XFX Radeon RX 6700 XT Speedster Merc 319 is the company’s premium custom-design Radeon RX 6700 XT card debuting today. With this, AMD intends to dominate the performance segment, taking the fight to popular NVIDIA Ampere SKUs such as the GeForce RTX 3060 Ti and even RTX 3070. The card is targeted at serious gamers seeking maxed out 1440p gaming, and also supports real-time raytracing, as it supports the full DirectX 12 Ultimate feature-set. It’s based on the same RDNA2 graphics architecture as the RX 6900 XT “Big Navi.”
The latest RDNA2 graphics architecture debuted with next-generation consoles, making its way to the PC with the Radeon RX 6000 series. This gives AMD a unique advantage as game developers optimizing for console also end up doing so for Radeon. AMD’s raytracing architecture involves specialized hardware called Ray Accelerators, which compute ray intersection; while much else of it is handled by the enormous compute muscle of these cards. This also means increased performance in non-raytraced games, as these programmable shaders can be made to do anything.
The Radeon RX 6700 XT is based on the new 7 nm Navi 22 silicon, and maxes it out. The chip is equipped with 40 RDNA2 compute units, which means 2,560 stream processors, 40 Ray Accelerators, 160 TMUs, and 64 ROPs. The company has also generationally increased the memory amount to 12 GB, which is certainly welcome, however, the memory bus is narrower at 192-bit. The company worked to overcome this bandwidth deficit by using the fastest 16 Gbps JEDEC-standard GDDR6 memory chips, and deploying its Infinity Cache technology, a fast on-die 96 MB cache located in the GPU, which operates at much higher bandwidths and lower latencies, cushioning data-transfers between the GPU and memory.
The XFX RX 6700 XT Speedster Merc 319 features a large triple-slot, cooling solution with a heatsink that outgrows the PCB not just lengthwise, but also in height, which means a significant amount of airflow from the three fans flows right through, resulting in much better ventilation. The design has certainly come a long way from the THICC series. XFX is giving the card its highest factory OC, running it at 2.65 GHz max boost, up from 2.58 GHz reference. The company is pricing the card at $570 USD, a $90 premium over AMD’s reference price. Both these prices are fantasy in today’s market situation, and one can expect to pick this up closer to $750. In this review, we take the card for a spin across our brand new test bench.
Our Radeon RX 6700 XT launch-day coverage includes six articles including this one. Do check them out! AMD Radeon RX 6700 XT (reference) | MSI Radeon RX 6700 XT Gaming X | ASUS ROG Strix Radeon RX 6700 XT OC | Sapphire Radeon RX 6700 XT NITRO+ | PowerColor Radeon RX 6700 XT Red Devil
PowerColor announced its top custom design AMD Radeon RX 6700 XT graphics card, the RX 6700 XT Red Devil. After surprising everyone with competitive graphics cards in the enthusiast segment with the RX 6800 series and the flagship RX 6900 XT, AMD is turning its attention to the segment that earns NVIDIA the most attention from serious gamers—the sub-$500 performance segment, where it’s looking to take on established rivals, the GeForce RTX 3060 Ti and the RTX 3070. Unlike the last time, AMD has largely leveled up to NVIDIA on the features front, with the RX 6700 XT being full DirectX 12 Ultimate capable, including real-time raytracing. The target user of this card is someone who games at 1440p with settings maxed out.
At the heart of the RX 6700 XT is the new 7 nm Navi 22 silicon by AMD, has half the compute muscle of the Navi 21 powering the RX 6900 XT. The chip has 40 RDNA2 compute units, which mean 2,560 stream processors, 40 Ray Accelerators, 160 TMUs, and 64 ROPs. AMD also increased the memory size to 12 GB compared to the previous generation, but the memory bus width is narrowed to 192-bit. The company attempted to make up for this by increasing the memory clocks and using the new Infinity Cache on-die cache memory that the company claims to significantly improve effective bandwidth. The new RDNA2 graphics architecture uses fixed function hardware to accelerate raytracing intersections, but the tech also heavily relies on the compute shader. A side-effect of this is a massive raster 3D performance gain over the previous generation. We detail the silicon in the next page.
The PowerColor RX 6700 XT Red Devil uses a lavish triple-slot cooling solution that looks a segment above when installed in your case. Thick aluminium fin-stack heatsinks peek through the cooler shroud, giving it an industrial look. All this cooling muscle comes together to support factory overclocked speeds of up to 2.65 GHz max boost engine clocks, a roughly 100 MHz increase over the reference design. You get plenty of goodies, including RGB LED lighting, dual-BIOS, including a noise-optimized Silent BIOS, and a 3-pin addressable-RGB header, letting you sync your lighting to the card. We expect PowerColor to price the card at a roughly $100 premium over the $479 reference MSRP, like most other custom RX 6700 XT cards we’re reviewing today.
Our Radeon RX 6700 XT launch-day coverage includes six articles including this one. Do check them out! AMD Radeon RX 6700 XT (reference) | MSI Radeon RX 6700 XT Gaming X | ASUS ROG Strix Radeon RX 6700 XT OC | Sapphire Radeon RX 6700 XT NITRO+ | XFX Radeon RX 6700 XT Speedster Merc 319
A rover on the Moon has metal wheels that can flex around rocky obstacles, then reshape back to their original form. On Earth, surgeons install tiny mesh tubes that can dilate a heart patient’s blood vessels all on their own, without mechanical inputs or any wires to help.
These shape-shifting capabilities are all thanks to a bizarre kind of metal called nitinol, a so-called shape-metal alloy that can be trained to remember its own shape. The decades-old material has become increasingly common in a wide range of everyday applications. And in the next decade, the metal will face its most challenging application yet: a sample return mission on Mars.
Nitinol, made of nickel and titanium, works its magic through heat. To “train” a paper clip made of nitinol, for example, you heat it at 500 degrees Celsius in its desired shape, then splash it in cold water. Bend it out of shape, then return the same heat source, and the metal will eerily slink back into its original form.
The temperature that triggers nitinol’s transformation varies depending on the fine-tuned ratio of nickel to titanium. Engineers can tweak the metal to adapt to a wide array of conditions, making it a key tool in places where complex mechanics won’t fit, like the blood vessels surrounding a human heart or a hinge that positions a solar panel by responding to the sun’s heat.
The Verge spoke with engineers at NASA’s Glenn Research Center to see how nitinol will play a role in a mission to retrieve humanity’s first cache of pristine Martian soil samples — the second leg of a Mars mission campaign led by NASA and the European Space Agency. Check out the video above to see how and to see nitinol in action. (We promise, it’s not CGI.)
