AMD’s Ryzen 5000 series processors have taken the DIY desktop PC market by storm, rewriting our Best CPU for Gaming recommendations and upsetting our CPU Benchmark Hierarchy. Now AMD is bringing the benefits of its Zen 3 architecture and 7nm process to the OEM market through two lower-TDP models, the Ryzen 9 5900 and Ryzen 7 5800.
As expected, these chips are functionally the same as the 12-core 24-thread Ryzen 9 5900X and eight-core 16-thread Ryzen 7 5800X, but they come with a lower TDP rating, the results in reduced clock speeds. These trimmings allow the chips to drop into smaller chassis and operate with the lesser cooling systems we see in the OEM market.
AMD Ryzen 5000 Series CPUs
Zen 3 Ryzen 5000 Series Processors
RCP (MSRP)
Cores/Threads
Base/Boost Freq.
TDP
L3 Cache
Ryzen 9 5950X
$799
16 / 32
3.4 / 4.9 GHz
105W
64MB (2×32)
Ryzen 9 5900X
$549
12 / 24
3.7 / 4.8 GHz
105W
64MB (2×32)
Ryzen 9 5900
N/A
12 / 24
3.0 / 4.7
65W
32MB (1×32)
Ryzen 7 5800X
$449
8 / 16
3.8 / 4.7 GHz
105W
32MB (1×32)
Ryzen 7 5800
N/A
8 / 16
3.4 / 4.6
65W
32MB (1×32)
Ryzen 5 5600X
$299
6 / 12
3.7 / 4.6 GHz
65W
32MB (1×32)
Remember, AMD specs a 280mm water cooler, or equivalent air cooler, as the minimum for the Ryzen 5000 105W processors, and you simply don’t see that class of cooling in the majority of OEM systems. Dialing back the TDP, and thus the cooling requirements, will help AMD squeeze more Zen 3 chips into OEM systems from the likes of HP, Lenovo, and others, though we haven’t seen any official announcements yet.
As expected with OEM chips, AMD isn’t sharing pricing for the new Ryzen models. Pre-built OEM systems comprise roughly 60% of the desktop PC market, and AMD’s continued push to bring more of those systems to market makes good business sense.
However, we’ve seen a string of OEM-exclusive AMD launches, like the Ryzen 7 Pro 4750G that we managed to find on the grey market and Threadripper 3995WX we recently reviewed, that would also make great chips for enthusiasts. It is a bit disappointing to see these lower-TDP models, which would naturally come with lower MSRPs, land in the OEM market. These chips could help address the only pain point of the Ryzen 5000 series – the chips cost more than their predecessors at retail, raising the bar for entry to the powerful Zen 3 platform.
But who knows? AMD could bring these chips to retail in the future, just like we saw with the aforementioned Threadripper Pro 3995WX. That chip landed in OEM systems first, but AMD announced today that it is coming to retail outlets, too.
AMD CEO Dr. Lisa Su took to the stage at the virtual CES 2021 to announce new ‘Cezanne’ Ryzen 5000 Mobile processors that bring the powerful Zen 3 architecture to the notebook market for the first time, opening the door for the company to finally have a larger presence in the highest-end gaming notebooks. That means that we’ll finally see AMD’s chips paired with the highest-end mobile GPUs when the new Ryzen 5000 Mobile processors come to market in February, which could shake up our Best Gaming Laptops rankings.
AMD says the new chips set the new standard for battery life in x86 notebooks and remain the only 8-core x86 chips for ultrathin laptops. The 13 new processors span from low-power 15W chips up to two new 45W+ HX-series models designed to bring desktop PC-like gaming performance to notebooks. These eight-core HX models carve out a new high-performance niche by bringing CPU, memory, and fabric overclocking to AMD-powered notebooks for the first time.
AMD also expanded its HS series with four flagship chips that slot in with boost clock speeds that stretch up to 4.8 GHz within the 35W TDP envelope. Two new 45W H-series models, which come in both six- and eight-core flavors, are trailed by five U-series processors.
