD MW: 88 FPS, Gears 5: 73 FPS
Aims to provide playable 4K framerates
Features “Infinity Cache”
Lisa Su in a CES 2020 interview said “we will have a high-end Navi […] it is important”
AMD CFO: “Big Navi” will be a halo product and not merely a lofty performance increase over the RX 5700 XT to make AMD competitive against GeForce “Ampere.”
Adds support for DirectX 12 Ultimate: variable-rate shading and hardware-accelerated ray-tracing (DXR version 1.1)

AMD RDNA 2 [updated]

Announcement: October 28
Lisa Su: “we will have our new next-generation RDNA architecture that will be part our 2020 lineup”
TSMC, 7 nm Plus (probably not 7 nm+ EUV)
Up to 18% higher transistor density
Higher clock speeds than RDNA
50% better performance per Watt than RDNA, twice the efficiency as GCN
Adds variable rate shading
Adds support for BFloat16
Adds AV1 video decode hardware acceleration
Adds hardware raytracing acceleration (DXR version 1.1)
Supports Microsoft DirectX 12 Ultimate API /DXR, VRS, Mesh Shaders & Sampler Feedback)
Same GPU architecture powers PlayStation 5 & Xbox Series X

AMD Radeon RX 6500 [added]

Release date: unknown
40 Compute Units / 2560 Stream Processors
192-bit GDDR6 memory
7 nanometer production process
RDNA2 architecture
Codename “Navy Flounder”
Below $250

AMD RDNA 3

Release Date: Late 2021 or 2022
“Advanced Node”, probably TSMC 6 nm or 5 nm

AMD CDNA and CDNA2 [updated]

Release Date: 2020 for CDNA and 2021-2022 for CDNA2
New architecture that focuses on compute for “Radeon Instinct”
TSMC 7 nm or 7 nm+
128 Compute Units = 8192 shaders
Arcturus engineering sample has 120 CUs (7680 shaders), 878 MHz for the core clock, 750 MHz SoC clock, and 1200 MHz memory clock
Compute only—Rasterization, display controllers and media encoding hardware removed
Product name: Radeon Instinct MI100, 120 CU / 7680 cores, 32 TFLOP FP32
1000 MHz memory clock: 1 TB/s memory bandwidth
GPU clock up to 1334 MHz
200 W TDP
CDNA seems to be very similar to Vega
Add Tensor cores like on NVIDIA
Uses 32 GB HBM2 or HBM2E memory from Hynix and Samsung
Infinity Fabric link to pool multiple GPUs
CDNA2 implements Infinity Fabric gen 3.0 to support vast memory pools and cache-coherent unified memory access
Adds support for BFloat16

Intel Xe Discrete Graphics [updated]

Release Date: 2021 for discrete GPU
Intel has scheduled a presentation event for August 13th, also Hot Chips Conference presentation on August 17th
Announcement: Xe DG1-SDV (Software Development Vehicle) announced at CES 2020 (Jan 9th 2020)
First Intel Discrete GPU since ill-fated Larrabee
New architecture built from the ground up, and not an upscale of Gen 11
Developer kit shipping as of Q4 2019, called “Discrete Graphics DG1 External FRD1 Accessory Kit (Alpha) Developer Kit”
Intel DG2: 8 GB GDDR6, Tiger Lake-H CPU, 256-bit memory bus, 512 EU
SDV OpenCL performance in Geekbench: 55373 points, with 3.53 Gpixels/s in “Sorbel,” 1.30 Gpixels/sec in Histogram Equalization, 16 GFLOPs in SFFT, 1.62 GPixels/s in Gaussian Blur, 4.51 Msubwindows/s in Face Detection, 2.88 Gpixels/s in RAW, 327.4 Mpixels/s in DoF, and 13656 FPS in Particle Physics. Roughly matches 11 CU Vega Picasso IGP
SDV is 15.2 cm long, 96 Execution Units, PCI-Express x16, slot only power (so 75 W), 3x DisplayPort, 1x HDMI, high noise levels
Up to 2x performance uplift for Intel Xe integrated graphics over previous Gen 11
Using a multi-chip design approach, with Foveros, Intel Xe scales up to 512 EUs with 500 W
512 EU model is datacenter only, 300 W 256 EU model for enthusiast markets
Targeted at 1080p gameplay, CES demonstration showed working gameplay on Destiny 2
Could be produced at Samsung to leverage their 10 nm tech, while Intel ramps up its own
Future Xe GPUs could be built on TSMC 6 nm and 3 nm nodes
Raytracing hardware acceleration support will definitely be included on the data-center GPUs (and probably on the consumer models, too)
Double-digit TFLOP/s scaling all the way up to 0.1+ PFLOP/s
Will be used in upcoming Cray Aurora Supercomputer for Argonne National Laboratory in 2021
Targeting a wide segment of markets, including consumer (client-segment) graphics, enthusiast-segment, and data-center compute
Uses new graphics control panel that’s being introduced during 2019