Shenzhen Longsys Electronics Co. Ltd, a Chinese NAND flash memory manufacturer, has demonstrated the power of its DDR5-6400 memory with one of Intel’s Alder Lake-S processors. The company’s results show that DDR5 will be an absolute delight for next-generation hardware.
Longsys currently has two DDR5-6400 memory modules in development. The 16GB variant follows a single-rank design, while the 32GB variant conforms to a dual-rank design. Both memory modules feature an eight-layer PCB, CAS Latency (CL) of 40, and a 1.1V DRAM voltage. Longsys’ offerings aren’t even the pinnacle of what DDR5 has to offer, though. DDR5 will eventually arrive with data rates up to DDR5-8400 and capacities that scale up to 128GB per module.
Longsys demonstrated the company’s DDR5-6400 (ES1) memory module in its 32GB version with a CL40. For comparison, JEDEC’s “A” specification for DDR4-6400 is rated for CL46.
There aren’t many processors that support DDR5 memory, and we haven’t heard anything conclusive from the AMD camp. Alder Lake is the closest processor on the horizon that will support DDR5. In fact, Longsys’ test platform is based on an Alder Lake-S chip with eight cores that operate with an 800 MHz base clock speed.
DDR5-6400 Benchmarks
It’s uncertain if Longsys compared its DDR5-6400 or DDR5-4800 memory module to one of the brand’s DDR4 memory modules. The company refers to DDR5-6400 in its results, but the BIOS screenshots show DDR5-4800. The data rate of the DDR4 memory is unknown as well. But judging by the CL22 value, the DDR4 memory module most likely conforms to the DDR4-3200 standard. In any event, we’ve reached out to Longsys for clarification.
Longsys DDR4 32GB C22
Longsys DDR5 32GB C40
Difference
AIDA64 Read
25,770
35,844
39%
AIDA64 Write
23,944
32,613
36%
AIDA64 Copy
25,849
28,833
12%
AIDA64 Latency
56.8
112.1
97%
Master Lu Benchmark
91,575
193,684
112%
According to Longsys’ provided RAM benchmarks, the DDR5 memory module outperformed the DDR4 memory module in AIDA64’s read, write and copy tests. The performance gains came down to 39%, 36%, and 12%, respectively. However, the DDR5 memory module did show a 97% higher latency than the DDR4 offering, though.
Longsys also shared the memory result for the Master Lu benchmark, which is a pretty popular benchmark in China. The DDR4 memory module scored 91,575 points, while the DDR5 memory module put up a score of 193,684 points. Synthetic benchmarks don’t tell the whole story, but the DDR5 memory module delivered up to 112% better performance in Master Lu.
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Intel’s 12th Generation Alder Lake-S processors may debut in late 2021 or early 2022, therefore, it shouldn’t be long before consumers get a first taste of the type of performance that DDR5 can supply.
Early reports are piling up that cryptominers have deciphered Nvidia’s anti-mining algorithm on the GeForce RTX 3060. Theoretically, it’s one of the best graphics cards, if you could find one for anything close to the official $329 MSRP. The Ampere graphics card was also supposed to be less attractive to miners, but it appears that the chipmaker shot itself in the foot and inadvertently posted a driver that unlocks mining performance on the RTX 3060. Meaning, anyone can unlock full mining performance with a minimum of effort.
Nvidia was pretty confident that its anti-mining algorithm is unhackable, which naturally put out an invitation for cryptominers to try to crack it. The chipmaker even affirmed that “End users cannot remove the hash limiter from the driver. There is a secure handshake between the driver, the RTX 3060 silicon, and the BIOS (firmware) that prevents removal of the hash rate limiter.” While the verification sounds like an intricate process, someone inadvertently released a workaround for it.
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The simple hack reportedly requires a clean driver install with Nvidia’s latest GeForce 370.05 Beta driver — some report the need to flash the GeForce RTX 3060 graphics card with a hacked vBIOS, though in our testing that’s not required. Nvidia apparently messed up something in this particular driver that renders its anti-mining algorithm completely useless.
Above, you can see Ethereum mining performance using the 461.81 drivers, topping out at around 28MH/s after tuning. (We set the power limit to 75% and boosted the memory clock by 1250MHz using MSI Afterburner.) With the 470.05 drivers, using the same power and clock settings, we’re now getting a consistent 48MH/s. It’s also interesting that power use didn’t change between the drivers, coming in at around 118W in both cases.
Now that the cat is out of the bag, Nvidia will likely remove the driver and pretend that it never existed. Sadly, the news is everywhere, meaning that cryptominers will be back on the hunt for GeForce RTX 3060 graphics cards. Not that they weren’t already, considering what we’re seeing in our GPU pricing index.
AMD unveiled its EPYC 7003 ‘Milan’ processors today, claiming that the chips, which bring the company’s powerful Zen 3 architecture to the server market for the first time, take the lead as the world’s fastest server processor with its flagship 64-core 128-thread EPYC 7763. Like the rest of the Milan lineup, this chip comes fabbed on the 7nm process and is drop-in compatible with existing servers. AMD claims it brings up to twice the performance of Intel’s competing Xeon Cascade Lake Refresh chips in HPC, Cloud, and enterprise workloads, all while offering a vastly better price-to-performance ratio.
Milan’s agility lies in the Zen 3 architecture and its chiplet-based design. This microarchitecture brings many of the same benefits that we’ve seen with AMD’s Ryzen 5000 series chips that dominate the desktop PC market, like a 19% increase in IPC and a larger unified L3 cache. Those attributes, among others, help improve AMD’s standing against Intel’s venerable Xeon lineup in key areas, like single-threaded work, and offer a more refined performance profile across a broader spate of applications.
The other attractive features of the EPYC lineup are still present, too, like enhanced security, leading memory bandwidth, and the PCIe 4.0 interface. AMD also continues its general approach of offering all features with all of its chips, as opposed to Intel’s strict de-featuring that it uses to segment its product stack. As before, AMD also offers single-socket P-series models, while its standard lineup is designed for dual-socket (2P) servers.
The Milan launch promises to reignite the heated data center competition once again. Today marks the EPYC Milan processors’ official launch, but AMD actually began shipping the chips to cloud service providers and hyperscale customers last year. Overall, the EPYC Milan processors look to be exceedingly competitive against Intel’s competing Xeon Cascade Lake Refresh chips.