AMD also conducted a demo of its RDNA2 mobile graphics cards that will come to market in the first half of this year. They’ll be accompanied by unspecified new RDNA2 cards for the desktop PC. But first, let’s take a look at the mobile CPUs.
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The Ryzen 5000 mobile processors all come with threading enabled, higher boost clocks than the previous-gen, and support CPPC (Collaborative Power and Performance Control) technology. This is the same thread-targeting feature present in the Ryzen 3000 and 5000 desktop CPUs, but now it’s debuting in AMD-powered laptops. Ultimately, this allows for tighter performance and power control, resulting in higher boost clocks on the fastest cores and extends battery life.
While we have detailed clock speeds and other particulars for the CPU portion of the SoCs, we do know the chips come with the same enhanced 7nm Vega architecture as the previous-gen Ryzen 4000 models (not the company’s newest Navi engine). AMD says the units have seen ‘double-digit increases’ due to higher frequencies, precise clock selection, better power state management, and the increased performance of the Zen 3 CPU cores.
AMD’s 7nm Radeon Vega graphics engine touts up to 59% more performance per CU (compute unit) than the first-gen 14nm Vega, which previously allowed the company to use 8 CUs instead of 11. We don’t know any other details about the integrated graphics engine, like the graphics clock rates or core (CU) counts for the various SKUs, but AMD says it will share more info in technical briefings as we come closer to the launch next month.
AMD recently chose to unify its Ryzen Mobile branding under the same Ryzen 5000 umbrella as its desktop chips, clearing up the confusion with the Ryzen 4000 series processors that came with an older architecture than desktop Ryzen 3000 models. However, AMD also sprinkled in three Zen 2 chips in the Ryzen 5000 Mobile stack. AMD says this approach meets specific pricing criteria and customer (OEM) demand on the lower end of its product stack. As seen in the second slide, these Zen 2-powered Ryzen 3, 5, and 7 models slot into the lowest-end 15W U-series category, muddying the branding for value seekers.
AMD U-Series Ryzen 5000 Mobile
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AMD shared a series of head-to-head benchmarks, but as with all vendor benchmarks, we should take them with a grain of salt.
AMD’s 15W U-series includes the Zen 2-powered Ryzen 7 5700U, Ryzen 5 3500U, and 5500U, but as you can see, they outperform their previous-gen Zen 2 equivalents in the Cinebench R20 multi-threaded test (as listed in the test notes). However, this test result is a bit unclear as it appears that AMD has used a multi-threaded metric to derive a single-threaded performance rating.
The PCMark 10 tests are a bit more definitive. The 15W Ryzen 7 5800U outperforms the previous-gen Ryzen 7 4800U easily and notches substantial wins over Intel’s four-core eight-thread Core i7-1165G7. Intel’s processor has a 12W to 28W TDP range, and it’s unclear if it was set to the maximum settings in these tests.
AMD says the Ryzen 7 5800U offers up to 17.5 hours of battery life during general usage and up to 21 hours of battery life during video playback, both of which are the longest in the ultrathin category.
AMD HS-Series Ryzen 5000 Mobile
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AMD’s 35W HS-Series processors are geared toward compact notebooks, and the flagship Ryzen 9 5980HS comes armed with four cores and eight threads that operate at a 3.0 GHz base and 4.8 GHz boost frequency — the highest of the Ryzen 5000 Mobile series. AMD’s benchmarks show the chip beating the eight-core 16-thread Intel Core i9-10980HK by ~1% in the single-threaded Cinebench R20 benchmark, and ~11% in the multi-threaded test.
AMD HX-Series Ryzen 5000 Mobile
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AMD shared a few benchmark comparisons of its highest-end overclockable Cezanne chip, the 45W Ryzen 9 5900HX, against Intel’s 45W Core i9-10900HK in a battle of the highest-end chips in both chipmakers’ stables. AMD claims a 14% advantage in single-threaded performance measured by Cinebench R20, a 37% advantage in overall performance as measured by Passmark PT10, and a 21% game physics advantage in the Fire Strike Physics benchmark. How that translatest to actual games is another matter.