Intel Discrete GPU / Arctic Sound

Release Date: 2020
Intel will hold a world tour in 2019, to build enthusiasm for the new architecture
Advanced management for power and clocks
Test chip: 8×8 mm² die area, 1.54B transistors, 14 nm, 50-400 MHz clock, EUs at 2x clock if needed
Raja Koduri who left AMD in late 2017 is somehow involved
Confirmed to support VESA Adaptive Sync

Intel Ponte Vecchio

Release Date: 2021 or 2022
Discrete GPU
Produced on 7 nanometer production process
Probably not 7 nanometer Intel but 7 nm TSMC or even 6 nm TSMC
Multiple GPU dies will be combined into a single accelerator
Architected “for HPC modeling and simulation workloads and AI training”
Workloads can be processed by GPU and CPU at the same time, using Intel oneAPI
Foveros packaging technology
Xe link to combine multiple GPUs (CXL interconnect)

Intel Jupiter Sound

Release Date: 2022
Discrete GPU
Produced on 10 nanometer production process
Successor to Arctic Sound

Zhaoxin Discrete GPU

Release Date: Unknown
Discrete GPU
Produced on 28 nanometer production process
70 Watt TDP
Based on VIA S3 graphics IP

Chipsets

Intel 500 Series Chipsets [updated]

Release Date: 2021, possibly March
For Rocket Lake processors
Models: Z590 (overclockers), H570 (premium desktop), B560 (midrange desktop), H510 (entry-level desktop), Q570 (commercial desktop), W580 (workstation)
Socket LGA1200
PCI-Express 4.0
2.5 Gb/s Ethernet, Thunderbolt 4, USB 3.2 20G

AMD 600-Series Chipsets

Release Date: September 2020, at the same time as Zen 3.
Highly likely these were scrapped when AMD decided to enable compatibility with 400 and 500 series chipsets
Socket AM4
Supporting Zen 3 Ryzen 4000 processors
Support for older CPUs very likely, probably at least Ryzen 3000
PCI-Express 4.0

Memory

DDR5 System Memory [updated]

Release Date: Late 2020, probably 2021
JEDEC standard finalized as of Jul 15th 2020
Demo’d in May 2018 by Micron: DDR5-4400
Samsung 16 Gb DDR5 DRAM developed since February 2018
Samsung has completed functional testing and validation of a LPDDR5 prototype: 10 nm class, 8 Gbit, final clocks: DDR5-5500 and DDR5-6400
Samsung has started 16 Gb LPDDR5 mass production in Aug 2020
SK Hynix 4800 – 5600 Mbps, 1.1 V
SK Hynix also has 16 Gb DDR5-5200 samples ready, 1.1 V, mass production expected 2020
April 2020: Hynix has 8.4 Gbps DDR5, minimum density per die is 8 Gbit, maximum is 64 Gbit
ECC is now supported by all dies (no longer specific to server memory modules)
SK Hynix demonstrated DDR5 RDIMM modules at CES 2020: 4800 MHz, 64 GB
Micron is shipping LPDDR5 for use in Xiaomi phones (Feb 2 2020). 5.5 Gbps and 6.4 Gbps
Samsung has begun production for LPDDR5 for mobile devices (Feb 25 2020). 16 GB, 5.5 Gbps
4800 – 6400 Mbps
Expected to be produced using 7 nm technologies
32 banks, 8 bank groups
64-bit link at 1.1 V
Burst length doubled to BL16
Bank count increased from 16 to 32
Fine grain refresh feature
Improved power efficiency enabled by Vdd going from 1.2 V to 1.1 V as compared to DDR4
On-die ECC
Voltage regulators on the DIMM modules
AMD DDR5 memory support by 2021/2022, with Zen 4

HBM2E Graphics Memory [updated]

Release Date: 2020
Offers 3.2 Gbps per pin (33% faster than HBM2)
Rambus offers a 4.0 Gbps memory interface controller
Samsung Flashbolt: 16 Gb per die, 8-layers stacked, 16 GB per chip with 410 GB/s bandwidth
Hynix: 460 GB/s, 3.6 Gbps, eight 16 Gb chips are stacked for a single 16 GB chip
Hynix: mass production has started as of July 2020

HBM3 Graphics Memory

Release Date: Not before 2019
Double the memory bandwidth per stack (4000 Gbps expected)
Expected to be produced using 7 nm technologies

HBMNext Memory [added]