Like AMD, Intel has also been shipping to its largest customers; the company recently told us that it has already shipped 115,000 Ice Lake chips since the end of last year. Intel also divulged a few details about its Ice Lake Xeons at Hot Chips last year; we know the company has a 32-core model in the works, and it’s rumored that the series tops out at 40 cores. As such, Ice Lake will obviously change the competitive landscape when it comes to the market.
AMD has chewed away desktop PC and notebook market share at an amazingly fast pace, but the data center market is a much tougher market to crack. While this segment represents the golden land of high-volume and high-margin sales, the company’s slow and steady gains lag its radical advance in the desktop PC and notebook markets.
Much of that boils down to the staunchly risk-averse customers in the enterprise and data center; these customers prize a mix of factors beyond the standard measuring stick of performance and price-to-performance ratios, instead focusing on areas like compatibility, security, supply predictability, reliability, serviceability, engineering support, and deeply-integrated OEM-validated platforms. To cater to the broader set of enterprise customers, AMD’s Milan launch also carries a heavy focus on broadening AMD’s hardware and software ecosystems, including full-fledged enterprise-class solutions that capitalize on the performance and TCO benefits of the Milan processors.
AMD’s existing EPYC Rome processors already hold the lead in performance-per-socket and pricing, easily outstripping Intel’s Xeon at several key price points. Given AMD’s optimizations, Milan will obviously extend that lead, at least until the Ice Lake debut. Let’s see how the hardware stacks up.
AMD EPYC 7003 Series Milan Specifications and Pricing
Cores / Threads
Base / Boost (GHz)
L3 Cache (MB)
TDP (W)
1K Unit Price
EPYC Milan 7763
64 / 128
2.45 / 3.5
256
280
$7,890
EPYC Milan 7713
64 / 128
2.0 / 3.675
256
225
$7,060
EPYC Rome 7H12
64 / 128
2.6 / 3.3
256
280
?
EPYC Rome 7742
64 / 128
2.25 / 3.4
256
225
$6,950
EPYC Milan 7663
56 / 112
2.0 / 3.5
256
240
$6,366
EPYC Milan 7643
48 / 96
2.3 / 3.6
256
225
$4.995
EPYC Milan 7F53
32 / 64
2.95 / 4.0
256
280
$4,860
EPYC Milan 7453
28 / 56
2.75 / 3.45
64
225
$1,570
Xeon Gold 6258R
28 / 56
2.7 / 4.0
38.5
205
$3,651
EPYC Milan 74F3
24 / 48
3.2 / 4.0
256
240
$2,900
EPYC Rome 7F72
24 / 48
3.2 / ~3.7
192
240
$2,450
Xeon Gold 6248R
24 / 48
3.0 / 4.0
35.75
205
$2,700
EPYC Milan 7443
24 / 48
2.85 / 4.0
128
200
$2,010
EPYC Rome 7402
24 / 48
2.8 / 3.35
128
180
$1,783
EPYC Milan 73F3
16 / 32
3.5 / 4.0
256
240
$3,521
EPYC Rome 7F52
16 / 32
3.5 / ~3.9
256
240
$3,100
Xeon Gold 6246R
16 / 32
3.4 / 4.1
35.75
205
$3,286
EPYC Milan 7343
16 / 32
3.2 / 3.9
128
190
$1,565
EPYC Rome 7302
16 / 32
3.0 / 3.3
128
155
$978
EPYC Milan 72F3
8 / 16
3.7 / 4.1
256
180
$2,468
EPYC Rome 7F32
8 / 16
3.7 / ~3.9
128
180
$2,100
Xeon Gold 6250
8 / 16
3.9 / 4.5
35.75
185
$3,400
AMD released a total of 19 EPYC Milan SKUs today, but we’ve winnowed that down to key price bands in the table above. We have the full list of the new Milan SKUs later in the article.
As with the EPYC Rome generation, Milan spans from eight to 64 cores, while Intel’s Cascade Lake Refresh tops out at 28 cores. All Milan models come with threading, support up to eight memory channels of DDR4-3200, 4TB of memory capacity, and 128 lanes of PCIe 4.0 connectivity. AMD supports both standard single- and dual-socket platforms, with the P-series chips slotting in for single-socket servers (we have those models in the expanded list below). The chips are drop-in compatible with the existing Rome socket.
AMD added frequency-optimized 16-, 24-, and 32-core F-series models to the Rome lineup last year, helping the company boost its performance in frequency-bound workloads, like databases, that Intel has typically dominated. Those models return with a heavy focus on higher clock speeds, cache capacities, and TDPs compared to the standard models. AMD also added a highly-clocked 64-core 7H12 model for HPC workloads to the Rome lineup, but simply worked that higher-end class of chip into its standard Milan stack.
As such, the 64-core 128-thread EPYC 7763 comes with a 2.45 / 3.5 GHz base/boost frequency paired with a 280W TDP. This flagship part also comes armed with 256MB of L3 cache and supports a configurable TDP that can be adjusted to accommodate any TDP from 225W to 280W.
The 7763 marks the peak TDP rating for the Milan series, but the company has a 225W 64-core 7713 model that supports a TDP range of 225W to 240W for more mainstream applications.
All Milan models come with a default TDP rating (listed above), but they can operate between a lower minimum (cTDP Min) and a higher maximum (cTDP Max) threshold, allowing quite a bit of configurability within the product stack. We have the full cTDP ranges for each model listed in the expanded spec list below.
Milan’s adjustable TDPs now allow customers to tailor for different thermal ranges, and Forrest Norrod, AMD’s SVP and GM of the data center and embedded solutions group, says that the shift in strategy comes from the lessons learned from the first F- and H-series processors. These 280W processors were designed for systems with robust liquid cooling, which tends to add quite a bit of cost to the platform, but OEMs were surprisingly adept at engineering air-cooled servers that could fully handle the heat output of those faster models. As such, AMD decided to add a 280W 64-core model to the standard lineup and expanded the ability to manipulate TDP ranges across its entire stack.
AMD also added new 28- and 56-core options with the EPYC 7453 and 7663, respectively. Norrod explained that AMD had noticed that many of its customers had optimized their applications for Intel’s top-of-the-stack servers that come with multiples of 28 cores. Hence, AMD added new models that would mesh well with those optimizations to make it easier for customers to port over applications optimized for Xeon platforms. Naturally, AMD’s 28-core’s $1,570 price tag looks plenty attractive next to Intel’s $3,651 asking price for its own 28-core part.