Thoughts
AMD’s Ryzen 4000 series mobile processors have already taken the notebook market by storm, granting the company its biggest slice of the mobile market in history, and the Ryzen 5000 Mobile chips look to continue that momentum. AMD pulled off this feat in record time — the Raven Ridge chips didn’t come to the mobile market for a year after debuting on the desktop, while this Zen 3 transition should take roughly four months.
(Image credit: AMD)
Speaking of Raven Ridge, those chips came to market in 75 designs, while the next-gen Ryzen 4000 chips landed in 100 devices. AMD expects Ryzen 5000 to land in over 150 notebooks by the end of the year, many with the highest-end graphics cards, a distinction that has long eluded the company.
(Image credit: AMD)
AMD has its own higher-end discrete mobile graphics cards coming, too. The company demoed an RDNA2 GPU running at over 60 fps in Dirt 5 at the 1440p resolution. The RDNA2 mobile graphics cards will come to market in the first half of this year. AMD also says that new RDNA2 graphics cards for the desktop PC will also land in the first half, but didn’t share any further detail.
Based on what we know about RDNA2 GPUs, these mobile chips are most likely unannounced Navi 22 or Navi 23 parts. Navi 21 goes in the current RX 6900 XT, 6800 XT, and 6800, but it can be quite power hungry and is a large 520mm2 chip. We expect AMD will have RX 6700 XT and RX 6700 cards in the near future, which will use less power. Mobile optimized versions of these would be the logical choice for gaming laptops.
We’ll have to wait to see how the Ryzen 5000 Mobile chips perform in real-world testing, and we’re particularly eager to see how the 7nm Radeon Vega graphics engine performs in tandem with the Zen 3 CPU cores. It won’t be long before we learn more about the chips — AMD says it will share more details before they come to market in February.
AMD CEO Dr. Lisa Su demoed the company’s upcoming third-gen EPYC Milan processors at CES, showing two of its 32-core models outperforming two 28-core Intel Xeon Scalable processors in a weather research and forecast (WRF) workload by 68%. The demo also possibly foreshadows AMD’s pricing strategy with its 32-core EPYC Milan models.
As with the current-gen EPYC Rome processors, AMD fabs the EPYC Milan chips with the 7nm process, and they top out at 64 cores. The most significant change to the series comes with the infusion of the Zen 3 microarchitecture that lends a 19% in instruction per cycle (IPC) throughput improvement courtesy of changes like a unified L3 cache and better thermal management techniques that allow the chip to extract more performance within any given TDP range.
(Image credit: AMD)
Here we can see two unnamed 32-core AMD Milan processors going head-to-head with two of Intel’s 28-core Xeon 6258R processors. This may seem like a bit of a lopsided comparison, but the performance delta, and AMD’s traditionally much less-expensive price points, factor into the importance of the benchmark results.
The WRF workload relies on large datasets, so data ingest performance is critical. Milan should have an advantage in this area, as it’s thought to come with the same 128 PCIe 4.0 lanes and eight channels of DDR4 support as the existing Rome models. (AMD’s Rome already has the connectivity advantage over Intel’s Xeon Scalable processors.) The benchmark runs a real-world workload to create a six-hour weather forecast.
(Image credit: AMD)
AMD’s results show a 68% performance advantage over Intel’s chips, and the nature of the comparison might foreshadow AMD’s pricing strategy for its new line of processors – it’s rational to expect the 32-core EPYC Milan models to land at similar or lower pricing than the $3,950 Xeon 6285R.
Milan’s increased IPC throughput floats all boats in terms of performance, but it tends to have the biggest impact on per-core performance. This is an essential aspect of performance for customers that license software on a per-core basis because it results in lower licensing fees.
Naturally, we can only imagine how this performance comparison would stack up against two of AMD’s 64-core models – the Xeon 6258R represents the height of Intel’s Xeon performance with the maximum of 28 cores.
We won’t have to wait long – AMD says EPYC Milan is on track will have its formal launch later this quarter. However, the EPYC Milan chips began shipping to select cloud and HPC customers in the last quarter of 2020, while the formal launch signifies availability for Tier 1 OEMs. That’s also evident by a string of benchmark results that have surfaced for both the 64-core and 32-core models.