Release Date: Late 2022 or 2023
JEDEC work in progress
Micron involved

GDDR6X Graphics Memory

Release Date: 2020
Will first be used on new GeForce RTX 3000 / Ampere Series

Silicon Fabrication Tech

TSMC 7 nanometer+

Release Date: Q4 2019
TSMC N7+ is successor to original 7 nm node
Uses EUV (Extreme Ultra Violet)
15-20% more density and improved power consumption over N7

TSMC 6 nanometer

Release Date: Unknown
Backwards compatible with 7 nm process—no new design tools needed
Uses EUV (Extreme Ultra Violet), up to four EUV layers
18% higher logic density than N7

TSMC 5 nanometer [updated]

Release Date: March 2020 to tape-out customer designs
Risk production as of Q2 2019
High volume production: Q2 2020
Uses TSMC’s second implementation of EUV (Extreme Ultra Violet)
Up to 1.8x the density of 7 nm
Up to 14 layers
+15% higher clocks
30% better bower than N7
Intel might be a customer of this node
N5P “Plus” node: improvement to N5 while staying on 5 nm, 84-87% increase in transistor densities over N7

TSMC 5 nanometer+

Release Date: 2021
High-volume production in Q4 2020
Uses EUV (Extreme Ultra Violet)

TSMC 4 nanometer [updated]

Mass production: 2023
Codename “N4”
Uses EUV lithography

TSMC 3 nanometer [updated]

April 2020: On-Track
Risk production: 2021
Volume production: H1 2022
FinFET technology
Uses TSMC’s third implementation of EUV (Extreme Ultra Violet)
10-15% speed improvement at iso-power or 25-30% power reduction at iso-speed, compared to N5.
55,000 water per month at the start, 100,000 by 2023

TSMC 2 nanometer [updated]

No details known other than “TSMC has started development”
June 2020: TSMC is accelerating R&D
Sep 2020: Fab construction has begun
Will use Gate-All-Around (GAA) technology

Samsung 6 nanometer

Release Date: Unknown
First product taped out as of Q2 2019
Uses EUV (Extreme Ultra Violet)
Special variant for customers

Samsung 5 nanometer

Release Date: 2020
Ready for customer sample production as of Q2 2019
Mass production in Q2 2020
Yields are challenging as of Q2 2020
Uses EUV (Extreme Ultra Violet)
Up to 25% the density of 7 nm
20% lower power consumption
10% higher performance

Samsung 3 nanometer

Release Date: 2022
50% less power while delivering 30% more performance
45% less silicon space taken per transistor (vs 7 nm)

Intel 7 nanometer

Release Date: 2022 or 2023
Succeeded by 7 nm+ node in 2022, and 7 nm++ in 2023
Uses EUV (Extreme Ultra Violet)
4x reduction in design rules
Planned to be used on multiple products: CPU, GPU, AI, FPGA, 5G networking

Other

Hynix 4D NAND

Release Date: H1 2019
Developed by SK Hynix
Sampling in Q4 2018
Products demonstrated at CES 2020: Platinum P31 M.2 NVMe and Gold P31—PCIe 3.0 x4, using flash, DRAM and controller made by Hynix, over 3 GB/s read/write.
Reduces chip physical size, while increasing capacity at the same time
Supports TLC and QLC
30% higher write and 25% higher read performance
1.2 V
1st generation: 96 stacks, 1.2 Gbps per pin, 512 Gbit TLC
128 stacks in development, scales up to 512 stacks

Toshiba 5-Bit-per-Cell NAND Flash (PLC)

Release Date: Unknown
Stores an additional bit of information per cell (compared to QLC)
32 states per cell
Will enable even cheaper SSDs, probably with a performance cost

Toshiba XL-Flash

Developed by Toshiba
Uses existing SLC flash technology to improve latencies
1/10th the read latency of TLC
Good for random IOPS and better QoS at shallow queue depth
Can combine SLC and TLC/QLC for tiered, cost-optimized storage
Intel Optane memory competitor
128 gigabit (Gb) die (in a 2-die, 4-die, 8-die package)
4 KB page size for more efficient operating system reads and writes
16-plane architecture for more efficient parallelism
Fast page read and program times

Micron 128-layer 3D NAND Flash

Release Date: 2020, taped out as of Q4 2019
CMOS-under-array design, but with Replacement Gate (RG) Technology instead of Floating Gate
Only for few applications, more focused on next-generation RG tech, which brings down cost, too

Toshiba 128-layer 3D NAND Flash

Release Date: 2020 or 2021
Developed by Toshiba and partner Western Digital
Called BiCS 5
According to a press release in Feb 2020, this is actually a 112 layer stacking process
Cells are TLC (not QLC)
Chip density: 512 Gb
Write performance per channel doubled to 133 MB/s

Intel 144-layer 3D NAND Flash

Release Date: 2020
Supports QLC, but can be configured to work as TLC or SLC
SSD codename “Keystone Harbor”
PLC (5-bit per cell) technology development is underway
Optane product codename “Alder Stream”, PCIe Gen4

SK Hynix 128-layer 3D NAND Flash

Mass Production: July 2020
Up to 1 Tb TLC flash per chip
Data rate up to 1400 Mbps at 1.2 V
Products will be 2 TB client SSD with in-house controller and 16 TB / 32 TB NVMe datacenter SSDs.