AMD made a few other adjustments to the product stack based on customer buying trends, like reducing three eight-core models to one F-series variant, and removing a 12-core option entirely. AMD also added support for six-way memory interleaving on all models to lower costs for workloads that aren’t sensitive to memory throughput.
Overall, Milan has similar TDP ranges, memory, and PCIe support at any given core count than its predecessors but comes with higher clock speeds, performance, and pricing.
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Milan also comes with the performance uplift granted by the Zen 3 microarchitecture. Higher IPC and frequencies, not to mention more refined boost algorithms that extract the utmost performance within the thermal confines of the socket, help improve Milan’s performance in the lightly-threaded workloads where Xeon has long held an advantage. The higher per-core performance also translates to faster performance in threaded workloads, too.
Meanwhile, the larger unified L3 cache results in a simplified topology that ensures broader compatibility with standard applications, thus removing the lion’s share of the rare eccentricities that we’ve seen with prior-gen EPYC models.
The Zen 3 microarchitecture brings the same fundamental advantages that we’ve seen with the desktop PC and notebook models (you can read much more about the architecture here), like reduced memory latency, doubled INT8 and floating point performance, and higher integer throughput.
AMD also added support for memory protection keys, AVX2 support for VAES/VPCLMULQD instructions, bolstered security for hypervisors and VM memory/registers, added protection against return oriented programming attacks, and made a just-in-time update to the Zen 3 microarchitecture to provide in-silicon mitigation for the Spectre vulnerability (among other enhancements listed in the slides above). As before, Milan remains unimpacted by other major security vulnerabilities, like Meltdown, Foreshadow, and Spoiler.
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The EPYC Milan SoC adheres to the same (up to) nine-chiplet design as the Rome models and is drop-in compatible with existing second-gen EPYC servers. Just like the consumer-oriented chips, Core Complex Dies (CCDs) based on the Zen 3 architecture feature eight cores tied to a single contiguous 32MB slice of L3 cache, which stands in contrast to Zen 2’s two four-core CCXes, each with two 16MB clusters. The new arrangement allows all eight cores to communicate to have direct access to 32MB of L3 cache, reducing latency.
This design also increases the amount of cache available to a single core, thus boosting performance in multi-threaded applications and enabling lower-core count Milan models to have access to significantly more L3 cache than Rome models. The improved core-to-cache ratio boosts performance in HPC and relational database workloads, among others.
Second-gen EPYC models supported either 8- or 4-channel memory configurations, but Milan adds support for 6-channel interleaving, allowing customers that aren’t memory bound to use less system RAM to reduce costs. The 6-channel configuration supports the same DDR4-3200 specification for single DIMM per channel (1DPC) implementations. This feature is enabled across the full breadth of the Milan stack, but AMD sees it as most beneficial for models with lower core counts.
Milan also features the same 32-bit AMD Secure Processor in the I/O Die (IOD) that manages cryptographic functionality, like key generation and management for AMD’s hardware-based Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV) features. These are key advantages over Intel’s Cascade Lake processors, but Ice Lake will bring its own memory encryption features to bear. AMD’s Secure Processor also manages its hardware-validated boot feature.
AMD EPYC Milan Performance
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AMD provided its own performance projections based on its internal testing. However, as with all vendor-provided benchmarks, we should view these with the appropriate level of caution. We’ve included the testing footnotes at the end of the article.
AMD claims the Milan chips are the fastest server processors for HPC, cloud, and enterprise workloads. The first slide outlines AMD’s progression compared to Intel in SPECrate2017_int_base over the last few years, highlighting its continued trajectory of significant generational performance improvements. The second slide outlines how SPECrate2017_int_base scales across the Milan product stack, with Intel’s best published scores for two key Intel models, the 28-core 6258R and 16-core 4216, added for comparison.
Moving on to a broader spate of applications, AMD says existing two-socket 7H12 systems already hold an easy lead over Xeon in the SPEC2017 floating point tests, but the Milan 7763 widens the gap to a 106% advantage over the Xeon 6258R. AMD uses this comparison for the two top-of-the-stack chips, but be aware that this is a bit lopsided: The 6258R carries a tray price of $3,651 compared to the 7763’s $7,890 asking price. AMD also shared benchmarks comparing the two in SPEC2017 integer tests, claiming a similar 106% speedup. In SPECJBB 2015 tests, which AMD uses as a general litmus for enterprise workloads, AMD claims 117% more performance than the 6258R.
The company also shared a few test results showing performance in the middle of its product stack compared to Intel’s 6258R, claiming that its 32-core part also outperforms the 6258R, all of which translates to improved TCO for customers due to the advantages of lower pricing and higher compute density that translates to fewer servers, lower space requirements, and lower overall power consumption.
Finally, AMD has a broad range of ecosystem partners with fully-validated platforms available from top-tier OEMs like Dell, HP, and Lenovo, among many others. These platforms are fed by a broad constellation of solutions providers as well. AMD also has an expansive list of instances available from leading cloud service providers like AWS, Azure, Google Cloud, and Oracle, to name a few.
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Model #
Cores
Threads
Base Freq (GHz)
Max Boost Freq (up to GHz11)
Default TDP (w)
cTDP Min (w)
cTDP Max (w)
L3 Cache (MB)
DDR Channels
Max DDR Freq (1DPC)
PCIe 4
1Ku Pricing
7763
64
128
2.45
3.50
280
225
280
256
8
3200
x128
$7,890
7713
64
128
2.00
3.68
225
225
240
256
8
3200
X128
$7,060
7713P
64
128
2.00
3.68
225
225
240
256
8
3200
X128
$5,010
7663
56
112
2.00
3.50
240
225
240
256
8
3200
x128
$6,366
7643
48
96
2.30
3.60
225
225
240
256
8
3200
x128
$4,995
75F3
32
64
2.95
4.00
280
225
280
256
8
3200
x 128
$4,860
7543
32
64
2.80
3.70
225
225
240
256
8
3200
x128
$3,761
7543P
32
64
2.80
3.70
225
225
240
256
8
3200
X128
$2,730
7513
32
64
2.60
3.65
200
165
200
128
8
3200
x128
$2,840
7453
28
56
2.75
3.45
225
225
240
64
8
3200
x128
$1,570
74F3
24
48
3.20
4.00
240
225
240
256
8
3200
x128
$2,900
7443
24
48
2.85
4.00
200
165
200
128
8
3200
x128
$2,010
7443P
24
48
2.85
4.00
200
165
200
128
8
3200
X128
$1,337
7413
24
48
2.65
3.60
180
165
200
128
8
3200
X128
$1,825
73F3
16
32
3.50
4.00
240
225
240
256
8
3200
x128
$3,521
7343
16
32
3.20
3.90
190
165
200
128
8
3200
x128
$1,565
7313
16
32
3.00
3.70
155
155
180
128
8
3200
X128
$1,083
7313P
16
32
3.00
3.70
155
155
180
128
8
3200
X128
$913
72F3
8
16
3.70
4.10
180
165
200
256
8
3200
x128
$2,468
Thoughts
AMD’s general launch today gives us a good picture of the company’s data center chips moving forward, but we won’t know the full story until Intel releases the formal details of its 10nm Ice Lake processors.