AMD’s early Milan shipments to HPC partners are critical: Milan has already enjoyed explosive uptake in the supercomputer space and is slated to power the world’s soon-to-be-fastest supercomputer, the exascale-class Frontier, and the Perlmuter supercomputer, among many others.
The EPYC Milan Tier 1 OEM launch comes soon, but the competitive landscape could change in the interim – Intel’s 10nm Ice Lake processors are also slated for release in the same time frame.
At its CES 2021 keynote, AMD has announced its new Ryzen 5000 mobile CPUs. Most (but not all) of them are based on the company’s 7nm “Zen 3” architecture. AMD CEO Lisa Su called the series “the most powerful PC processors ever built.”
As with the previous generation, the 5000 line has two categories for two very different audiences. There’s the H-series — which you’ll find in laptops intended for gaming and content creation — and the U-series, meant for ultraportable notebooks. (Three of the U-series chips are based on the older Zen 2 architecture, which is a bit annoying.)
Within those categories are the Ryzen 3, Ryzen 5, Ryzen 7, and Ryzen 9 tiers (loose counterparts to Intel’s Core i3, Core i5, Core i7, and Core i9, respectively). The H-series keeps the H and HS suffixes from the 4000 series, in addition to a new HX designation.
Headlining the U-series is the eight-core, 16-thread Ryzen 7 5800U, with 1.9GHz clock speeds that can boost up to 4.4 GHz. AMD claims that this chip delivers “the fastest productivity in ultrathin notebooks.” Per the company’s benchmarks, the chip outperforms Intel’s Core i7-1165G7 by a factor of 1.23 on PCMark 10 and beats it on a subtest involving a number of office apps including Excel and Edge (though the two chips tie on PowerPoint, and Intel wins very narrowly on Word).
The company also claims the 5800U can deliver up to 17.5 hours of general-usage battery life and 21 hours of movie playback. That would be quite a lot of juice, even for AMD, but we’ll have more accurate estimates once we’ve tried the systems out.
On the H-series side, the big player is the Ryzen 9 5980HS, also with eight cores and 16 threads, but with 3.0Ghz clock speeds boosting up to 4.8GHz. AMD says these are “the fastest mobile processors you can get.” The 5980HS is multiple steps above the Ryzen 9 4900HS, the monstrous chip that powers Asus’ 2020 Zephyrus G14.
AMD claims that the Ryzen 9 5980HS beats out Intel’s Core i9-10980HK on Cinebench R20 in both single-thread performance (601 to Intel’s 514) and multi-thread performance (4349 to the i9’s 3892). It also beats the newer Core i7-1185G7 in both cases.
New to the H-series are the HX chips, which AMD says are meant for “serious gaming.” AMD claims that its Ryzen 9 5900HX, at 45W+ TDP, will power “2021’s best gaming notebooks.”
Per the company’s benchmarks, the chip beats the Core i9-10980HK on Cinebench R20 (single-thread) by 14 percent, 37 percent on Passmark P10 (measuring overall CPU performance), and 21 percent on 3DMark Fire Strike Physics (which measures graphics performance).
Su expects over 150 Ryzen 5000 laptops to launch this year — she expects the first to hit shelves in February.
The big question will be how these processors compare to Intel’s new Tiger Lake H systems — the company announced those chips yesterday at its CES 2021 keynote. All three of those chips (including two Core i7s and one Core i5) max out at 35W and have just four cores and eight threads — half the count of Ryzen’s top offerings. However, Intel says there’s an eight-core processor with speeds up to 5GHz coming “later this quarter.” That’s likely what AMD has to watch out for.
AMD CEO Dr. Lisa Su will take the stage to deliver her second CES keynote today, and you can watch the action unfold here, live, in the embedded video below. The keynote begins at 11am ET / 9am PT, and be sure to check for our deep dive coverage following the event.
AMD has taken the world by storm, upsetting Intel on the CPU side for the first time in 15 years and giving Nvidia a stiff challenge in GPUs. We expect the company to build on that momentum with its CES 2021 announcements, perhaps with the rumored announcement of the next-gen Cezanne Ryzen 5000 Mobile processors.