Samsung 160-layer 3D NAND Flash

Release Date: End of 2020
7th generation V-NAND

Intel CXL Interconnect

New interconnect for high-bandwidth devices like GPUs
Targeted at enterprise and servers
Competitor to NVLink, Infinity Fabric and PCI-Express
Uses PCIe physical layer
Link layer designed for low latency
32 Gbps per lane, per direction (Like PCIe Gen 5.0)

PCI-Express 5.0

Specification released end of May 2019
Products not expected before 2020
32 GT/s bandwidth per lane, per direction (4x the bandwidth of PCIe 3.0)
128/130 bit encoding (= 1.5% overhead)
Implements electrical changes to improve signal integrity and mechanical performance of connectors
Physical connector

Huawei Mate 40 Pro – we got to know the appearance and specification of the smartphone

Not so long ago, we waited for new Huawei smartphones with bated breath, especially since models such as P 30 Pro or Mate 20 Pro were once considered to be one of the best devices in their class. Unfortunately, the loss with the American government was not kind to the Chinese, as as a result the manufacturer lost the ability to use Western technologies and is already installing Google services on its phones. No wonder then that models such as Mate 30 Pro and P 40 Pro were just a curiosity with us … Will it be the same for Mate 40 Pro? Rather yes, but it does not change the fact that we are preparing an extremely interesting smartphone with considerable possibilities. What do we already know about it?

The premiere of the smartphone will take place 22 October. Electronics fans definitely have something to wait for, because a piece of a decent device is being prepared. For others, it may be just an expensive curiosity …

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SoC Kirin 9000 from Huawei Mate 40 Pro tested in Geekbench

Huawei Mate 40 The Pro does not seem as groundbreaking as previous Chinese flagships. The device will have 6, 76 – inch AMOLED screen with unusual resolution 1344 x 2772 pixels (pixel density 456 ppi) with refresh 90 Hz The panel will again have curved edges, but Interestingly, this time there will be no shortage of physical buttons to adjust the volume or turn it off fingerprints. The heart of the new Mate will be the Kirin chip 9000 made in the 5 nm process and equipped with an integrated 5G modem. The processor will consist of a large Cortex-A core 77 with a clock up to 3, 13 GHz, three more A 77 working with clock 2, 54 GHz and four small A units 55 (2, 04 GHz). The GPU is a Mali-G chip 78, which should leave even Snapdragon graphics behind 865 +. In Europe, Huawei reportedly plans to sell a version with 8 GB of RAM and 256 GB of UFS 3.1. The China version will go to 12 GB of RAM.

Huawei P 40 Pro + in Polish stores. Preorder Price and Bonuses

Now let’s turn to the main camera. The main matrix will have a resolution 50 Mpix, f / 1.9 aperture and optical stabilization. In addition, there will be an ultra-wide angle lens on board 20 Mpix f / 1.8, telephoto 10 Mpix f / 3.4 (providing optical zoom x5), as well as a laser sensor that supports autofocus. In the front, in a not very pretty “bean”, we find a front camera 13 Mpix f / 2.4 and 3D face scanner. The rest of the specification is completed by a battery 4400 mAh with support for wireless and network charging 65 Android system 10 with Huawei Mobile Services, as well as a USB Type-C port and Bluetooth 5.2, NFC and Wi-Fi 6 modules. and dimensions 162, 9 × 75, 5 × 9.1 mm at weight 212 grams. The premiere of the smartphone will take place in October 22 October. The price is not known yet. It is possible that during the debut we will also meet Mate 40 Pro + , which visually will be slightly different from the regular Pro – the photo below shows us.

Source: WinFut

Nokia and NASA together to bring 4G LTE connectivity to the moon

Nokia and NASA have partnership for the construction of the first 4G LTE network on the Moon’s soil. This will serve the astronauts of the Artemis missions, landers and rovers to be able to communicate efficiently.

by Mattia Speroni published 19 October 2020 , at 16: 51 in the Science and Technology channel

NASA Nokia

The connectivity is an important issue and it is even more so when infrastructure is lacking, not only on Earth but also in Space! This is why the partnership between Nokia and NASA to bring connectivity 4G LTE on the Luna plays an important role, especially in view of the Artemis missions.

The solutions of the Nokia Bell Labs will be used to create a configuration 4G LTE end-to -end which will promise to take up little space, be low-powered, and withstand the extreme conditions of the space and lunar environment. All within 2022, considering that if the program is respected, we will see humans walking on our satellite in the 2024.