The volume ramp for both AMD’s EPYC Milan and Intel’s Ice Lake has been well underway for some time, and both lineups have been shipping to hyperscalers and CSPs for several months. The HPC and supercomputing space also tend to receive early silicon, so they also serve as a solid general litmus for the future of the market. AMD’s EPYC Milan has already enjoyed brisk uptake in those segments, and given that Intel’s Ice Lake hasn’t been at the forefront of as many HPC wins, it’s easy to assume, by a purely subjective measure, that Milan could hold some advantages over Ice Lake.
Intel has already slashed its pricing on server chips to remain competitive with AMD’s EPYC onslaught. It’s easy to imagine that the company will lean on its incumbency and all the advantages that entails, like its robust Server Select platform offerings, wide software optimization capabilities, platform adjacencies like networking, FPGA, and Optane memory, along with aggressive pricing to hold the line.
AMD has obviously prioritized its supply of server processors during the pandemic-fueled supply chain disruptions and explosive demand that we’ve seen over the last several months. It’s natural to assume that the company has been busy building Milan inventory for the general launch. We spoke with AMD’s Forrest Norrod, and he tells us that the company is taking steps to ensure that it has an adequate supply for its customers with mission-critical applications.
One thing is clear, though. Both x86 server vendors benefit from a rapidly expanding market, but ARM-based servers have become more prevalent than we’ve seen in the recent past. For now, the bulk of the ARM uptake seems limited to cloud service providers, like AWS with its Graviton 2 chips. In contrast, uptake is slow in the general data center and enterprise due to the complexity of shifting applications to the ARM architecture. Continuing and broadening uptake of ARM-based platforms could begin to change that paradigm in the coming years, though, as x86 faces its most potent threat in recent history. Both x86 vendors will need a steady cadence of big performance improvements in the future to hold the ARM competition at bay.
Unfortunately, we’ll have to wait for Ice Lake to get a true view of the competitive x86 landscape over the next year. That means the jury is still out on just what the data center will look like as AMD works on its next-gen Genoa chips and Intel readies Sapphire Rapids.
Leading workstation vendors offer Linux-based machines with the latest hardware inside, but those PCs are expensive and are not exactly home-friendly due to their expansive design. Meanwhile, buying a boutique desktop PC with Linux is somewhat tricky. Fortunately for Linux users, there are companies like System76, which just launched its Thelio Mira midrange system that can be equipped with a 16-core Ryzen 9 5950X processor and a leading-edge Nvidia Quadro RTX graphics card.
System76 doesn’t label the Thelio Mira as a workstation; instead, the company brands it as a professional desktop system. Yet the PC can pack an AMD Ryzen 5000-series processor with up to 16 CPU cores, one or two Nvidia’s Quadro RTX graphics cards (up to the RTX 8000 model), up to 128GB of DDR4 RAM with ECC memory, up to 4TB of PCIe 4.0 NVMe storage (using two M.2 drives), and up to 36 TB of HDD storage. Obviously, all the connectivity features that you would expect from a 2021 desktop are all there, too: Wi-Fi 6, Bluetooth 5.0, 2.5 GbE, USB 3.2 Gen 2, USB Type-C, and audio connectors.
Measuring 436.35 × 253 × 331mm (17.18″ × 9.96″ × 13.03″), the System76 Thelio Mira is smaller than most high-end workstations by major vendors and is more compact than the company’s top-of-the-line Thelio Major box. While the system isn’t large, it can still support two graphics cards and loads of DRAM, which is something you usually don’t find in midrange machines.
One thing to note about the System76 Thelio Mir is that it does not look as utilitarian as machines from the big suppliers. With a choice of five different wooden finishes, it can actually fit almost any home design.
System76’s Thelio Mir stats at $1,499 and comes with Pop!OS 20.10 (64-bit), Pop!OS 20.04 LTS (64-bit), or Ubuntu 20.04 LTS (64-bit) operating systems. Meanwhile, nothing is stopping you from installing Windows 10 on these PCs.
Caviar introduces a luxury Galaxy S21 Ultra in the shape of a gold bar and decorated with 1 kilo of pure gold. As an investment object for the rich.
Caviar has just announced the Goldphone, a special Limited Edition smartphone that has been placed within the famous Gold Collection, which also includes the PlayStation 5 Limited Edition. The Goldphone is enriched with 1 kilogram of 24 karat gold and has the shape of a gold bar. The Samsung Galaxy S21 series is used as the basis for this creation. Customers can choose from the Samsung S21, the S21 Plus and the S21 Ultra. Are you more of an iPhone fan? Then you can also opt for the iPhone 12 Pro (Max).
The back of the smartphone has been thoroughly overhauled by Caviar. To transform the S21 into a gold bar, the camera system has been eliminated. It is a beautifully rounded smartphone decorated with 1 kilo of gold. The specifications are engraved on the back of the device: “Fine Gold 999.9, net weight 1000g.”.
Samsung Galaxy S21 Golden Limited Edition
Normally Caviar uses 18-karat gold (750 gold) for its luxury smartphone creations, which is more practical in everyday life and also more affordable. However, the Goldphone is an investment object that will retain its value over the years. That is why Caviar has opted for 24-karat gold, or pure gold (99.9% instead of 75%).
Only 7 copies of this unique Limited Edition smartphone are produced. A unique number is engraved at the bottom of the back of the Samsung Galaxy S21, so that the owner can see exactly which one belongs to him.
With a suggested retail price of $ 169,000 USD, this is the most expensive Samsung Galaxy S21 Ultra you can buy. Customers can choose from three memory variants: 128GB, 256G and 512GB.
Each Limited Edition smartphone comes in a chic packaging. For this Goldphone Caviar opted for a luxurious white case-safe with a combination lock, to underline the exclusivity of this model.