AMD’s official press release about the keynote doesn’t give us any clue what the company will unveil, but Zen 3-powered Threadripper and new mid-range Radeon RX 6700 series graphics cards are among the potential contenders.
We’ve also seen new DIY-focused motherboards emerge for the Threadripper Pro series that we recently took for a spin, so there’s a possibility that we could learn more about those processors at the show, too. Anything’s possible, pull up a seat!
At yesterday’s keynote at CES, Intel presented numerous innovations in the field of processors. Tiger Lake, Rocket Lake, Jasper Lake and Alder Lake – these are the code names of the processors used in the various categories.
But there is another announcement from Intel concerning the data center. The third-generation Xeon scaleable processors alias Ice Lake-SP, which were already expected in the fourth quarter and then apparently moved to 2021 to be mass-produced this quarter. This means that the first major customers should be supplied with the new processors in the coming weeks. General availability should be achieved in the second quarter.
“Today marks a significant milestone for Intel as we continue to accelerate the delivery of our 10 nm products and maintain an intense focus on delivering a predictable cadence of leadership products for our customers, “ said Navin Shenoy, executive vice president and general manager of the data center group at Intel. “Our 3rd Gen Intel Xeon Scalable platform represents a strategic part of our data center strategy and one that we’ve created alongside some of our biggest customers to enable the data center of tomorrow.”
Intel is not giving the official starting shot, but is talking about a formal announcement that will follow in the coming months.
Use the Xeon processors based on Ice Lake-SP CPU cores based on the Sunny Cove architecture. It is not yet known how many cores Intel has packed into a package. Thanks to the new CPU cores, an IPC plus of about 14% expected. As an innovation of the platform, Ice Lake-SP will support PCI-Express 4.0 and thus eliminate a disadvantage of the current Xeon generation. In addition, Intel is increasing the number of memory channels from six to eight.
The EPYC processors based on the Milan design, i.e. the Zen 3 architecture, are expected to start in the coming weeks and months . So there is another exchange of blows in the server area.
To come back to the code names at the beginning of the message: Yesterday Intel presented new quad-core processors for mobile use (Tiger Lake -H 21) announced the more powerful models with up to eight cores for later in the year at (Tiger Lake-H 45), transferred the first Pentium and Celeron processors in the 01 -nm production (Jasper Lake) and gave further details about the next (Rocket Lake-S) and the next but one (Alder Lake) desktop platform.
Already in the run-up to the CES 2021 indicated that there would be numerous innovations in the mobile area. Now Intel has announced the Tiger Lake H processors, which should cover a new ultra-mobile performance range. Tiger Lake-H is the well-known Tiger Lake design with four cores, but with significantly more leeway in the power limit than has been the case with the ultra-mobile Tiger Lake variants so far. Intel calls the processors a special edition. In the form of the Core i7 – 1165 G7 we have already looked at one of these.
Tiger Lake-H should be characterized by a maximum clock rate of 5 GHz. The fastest Core i7 so far – 1185 G7 comes to 4.8 GHz. Thanks to the use of the Willow Cove architecture, the Tiger Lake processors are said to offer quite a remarkable single-threaded performance. It is not surprising that the ST-CPU performance also increases by 9% compared to the previous Tiger Lake processors – the higher clock rate in comparison makes this possible.
The Xe-LP -Graphics unit is identical to the previous Tiger Lake processors. So we see 96 Execution Units (EUs) with a cycle of up to 1, 35 GHz. The connection of the main memory is also identical. The corresponding controller supports DDR4 – 2485 and LPDDR4X – 4266. An integrated Thunderbolt 4 controller and Wi-Fi 6 / 6E are also offered. The four available PCI Express 4.0 lanes can be used to connect an SSD in the best possible way. It is not known whether a dedicated GPU will also be connected via it.
The Tiger-Lake-H -Processors with the new mobile graphics cards of the GeForce RTX – 30 – Generation from NVIDIA, which will be introduced tomorrow. In this context, Intel also mentions support for Resizeable BAR. Intel and NVIDIA have now also implemented the technology that AMD (as Smart Memory Access) transferred to gamer practice.