To succeed in building a communication network on the Moon, Nokia is collaborating with Intuitive Machines in order to integrate its systems within the lander which will land on the Moon by the end of 2021. The system will work autonomously to create the first 4G LTE network on the satellite surface.

Marcus Weldon (CTO of Nokia and President of Nokia Bell Labs) stated “leveraging on our rich history of success in space technologies, from cutting-edge satellite communication to the discovery of cosmic background radiation to microwaves produced by the Big Bang, we are now building the first cellular communication network on the Moon. Reliable, resilient, and high-capacity communication networks will be critical to supporting sustainable human presence on the lunar surface. Building the first high-performance wireless network solution on the Moon, Nokia Bell Labs is once again planting the banner of pioneering innovation beyond conventional limits “.

Such a network will serve for various purposes com and sending and receiving data from the various modules, remote control of the rovers, communication between the various teams, high definition video streaming. It will therefore be a fundamental system for human stay on the Moon.

The network structure Nokia dedicated to the Luna includes: 4G LTE base radio station with EPC functionality, RF antennas and control software for operations and maintenance. All focusing on resistance both at launch and landing as well as obviously survival on the lunar surface. Furthermore, in the future, there will also be the implementation of 5G-based communication technology.

The culture of the data center according to Vertiv

The concept of digital reach, the ability to manage digital services wherever needed is leading to a major transformation in the data center industry, which is moving towards more agile solutions, to be installed at the edge

by Alberto Falchi published on 19 October 2020 , at 15: 01 in Cloud channel

Data Center Vertiv IDC

I data center today are one of the most important assets of companies. This is where the most valuable data is stored and business apps run, and it is easy to understand their centrality in the business economy. The cloud has not replaced them , on the contrary, it has made them even more fundamental and – in some ways – flexible . Until a few years ago the data center contained all the digital assets of a company, but things have changed radically and first the cloud and now, in constant growth, the edge . The revolution of industry 4.0 and the spread of the IoT in the industrial sector have in fact made it necessary to process data where it is generated , drastically lowering latencies. The spread of 5G can only further accelerate this trend.

The modern data center

In light of the above, it is clear that when we talk about data centers, we are not referring to a single type of structure. There are the classic ones, huge rooms inside which there are dozens, if not hundreds, of rack cabinets, but there is no shortage of compact size data centers, usually installed in peripheral offices and factories: these do not manage all the corporate data assets, but they usually share information with the central ones and with the cloud, delivering the computing power necessary for applications running on the edge of the infrastructure.

Vertiv and the concept of digital reach

This summer, in June, Vertiv participated in the forum Future of Infrastructure 2020 , organized by IDC . The main theme of the event was the concept of d igital reach , the ability to manage digital services wherever needed. A theme made even more topical by the health emergency due to Covid – 19. As easily understood, the classic data center is not enough to guarantee the digital reach and it is necessary to review the corporate infrastructure, leveraging the edge systems .

During the IDC forum, Vertiv moderated a Virtual Focus Group in which the company’s speakers, together with those of IDC, met with representatives of the main operators of the sector, addressing the data center topic in a less technical and more holistic way, thinking about management strategies and practices . The focus was on the transformation of the corporate data center, which is becoming more and more fluid, with resources scattered across the data center, cloud and edge .

During the discussion a series of criticalities experienced by companies emerged, in particular the difficulty of adapting the classic logic of the IT world to a new reality. For a successful transformation, according to Vertiv it is in fact necessary to change not only the technological equipment, but also the logic and – consequently – the KPIs and the processes for measuring effectiveness and productivity. In short, a change in leadership management is needed, a process that is not simple, as confirmed by the participants, who expressed the need to be supported in bringing their vision closer to those of business managers, so as to set up new well-founded metrics on business results.

The Focus Group highlighted an important aspect: companies that have made progress in interpreting their role in a changing society in a more modern way and the foundations have been laid for an evolution of the data center culture.

Further information on what emerged from the focus group discussion and on the future of data centers is available in the white paper Future of Infrastructure : Challenges and Opportunities in Developing a Data Center Culture , free to download.