Ilse is a Dutch journalist and joined LetsGoDigital more than 15 years ago. She is highly educated and speaks four languages. Ilse is a true tech-girl and loves to write about the future of consumer electronics. She has a special interest for smartphones, digital cameras, gaming and VR.
Caviar transforms the iPhone 12 Pro (Max) into a 1 kilogram 24-karat gold bar. These unique Limited Edition smartphones will retain their value over time.
The Russian company Caviar is known for enriching and decorating high-end Apple and Samsung smartphones with rare materials, including precious metals. This time Caviar takes a slightly different approach. The iPhone 12 Pro (Max) was used as the basis for the new Goldphone. In Caviar’s jewelry workshop, the smartphone is decorated with a kilogram of 24-karat gold, making it an investment object for investors.
Normally, Caviar uses 18 karat gold for its luxurious creations, which is more practical in everyday life and also more affordable. This time, however, Caviar only uses 24 karat gold, making it a worthwhile investment for the long term.
iPhone 12 Pro Goldphone as an investment
Caviar’s iPhone 12 Pro Goldphone looks like a bar of gold, while retaining all the smart features the iPhone has to offer. Most functions, at least, because to create this golden design Caviar decided to eliminate the camera system.
The Caviar logo is processed on the back of the smartphone. Directly below, the letters “Fine Gold 999.9” are engraved, including the weight of 1000 grams. The Goldphone comes in a limited edition of only 7 pieces, on the back of the device the unique number is engraved.
This golden Limited Edition smartphone comes in a luxurious white case-safe with a combination lock. Caviar ships all over the world, every phone is delivered by a private courier. Delivery is included in the price, regardless of where you live.
This golden iPhone retains all functions that can also be found in the regular iPhone 12 Pro (Max) – except for the rear-camera. Customers can choose from the Pro or Pro Max model. Both devices are available in three memory variants: 128GB, 256GB and 512GB.
The suggested retail price of the Caviar Goldphone is set at $ 159,000 USD, for which you will receive the 128GB iPhone 12 Pro. Do you prefer a Samsung phone? Alternatively, Caviar offers the same design based on the Samsung Galaxy S21.
Ilse is a Dutch journalist and joined LetsGoDigital more than 15 years ago. She is highly educated and speaks four languages. Ilse is a true tech-girl and loves to write about the future of consumer electronics. She has a special interest for smartphones, digital cameras, gaming and VR.
Zadak is a fairly young manufacturer of computer hardware—they were founded in 2015 in Taiwan. Besides SSDs, they’ve released cases, memory, and closed-loop watercoolers. All their products are targeted at the DIY PC space.
The Zadak Spark RGB is an M.2 NVMe SSD that goes all out on RGB bling capability. Thanks to support for all major motherboard vendors, you can use the Spark RGB with your mobo’s RGB control software, and it just works. No additional cabling is required, the SSD will show up as a separate ARGB element in your motherboard’s RGB software.
Under the hood, the Zadak Spark RGB SSD is based on a Phison PS5012-E12 controller, paired with Micron 96-layer 3D TLC flash and 1 GB of DDR4 DRAM cache. PCI-Express 3.0 x4 is used as the host interface.
The Zadak Spark RGB SSD is available in capacities of 512 GB ($130), 1 TB ($220), and 2 TB ($390). Endurance for these models is set at 360 TBW, 726 TBW, and 1550 TBW respectively. Zadak provides a five-year warranty for the Spark RGB.
Specifications: ZADAK Spark RGB 1 TB
Brand:
ZADAK
Model:
SPARK PCIe Gen 3×4 M.2 RGB SSD
Capacity:
1024 GB (953 GB usable) No additional overprovisioning
Executives of Loongson Technology, a subsidiary of the Chinese Academy of Engineering, said at a recent conference that the next-gen Loongson 5000-series processors were on track to be released this year. The new MIPS64-compatible CPUs are aimed at client PCs as well as multiprocessor servers. Interestingly, the new chips may be the last high-end MIPS64 offerings from the Chinese Academy of Engineering.
The chips in question are the 2.50 GHz quad-core Loongson 3A5000 for client PCs and 16-core Loongon 3C5000 for servers with up to 16 processors. Both chips are set to be made using a 12nm process technology (most likely one of TSMC’s nodes), reports CnTechPost, citing a small conference that was held earlier this year. Both CPUs are said to be based on a new internal architecture that is compatible with the MIPS64 instruction set, feature enlarged caches, and a new memory controller.
Based on some previous reports, the 3A5000 was taped out in April 2020, which is why it is due in the coming months; whereas the 3C5000 was taped out in August, 2020, so it will be released towards the end of 2021 if everything goes as planned.
One interesting thing about Loongson Technology is that the company is reportedly ‘looking forward to join the open-source instruction consortium.’ The consortium mentioned by Loongson’s executives is almost certainly RISC-V International, which essentially means that going forward, the company will focus on RISC-V.
Loongson has historically developed MIPS-compatible CPU cores, so switching to RISC-V should not be too challenging for the company as the architectures have many similarities. Meanwhile, the adoption of RISC-V means that Loongson’s upcoming processors (or cores) will be supported by a broad ecosystem of software and hardware, something that will inevitably make them more competitive.
Developing new RISC-V-compatible microarchitectures and cores will take several years, so for now, Loongson will have to promote its 3A5000 among PC makers and its 3C5000 among server and HPC customers.
Although Intel has not yet officially launched its 11th-Gen Core processors for desktops codenamed Rocket Lake, these CPUs were available from a single retailer for a brief period of time, so enthusiasts have already begun experimenting. Recently, one experimenter decided to remove the Core i7-10700K’s lid (delid) to reveal the die underneath.
This week MoeBen, an enthusiast from Overclock.net forums, delidded Intel’s Core i7-11700K processor. Even though he used special tools for delidding, the CPU died as a result of his manipulations.
The main thing that strikes the eye about Intel’s Rocket Lake is its rather massive die size. A quick comparison of Rocket Lake’s silicon to delidded Intel’s previous-generation processors reveals that the die of Intel’s eight-core Core i7-11700K is both ‘taller’ and ‘wider’ than the die of Intel’s 10-core Core i9-10900K. Also, the new CPU uses a slightly different packaging with resistors placed differently.
Based on rough napkin math based on the size of Intel’s LGA115x/1200 packaging (38 mm × 38 mm), an estimate for the Rocket Lake die size puts it around 11.78 mm × 24.58 mm, or 289.5 mm2. Such a large die area puts Rocket Lake into the league of the company’s LCC high-end desktop and server processors. For example, Intel’s 10-core Skylake-SP with a massive cache is around 322 mm2.