The technical data of the Tiger Lake H models are as follows from:
Comparison of the models
Model
Cores / Threads
Clock cTDP Up
Clock cTDP Down
1C-Turbo
2C-Turbo
4C-Turbo
TDP
Core i7 – 11375 H
4/8
3.3 GHz
3.0 GHz
5.0 GHz
4.8 GHz
4.3 GHz
28 – 35 W
Core i7 -11370H
4/8
3.3 GHz
3.0 GHz
4.8 GHz
4.8 GHz
4.3 GHz
28 – 35 W
Core i5 – 11300H
4/8
3.1 GHz
2.6 GHz
4.4 GHz
4.4 GHz
4.0 GHz
28 – 35 W
As part of the existing Tiger Lake product range, the new models are as follows:
Comparison of the models
Model
Cores / Threads
Base cycle
Single-Core-Turbo
Cache
ES
TDP
Core i7 – 1185 G7
4/8
3.0 GHz
4.8 GHz
12 MB
96
12 – 28 W
Core i7 – 1165 G7
4/8
2.8 GHz
4.7 GHz
12 MB
96
12 – 28 W
Core i7 – 11375H
4/8
3.0 GHz
5.0 GHz
12 MB
96
28 – 35 W
Core i7 – 11370H
4/8
3.0 GHz
4.8 GHz
12 MB
96
28 – 35 W
Core i5 – 1135 G7
4/8
2.4 GHz
4.2 GHz
8 MB
80
12 – 28 W
Core i5 – 11300 H.
4/8
2.6 GHz
4.4 GHz
8 MB
80
28 – 35 W
Core i3 – 1125 G4
4/8
2.0 GHz
3.7 GHz
8 MB
48
12 – 28 W
Core i3 – 1115 G4
2/4
3.0 GHz
4.1 GHz
6 MB
48
12 – 28 W
Core i7 – 1160 G7
4/8
1 , 2 GHz
4.4 GHz
12 MB
96
7 – 15 W
Core i5 – 1130 G7
4/8
1.1 GHz
4.0 GHz
8 MB
80
7 – 15 W
Core i3 – 1120 G4
4/8
1.1 GHz
3.5 GHz
8 MB
48
7 – 15 W
Core i3 – 1110 G4
2/4
1.8 GHz
3.9 GHz
6 MB
48
7 – 15 W
Manufacturers such as Acer, ASU S, MSI, Sony, Dell, HP and Lenovo will bring corresponding notebooks onto the market or have already announced them – even without explicit mention of Tiger Lake-H. The notebooks should be in the first half of the year 2021 come on the market.
Of course, Intel also delivers some benchmarks. Compared to the Comet Lake H predecessors, the new processors have an advantage, especially in terms of consumption, because instead of up to 45 W with 35 W get along. In terms of single-threaded performance, Intel sees itself as having a clear advantage over the competition.
With regard to the range of functions, it should be noted that the Tiger Lake H processors do not support any overclocking (and therefore no Extreme Tuning Utility (XTU) either.
AMD will, however, present the successor based on the Zen 3 architecture tomorrow and this lead should be a little smaller again.
Tiger Lake-H with eight cores and 20 x PCIe 4.0 later
Without an exact date, Intel has also announced further Tiger Lake H models. These are the models with up to eight cores and 16 Threads that are supposed to reach 5 GHz on multiple cores. Another factor of this Mo dent should be the 16 PCI Express 4.0 lanes, while the previous Tiger Lake processors only have four Offer.
Intel fired back at AMD’s Ryzen 5000 today at CES 2021 with its Rocket Lake-S flagship, claiming the new chip takes back the gaming performance crown. Intel says that its 14nm Rocket Lake processors will come to market this quarter with a 19% IPC increase born of the new Cypress Cove architecture, matching AMD’s IPC increase with its Ryzen 5000 series processors. Intel pairs this new backported architecture with its 14nm process, touting boost speeds up to a dual-core 5.3 GHz, all of which the company says will wrest the gaming lead back from the fastest gaming chip on the market, AMD’s potent 5900X, and perhaps shake up our Best CPU for Gaming and CPU Benchmark Hierarchy in the process.