Vertiv’s offering for data centers

Vertiv is a leading provider of data center solutions and services. Known above all for its UPS – uninterruptible power supplies that guarantee power to servers even in the event of momentary blackouts – the company also manufactures racks and cooling solutions, as well as complete modular and transportable data centers, designed for edge computing scenarios: a factory, for example, but also logistics and cultivation centers built with the criteria of agriculture 4.0 and applications in the Oil & Gas sector. The solutions SmartMod are prefabricated buildings made as pre-assembled modules, so as to facilitate their transport and installation. In addition to edge computing applications, SmartMods can also be used to scale the computing power of an existing data center in man

TCL 10 Plus does not have the latest hardware, and this is its heel d ‘Achilles. However, it defends itself with a spectacular display in its price range, and an aesthetic that emulates (very well) that of the top of the range. Here is our in-depth test

by Nino Grasso published 17 October 2020 , at 12: 31 in the Telephony channel

TCL

After trying TCL 10 Pro we gave TCL a chance 10 Plus , device for many very similar verses but with some small differences. Compared to the latter we find a plastic body, however well done, and indistinguishable larger dimensions with a slightly lower thickness and weight. However, the beautiful aesthetics remain, despite the less “noble” materials, the excellent display, and the technical specifications are not so different. All at a more interesting price: the list are 399 euro, but today’s street price makes it cheaper

Article index

Technical features
Equipment, prices and availability
Software and user experience
Technical analysis

Benchmark
Display
Autonomy

Camera
- Examples of shots or
Final considerations

Technical specifications and differences with the Pro

TCL 10 Plus arrives a few weeks later than the Pro, but in many ways it can replace it at a more attractive price. The flagship of the Pro model is taken up, at least on paper, also on TCL 10 Plus: we refer to the display, a AMOLED 6, 47 “Full HD resolution + compatible with HDR which we liked a lot on the Pro.

Compared to Snapdragon 675 of the Pro we have a processor Qualcomm Snapdragon 665 , with four Kryo cores 177 Gold and four Silver (SD 675 has instead two Kryo cores 460 Gold and six Silver). The maximum operating frequency is the same, 2.0GHz, and the production process of the two processors is the same (11 – nm). As for the memory sector, there are different versions announced: on Amazon it is possible to buy the variant from 6 + 256 GB at a price below 300 EUR, but the device is also produced with 64 or 128 GB of storage.

Another difference compared to the Pro is present in the photographic sector: there are always four rear modules, but here we find a main from 48 MP f / 1.8, an 8MP f / 2.2 ultra wide angle and two modules for macro and to enhance the light captured in 2MP low light shots. On the Pro instead we find a main sensor from 64 MP, an ultra wide angle camera from 16 MP and macro and depth sensor are respectively 5MP and 2MP. The front camera is also different: 16 MP for Plus , 24 MP on the Pro, paired with a brighter lens.

The battery boasts the same features on both terminals, 4. 500 mAh with Quick Charge 3.0 support up to 18 W with the supplied adapter, and both devices support Bluetooth 5.0, NFC, Wi-Fi ac and integrate the 3.5mm audio jack along the body. There is also the fingerprint sensor, under the glass of the device, with the Plus model which is slightly thinner and lighter: 8.9mm against the 9.2mm of the Pro, and 172 grams versus i 177 grams of the model immediately higher in the range.

Both smartphones, however, share the precision in the assembly, the flush camera on the back of the body, and a decidedly refined aesthetic. Up TCL 10 Plus the shell is polycarbonate, not glass like on the Pro, but the difference is barely seen and to the touch it is in our opinion imperceptible. The ergonomics are also excellent, also thanks to the not excessive weight, with TCL that has certainly done an excellent job also on this terminal.

Software ed user experience

On the software side we do not find many differences: since the first start we have the TCL UI, a stock version of Android on steroids, with the screen on the far left of the Home that welcomes Google Discover, just like the stock , while scrolling from bottom to top leads to the so-called app drawer which leads to the icons of all the apps installed. Here they can be divided by name, label, use, installation or even by icon color or category.

In the Settings you can find typically TCL additions: in the Display screen, for example, we have access to Dark Mode and Healthy Eyes Mode (the translation of the menus is not the strength of the smartphone); but it is in the NXTVISION screen that there are more succulent news than the stock. Here we find the following settings:

Visual enhancement : Automatically adjusts the contrast, sharpness and saturation to make the image clearer, with richer depth of detail and an improved brightness level for dark scenes when viewing photos or playing videos and used video games. Only works in Vivid Screen color mode
- SDR to HDR : It only activates with Visual Enhancement enabled. Enhance the color, contrast and detail depth of video streaming from any source to provide HDR quality display.
Reading mode : Optimizes the screen display to make the reading experience comfortable, as if you were reading from an e-book reader.

The three features allow you to get the most out of the display even when the source video is not qualitatively impeccable or is compressed in SDR. The results are obviously more impactful, but they depart from the director’s original idea: purists will likely keep everything disabled. And, just for purists, on the software side it is possible to set three “True Color” modes for the display.

Standard and Delicate are in no way customizable by the user: the first is based on DCI-P3 gamut, fully supported by the device; the second instead on the less extensive sRGB standard in terms of color saturation. We then have Vivid , which can be set with Adaptive or manual hue: the first configures the white balance dynamically based on ambient light, the second allows you to shift the white temperature with a horizontal slider.