Intel’s Rocket Lake processors pack eight cores based on the Cypress Cove microarchitecture (which is a derivative of the company’s Willow Cove microarchitecture), an integrated GPU featuring the Xe architecture, a new media encoding/decoding engine, a revamped display pipeline, and a new memory controller.
Essentially, Rocket Lake uses CPU and GPU IP designed for Intel’s 10 nm SuperFin process technology, yet since it is made using one of Intel’s 14 nm nodes, it is natural that the said IP consumes more silicon area. To that end, it is not surprising that the new CPU is substantially bigger than its predecessor despite the fact that it has fewer cores. Obviously, since these cores are larger (and faster), they take up more die space.
Intel is projected to officially launch its Rocket Lake processors on March 30, 2021.
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The true wireless earbuds market has never been more crowded than it is in 2021. With so many to choose from, finding the best earbuds can seem daunting. But the vast selection is actually a good thing: not only are there excellent picks for everyday buds to carry in your pocket, but you’ve also got a slew of options that prioritize things like noise cancellation, fitness, lengthy battery life, and comfort.
Even if you don’t consider yourself any kind of audiophile, it’s important to find a set of earbuds that sound good to you. This means different things depending on the person: do you want head-rattling bass or something more balanced with an immersive soundstage? You’ll want to find a pair with a good, reliable Bluetooth connection — all of the below picks check off that box — and enough battery life to last you through a normal day of intermittent listening.
Remember that getting the most out of earbuds requires a good seal in your ear. Always try the various ear tip sizes that come with whichever buds you purchase — and don’t be afraid to experiment with different sizes in each ear. Ears are funny like that. Many of these earbuds have apps you can install on your phone to further personalize their sound and controls the way you want.
If you’re looking for the overall best noise-canceling earbuds, you’ll be very happy with Bose’s QuietComfort Earbuds. They have best-in-class noise cancellation and sound great.
But if you’ve got other priorities, there is a range of great options from Apple, Beats, Jabra, Sennheiser, and Ultimate Ears that won’t disappoint. This guide covers higher-end wireless earbuds. If you’re on the hunt for more affordable options, check out the best cheap wireless earbuds to buy.
1. Bose QuietComfort Earbuds
Best noise-canceling earbuds
The QuietComfort Earbuds offer very powerful active noise cancellation, but what’s equally nice about them is how customizable the ANC is. You can choose between 11 different levels of noise cancellation (based on how much of the outside world you want mixed in) and set three favorites to cycle between when you double-tap the left earbud.
Bose’s premium earbuds put out fantastic audio with punchy bass. Their transparency / ambient mode is second only to Apple in how natural it sounds. And even the voice mics work well, so you really get the whole package — as you should for this kind of money.
2. Apple AirPods Pro
Best wireless earbuds for the iPhone
There’s no beating the interplay between AirPods and Apple’s other devices like the iPhone, iPad, and Mac. The AirPods Pro don’t offer the best sound quality of our top picks, but it’s perfectly satisfactory to many people. And the active noise cancellation is right up there with Bose.
But it really all comes together if you’re in Apple’s ecosystem and also own a Mac or iPad. The AirPods Pro can automatically hop between devices based on which one you’re using, and on iPhone or iPad, spatial audio delivers immersive surround sound when watching streaming video apps. They’re fantastic for making calls with, and Apple continues to pull ahead of competitors when it comes to ease of use.
Here’s a tip: if none of the included ear tips get you a perfect seal, I recommend a set of memory foam tips like those from Comply or Dekoni.
3. Jabra Elite 75t
Best wireless earbuds for multitasking
Jabra is pretty much the only company making true wireless earbuds that support “multipoint” for two simultaneous Bluetooth connections. So you can pair them up with a phone and your laptop or tablet at the same time. Jabra’s mobile app offers a ton of customization over the controls, EQ, and even includes bonuses like white noise or nature sounds if you’ve got situations where they’d be handy.
Jabra Elite 75t
$130
$150
14% off
Prices taken at time of publishing.
Jabra’s Elite 75t earbuds offer pleasing bass-heavy sound, reliable performance, and can connect with two devices — like a phone and laptop — at the same time.
$130
at Amazon
$130
at Best Buy
The newer Elite 85t earbuds add more effective noise cancellation to the mix, but the 75ts are on sale so frequently that they’re still the go-to pick if multitasking is important to you. They pack a wallop when it comes to bass — but not to the point where it overwhelms the rest of the mix.
Jabra backs them with a two-year warranty in the event you experience any hardware issues. (I’ve had a 75t bud stop taking a charge out of nowhere, so it can happen.)
4. Beats Powerbeats Pro
Best wireless earbuds for fitness
Nothing has managed to unseat the Powerbeats Pro as the best fitness earbuds since their release in 2019. Their ear hook design keeps them planted on your ears during intense exercise, they can endure your sweatiest workouts, and the nine hours of continuous battery life should get you through just about any marathon. And the sound quality is killer, with plenty of bass to keep you motivated and moving.
And since Beats is owned by Apple, the Powerbeats Pro can also take advantage of features like audio sharing, auto device switching (like the AirPods Pro), and a dead-simple pairing process.
5. Samsung Galaxy Buds Plus
Best wireless earbuds for battery life
They can last 11 hours on a single charge. That’s what I consider marathon battery life for true wireless earbuds, and few other companies have managed to keep up with the longevity of Samsung’s Galaxy Buds Plus. They lack active noise cancellation, so that helps them keep playing for longer, but even then, 11 hours is quite a feat. Like the Jabras, these are often on sale and easy to grab at a discount.
6. Sennheiser Momentum True Wireless 2
Best wireless earbuds for sound quality
Sennheiser’s second swing at true wireless earbuds improve on the original Momentums with a more comfortable fit and the addition of active noise cancellation. But everything about these earbuds is second fiddle to their sound quality: the Momentum True Wireless 2 earbuds put out dynamic, expressive, and wonderfully detailed audio. They’re the sort of buds that will bring out things in your favorite music you haven’t noticed before.
But that upgraded sound quality comes for a hefty $300 price. If you want arguably the best sound that true wireless earbuds can deliver, these are it. But all of these other picks sound plenty good in their own right.
7. UE Fits
Best wireless earbuds if comfort is everything
If you often have difficulty finding ear tips that fit your ears comfortably, it doesn’t really get better than the UE Fits. These earbuds include special tips that mold to the shape of your ear during a 60-second fitting process that you activate with UE’s app. They get warm during molding (but not uncomfortably so) and you can feel them adapting to the contours of your ear canal.