Intel also claims the new chips, courtesy of the new Xe Graphics architecture, will deliver a 50% gen-on-gen increase in integrated GPU gaming performance.
(Image credit: Intel)
Intel has slowly teased bits of info about Rocket Lake, but here’s probably the most important new bit of details: Intel says the 8C/16T Core i9-11900K reclaims the gaming performance crown from AMD’s Ryzen 9 5900X at 1080p. The margins are slim, though. Intel ran these tests with an EVGA RTX 3080 XC3 graphics card, and the company’s claimed lead ranges from 2% to 8% (roughly a 4% advantage overall). That paints a picture of a closely-contested battle in gaming performance between Rocket Lake and Zen 3, particularly at higher resolutions.
Intel’s traditionally higher overclocking ceilings could prove to be an advantage against the Ryzen 5000 processors — it’s important to remember that Intel tested the Rocket Lake chip at stock settings. If these slim deltas play out in our testing and the Intel chips overclock well, pricing might be the determining factor if you’re on the hunt for a gaming processor in 2021. Unfortunately, Intel hasn’t shared pricing or availability information yet (the chips are rumored to land in mid-March). Still, the company has detailed a few other new features for the Rocket Lake series.
(Image credit: Intel)
AMD Ryzen 5000 Series Processor Competition
Zen 3 Ryzen 5000 Series Processors
Cores/Threads
Base/Boost Freq.
TDP
Ryzen 9 5900X
12 / 24
3.7 / 4.8
105W
Intel Core i9-11900K
8 / 16
? / 5.3
150W?
Core i9-10900K / F
10 / 20
3.7 / 5.3
125W
Ryzen 7 5800X
8 / 16
3.8 / 4.7
105W
Core i9-10850K
10 / 20
3.6 / 5.2
95W
Core i7-10700K / F
8 / 16
3.8 / 5.1
125W
Much of Intel’s Rocket Lake disclosure covers information we already knew, but there are a few new tidbits. Intel’s Core i9-11900K is the company’s Rocket Lake flagship and comes with 5.3 GHz dual-core and 4.8 GHz all-core boost frequencies, matching the previous-gen 10900K. It’s noteworthy that these are Thermal Velocity Boost frequencies that only activate if the processor is under a certain temperature limit, but most motherboard makers ignore those limits anyway. That means the chips will likely operate at these speeds regardless of temperature limits, at least on higher-end motherboards.
The 11900K comes with only eight cores and sixteen threads, a step back from the 10-core Comet Lake i9 models. Intel says the eight cores ‘maximizes real-world performance,’ but that decision also stems from the backported architecture.
“Backporting” is a method that allows Intel to take a new design built on a smaller process node, in this case 10nm, and etch it on an older, larger node (in this case, 14nm). Intel backported the 10nm Sunny Cove cores found in Ice Lake processors to the less-dense 14nm process to create the Cypress Cove architecture in Rocket Lake, leaving the chip designers with fewer transistors to make the new chips. As a result, Intel had to remove two cores; there simply wasn’t enough room in the chip package for a larger die.
Intel claims that Rocket Lake’s IPC and frequency improvements offset the removal of the two cores, implying the chip will offer the same performance in threaded work as the ten-core 10900K. The company has previously shared that the chips feature a 150W PL1 power rating (at the base frequency), a 25W increase over the 10900K, and an identical 250W PL2 (boost) rating. Intel also says the chips come with new overclocking features that it will explain in the future. We’re pretty sure that includes support for the new sub-ambient coolers from EKWB QuantumX Delta TEC and Cooler Master MasterLiquid ML360 Sub-Zero that Intel helped design to bring exotic cooling to the masses.
The Rocket Lake-S chips are backward compatible with 400-series chipsets, and the PCIe 4.0 connection will work on existing motherboards that support the interface. Most Comet Lake chips are forward-compatible with the new 500-series motherboards that will debut today, the lone exception being Celeron models with 2MB of CPU cache.