Among the software functions the most evident is the Edge Bar , accessible with a swipe from top to bottom on the right or left side (the position is at the user’s discretion) of the device. Allows access to a list of applications or functions chosen by the user. TCL’s additions also include the Smart Manager , which allows you to manage and optimize various aspects of the device, and various apps for the use of multimedia content. The Pro’s customizable Smart Key here is replaced with a key to activate Google Assistant. Useful, but definitely anonymous since it cannot be configured by the user in any way.

Technical analysis

TCL 10 Plus implements a mid-range SoC, not the latest, but offering performance not so different from those proposed by the Pro. The smartphone performs well especially when it is not under stress: the navigation in the apps and in the UI of the operating system is fluid, and the general reactivity is excellent in most cases. When power is required, however, the differences with the top of the range are felt a little, especially with the heavier Play Store games.

Benchmark

Below are the benchmarks we performed with the terminal.

Display

Display Analysis

The smartphone is faithful to TCL’s Display Greatness motto as regards the screen, which is identical to that of the Pro model, as our measurements attest . We recorded the values of maximum luminance in manual mode, even with HDR content, and over d / m² in automatic mode in both SDR and HDR. All with the very high contrast ratio typical of AMOLED panels, here in the version with double curve on the sides. Three modes that can be set via software:

Vivid – the default mode. Allows for a white balance calibration and enabling of NXTVISION effects, such as Visual Enhancement and SDR to HDR. It takes the DCI-P3 gamut as a chromatic reference. Allows the enabling of Adaptive Hue, which automatically adjusts the color temperature according to the ambient light.
Delicate – the mode that takes the sRGB gamut as a reference, less extended than P3.
Standard – takes the DCI-P3 standard as a reference, but with a more precise color calibration than Vivido. It is not in any way customizable by the user.

Vivid Mode (DCI-P3)

Gamut

White Balance

Gamma curve

Color Fidelity (DCI-P3)

Standard Mode (DCI-P3)

Gamut

White Balance

Gamma curve

Color Fidelity (DCI-P3)

Delicate Mode (sRGB)

Gamut

Balance de l white

Gamma curve

Color Fidelity (sRGB)

HDR Playback

Gamut

White Balance

Gamma Curve

Color fidelity (DCI-P3 SMPTE 2084 HDR)

Most likely the integrated display on TCL 10 Plus is the same as that of the Pro, since the colorimeter analysis reports very similar values between the two models, with the exception of the maximum luminance measured which on the Pro is slightly higher. TCL 10 Plus still offers 776 nit (approx. 490 in mode manual) and an unmeasurable contrast ratio due to the extremely deep blacks typical of OLEDs. Excellent viewing angles, while we have verified a slight shyness in red tones on all modes, a factor that makes the image slightly colder than the reference. All modes also feature a slightly more boosted gamma curve than sRGB and DCI-P3 references, resulting in a slightly more contrasted image than the original source. The chromatic extension of the Vivid and Standard modes (according to the DCI-P3 standard) is very good, with the latter boasting a slightly better color fidelity thanks to a more faithful calibration. The Vivid mode, active by default, serves more than anything else to amaze, but it is also particularly precise. The Delicate mode instead refers to the sRGB standard, which is followed without particular smudges with an excellent extension in terms of saturation and good color fidelity. The TCL panel 10 Plus result less precise with HDR content , but in any case the reproduction is extremely enjoyable. In short, that of TCL 10 Pro it is an excellent display, also in consideration of the various image enhancement modes that allow you to take advantage of high definition even with traditional content. Below are the average DeltaE values with the various methods:

Vivid DeltaE (DCI-P3) = 3.3

Standard DeltaE (DCI-P3) = 3.0

Delicate DeltaE (sRGB) = 3.7

HDR (DCI- P3 SMPTE 2084 HDR) = 5.3

Autonomy

They are few the differences between the two smartphones, but one of these is in autonomy by virtue of the different processors. TCL’s 10 Pro, the Snapdragon 675, it is slightly more powerful but – according to our test – consumes more resources than the Snapdragon 665 by TCL 10 Plus. Nothing transcendental, however, with the difference between the two being less than 10% in terms of autonomy. Considering that the differences in performance are difficult to distinguish in everyday use, this aspect makes the Plus preferable over the Pro, at least in purely numerical terms.

Just like the Pro model, also TCL 10 Plus supports fast charging from 18 W. It clearly pales in speed when compared to technologies from 30, 45 or even 65 W that we have seen on other smartphones, but it does its duty in charging the smartphone without – in theory – damaging the battery too prematurely and in times certainly not biblical.