Once the process is done, you’re left with custom earbuds with a fit that’s as close to perfect as you’ll ever find — unless you visit your local audiologist for a professional mold, and that gets expensive fast. Ultimate Ears has a fit “guarantee” and will send you a second set of tips should your first molding attempt go awry. The UE Fits are quite good, last for up to eight hours of continuous playback, and they’re rated IPX4 for water resistance.
UE Fits
$249
Prices taken at time of publishing.
The UE Fits come with unique ear tips that permanently mold to the unique shape of your ears in just 60 seconds. This allows for a much better fit that you can comfortably wear for hours.
Samsung Foundry will be the first maker of semiconductors to start using gate-all-around field-effect transistor (GAAFET)-like structures with its upcoming 3 nm fabrication process. The node is not quite ready for primetime yet, but at the IEEE International Solid-State Circuits Conference (ISSCC) engineers from Samsung Foundry shared some of the details about the upcoming 3 nm GAE MBCFET (multi-bridge channel FET) manufacturing technology.
Formally, there are two types of GAAFETs: typical GAAFETs called nanowires that feature ‘thin’ fins as well as MBCFETs called nanosheets that use ‘thicker’ fins. In both cases, the gate material surrounds the channel region on all sides. Actual implementations of both nanowires and nanosheets heavily depend on design, so in general many industry observers describe both with one term, GAAFETs. But previously they were known as surrounding-gate transistors (SGTs). Meanwhile, MBCFET is a trademark of Samsung.
The first GAAFETs were demonstrated in 1988, so the key advantages of the technology are pretty well known. The very structure of this type of transistor allows designers to precisely tune them for high performance or low power by adjusting width of the transistor channel (also known as effective width, or Weff); wider sheets enable higher performance at higher power while thinner/narrower sheets reduce power consumption and performance. To do something similar with FinFETs, engineers have to use additional fins in a bid to improve performance. But in this case the ‘width’ of the transistor channel can only be doubled or tripled, which is not really precise and sometimes inefficient. In addition, adjustments of GAAFETs allow for increased transistor density, as different transistors can be used for different purposes.
Back in 2019, Samsung’s 3GAE process design kit version 0.1 included four different nanosheet widths to provide some flexibility for early adopters, though it is unclear whether the company has added more widths for extra flexibility. In general, Samsung says that when compared to its 7LPP technology, its 3GAE node will enable an up to 30% performance improvement (at the same power and complexity), up to 50% lower power (at the same clocks and complexity), and an up to 80% higher transistor density (which includes a mix of logic and SRAM transistors).
Samsung’s 3GAE (its first-generation MBCFET technology) is due in 2022. So Samsung has not disclosed all of its peculiarities just now. At ISSCC, the company discussed how it improved SRAM performance and scalability using its new types of transistors. The scalability of SRAM has been lagging scalability of logic in recent years. Meanwhile, modern system-on-chips use loads of SRAM for various caches, so improving its scalability is a crucial task.
At ISSCC, Samsung Foundry described its 256Mb MBCFET SRAM chip with a 56mm2 die size, reports EE Times Asia. This means that while the company has yet to tape out its first 3GAE logic chip it is evident that the technology works for SRAM.
SRAM is a six-transistor memory cell: two pass gates, two pull ups, and two pull downs. In FinFET designs, an SRAM cell would use the same transistors with the same channel width. With MBCFET, Samsung could tune the channel width, so it came up with two schemes: In one case it used transistors with wider channels for pass gates and pull downs, while in another it would use transistors with wider channels for pass gates and transistors with narrower channels for pull downs. By using transistors with wider channels for pass gates and transistors with narrower channels for pull ups, Samsung has managed to decrease writing voltage by 230 mV compared to a regular SRAM cell, according to Samsung via IEEE Spectrum.
AMD has announced via a reddit post that it has found a fix for the widely-reported USB connectivity issues that have impacted systems with Ryzen processors, saying, “With your help, we believe we have isolated the root cause and developed a solution that addresses a range of reported symptoms[…].” The fix comes after AMD acknowledged reports of the issues last month and asked users to help it pinpoint the source of the problem by submitting detailed logs.
AMD will release a new AGESA 1.2.0.2 to motherboard vendors in ‘about a week,’ and downloadable beta BIOSes with the patch will land in early April. Naturally, fully-validated BIOS versions with the fix will arrive shortly thereafter.
AMD hasn’t provided further clarity about the fix or the nature of the underlying problem, but the issues seemed confined to Ryzen 3000 and 5000 series CPUs in 500- and 400-series motherboards (i.e., X570, X470, B550, and B450) and consisted of random dropouts for USB-connected devices. The complaints encompassed several different types of USB devices, including unresponsive external capture devices, momentary keyboard connection drops, slow mouse responses, issues with VR headsets, external storage devices, and USB-connected CPU coolers.
Motherboard vendors build firmware upon the AGESA bedrock, so improvements to the underlying code take some time to filter out to the general public. As a reminder, AGESA (AMD Generic Encapsulated System Architecture) is a bootstrap protocol that initializes processor cores, memory, and the HyperTransport (now Infinity Fabric) controller.
Here’s AMD’s post regarding the matter:
“We would like to thank the community here on r/AMD for its assistance with logs and reports as we investigated the intermittent USB connectivity you highlighted. With your help, we believe we have isolated the root cause and developed a solution that addresses a range of reported symptoms, including (but not limited to): USB port dropout, USB 2.0 audio crackling (e.g., DAC/AMP combos), and USB/PCIe Gen 4 exclusion.
AMD has prepared AGESA 1.2.0.2 to deploy this update, and we plan to distribute 1.2.0.2 to our motherboard partners for integration in about a week. Customers can expect downloadable BIOSes containing AGESA 1.2.0.2 to begin with beta updates in early April. The exact update schedule for your system will depend on the test and implementation schedule for your vendor and specific motherboard model. If you continue to experience intermittent USB connectivity issues after updating your system to AGESA 1.2.0.2, we encourage you to download the standalone AMD Bug Report Tool and open a ticket with AMD Customer Support.”If you’re experiencing issues with USB connectivity issues now, AMD has previously issued a few suggestions on how to resolve the issue. You can apply those fixes now while you wait for the new BIOS revisions. We followed up with AMD for more information on the nature of the problems, but the company says it isn’t providing further information on the matter.
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