Camera

In addition to autonomy, one of the expected differences on the Plus model compared to the Pro is from the camera. Here we find a main module from 48 MP with an ultra wide angle on less refined paper due to the less defined sensor. The remaining modules, macro and low brightness, are an excellent marketing strategy to increase the number of cameras without offering real added value to the user. Video side we have the possibility to record videos also in 4K Ultra HD, even if only at 30 fps (more expensive devices allow you to do it also at 31 fps).

TCL 10 Plus, camera features

Standard

Sensor from 48 MP

Lens f / 1.8

PDAF Autofocus

Focal length 26 mm equivalent

Ultra -wide

8MP sensor

Lens f / 2.2

Focal length 13 mm equivalent

Macro

2MP sensor

Lens f / 2.4

Low light:

2MP f / 2.4

Video 4K Ultra HD @ 24 fps

TCL Snapshot Examples 10 Plus

Click on the thumbnails to see the original photos

Wide

Ultrawide

Wide

Wide in the dark

Wide in the dark with flash

TCL 10 Plus offers a good camera, with the difficult sensor to 48 MP which is well managed in all circumstances without clearly working miracles. Noise and shake are avoided in shooting in the dark, despite the absence of optical stabilization, while there is a certain predisposition to overexpose when using the flash at close distances, with several details burned. The camera is quite usable in good light conditions and in intermediate conditions (for example indoor spaces), even if the images appear a little washed out, not very incisive in colors. The level of detail is excellent in the simplest conditions, with good post-processing carried out in this area by the natively integrated software. Undertone the ultra-wide, which is much lower than the one integrated on TCL 10 Pro , as well as the main one of the Pro allows you to get more pleasing shots both in terms of colors and in terms of captured detail, in good light conditions. In the dark, however, it seemed more balanced TCL 00008 Plus, which underexposes compared to the Pro, but more effectively avoids shake and noise.

Final considerations

There are not many who talk about TCL smartphones, or who trust the new brand, however we believe that after a somewhat limping start in Italy with the Plex, and after TCL’s high prices 10 Pro, your proposal is starting to get very interesting.

Especially do po have taken a tour of the various online stores: TCL 10 Plus can be purchased at 270 ?? as of this writing, TCL 00008 Pro a 290 ?? resulting even more interesting than the first. It is clear that if you add it to the Xiaomi plate, with Mi 10 Lite 5G for example, the two TCL smartphones seem a bit overpriced, but in our opinion the two devices of the series “10 “have something from say to their advantage.

They don’t support 5G like Mi 10 Lite, but have a less invasive graphic customization and a superior display with good autonomy, net of lower performance evident only with three-dimensional video games. In short, at today’s price the new TCL series “10 “are both in our opinion very interesting competitors, even if to defeat the competition, greater attention would be needed not so much to today’s needs by users, but also and above all to the needs of tomorrow.

OS (at launch)	Android 10 with TCL UI	Android 10 with TCL UI
Processor	Qualcomm Snapdragon 665 to 11 – nm 4 x Kryo 260 @ 2.0 GHz 4 x Kryo 260 @ 1.8 GHz	Qualcomm Snapdragon 675 to 11 – nm 2 x Kryo 460 @ 2, 0 GHz 6 x Kryo 399 @ 1.7 GHz
Memories	6 GB of RAM 256 GB Expandable via microSD	6 GB of RAM 128 GB Expandable via microSD
Display	6, 47 “OLED (19. 5 : 9) 2340 x 1080 px (398 PPI) HDR – DCI-P3	6, 47 “OLED (19. 5: 9) 2020 x 1080 px ( 398 PPI) HDR 10 – DCI-P3
Cameras	Back: Normal (26 mm): 48 MP f / 1.8 PDAF Ultra-wide (13 mm ): 8MP f / 2.2 Macro: 2 MP f / 2.4 Low light: 2 MP f / 2.4 Ultra HD Video @ 30 fps Front: Normal: 16 MP f / 2.2	Back : Normal (26 mm): 64 MP f / 1.8 PDAF Ultra-wide (13 mm): 16 MP f / 2.4 Macro: 5 MP f / 2.2 Low light: 2 MP f / 2.4 Ultra HD Video @ 30 fps Front: Normal: 24 MP f / 2.0
Extra	4G LTE-A Cat. 00009 (400 / 75 Mbps) Wi-Fi ac 2.4-5GHz Bluetooth 5.0 NFC Dual SIM Under glass fingerprint sensor	4G LTE-A Cat. 13 (400 / 75 Mbps) Wi-Fi ac 2.4-5GHz Bluetooth 5.0 NFC Dual SIM Under glass fingerprint sensor
Doors	USB Type-C 3.5 mm audio jack	USB Type-C 3.5 mm audio jack
Battery	4. 460 mAh Quick charge 18 W	4. 460 mAh Quick charge 18 W
Dimensions	128 x 73 x 8.9 mm	158 x 72 x 9.2 mm
Weight	172 grams	177 grams