Rocket Lake also brings the debut of Intel’s Xe LP graphics for its desktop chips. Intel says it added a ‘third more’ EUs to the chips to boost performance up to 50% over the previous-gen UHD 630 graphics. It isn’t clear if the increased EU count is over the existing UHD 630 graphics, which would mean we’re looking at chips with a maximum of a lackluster 32 EUs, or if it represents an increase over the Tiger Lake chips, which would beef up the Rocket Lake processors with 128 EUs.
We hope it’s the latter, as 32 EUs would hamper gaming performance significantly. On the other hand, doing 128 Xe EUs on 14nm would use up a considerable amount of die space, and most desktop users (at least in the DIY space) will simply use a dedicated GPU anyway. Notably, Intel’s test notes say the margin of error for its performance claim is +/- 15%, so we’ll have to wait for real-world testing. Intel’s Xe graphics also bring in-built AV1 decode acceleration, which is helpful because the codec reduces bandwidth up to 20% for video streaming (such as 4K and 8K content).
Intel also bumped up memory support from DDR4-2933 to DDR4-3200, matching AMD’s Ryzen, and added support for 20 lanes of PCIe 4.0, a needed addition that comes two long years after AMD led the industry with the first PC chips to support the interface. Intel also reworked the internal PCIe subsystem to accommodate the x4 direct connection (the chips now support 20 lanes) for M.2 SSDs to the CPU. Intel also widened the DMI 3.0 connection (the pathway that connects the CPU and chipset) from four lanes to eight, doubling throughput up to a theoretical ~7.86 GB/s.
Rocket Lake’s wider x8 DMI connection is only active on ‘select’ 500-series chipsets, so the chip defaults to a x4 connection on B560 and H510 motherboards. Comet Lake chips also only use a x4 connection on all 500-series motherboards, and the same x4 connection applies for Rocket Lake processors in 400-series motherboards.
Given the socket pinout, it’s doubtful that the widened DMI connection would work when you drop a Rocket Lake chip into a 400-series board, or when you use a Comet Lake processor in a 500-series motherboard, but we’ve followed up with Intel for further information.
The wider DMI connection should help with bottlenecks for devices attached to the chipset, like SSDs in RAID. However, the most recent unofficial information points to PCIe 3.0 support for devices connected to the chipset, and not PCIe 4.0. We do know that the chipset now features an integrated USB 3.2 Gen 2×2 controller, doubling support over the existing interface to 20Gbps.
Intel also demoed the new Hitman 3, an Intel-sponsored title that supports a new feature that tests your CPU and adjusts settings ‘on Intel hardware,’ dialing up features like destruction physics, NPC density and 3D spatial audio through the engine’s ‘brick’ system. As a result, this system turns on automatically for PCs that have a CPU that passes a certain performance threshold.
Intel claims the 11th-Gen Rocket Lake i9-11900K offers up to 7% more performance in Hitman 3 than the 10th-Gen Comet Lake 10900K, but didn’t specify if the performance jump was due to the new features, or if that stems from the natural benefits of Rocket Lake’s higher performance. Hitman 3 comes to market this month.
Oddly, Intel also touted its ‘new’ Always-On QuickSync Video. This feature allows Xe Graphics to run concurrently with a discrete GPU so you can offload some workloads, like video streaming with QuickSync, to alleviate the burden on your discrete GPU. This feature has already been around for several years, but it required BIOS support, and you had to manually enable the integrated graphics unit after you installed a video card. Intel says the technique is now a supported and validated configuration that’s enabled by default in the BIOS.
Rocket Lake also supports Intel’s Deep Learning Boost (DLBoost) and VNNI features, which require support for AVX-512 instructions, to speed up AI workloads. Intel has helped enable the software ecosystem to better take advantage of the explosive performance benefits. Adobe’s recent suite of updates is a prime example of the improvements we can expect as AI becomes more broadly adopted for PC workloads.
Intel hasn’t shared detailed specifications, launch dates, or pricing, though the company did say that it was launching eight new high-performance desktop PC chips. We’ll update as more information becomes available.
As part of the consumer electronics fair CES 2021, AMD and Nvidia are organizing on Tuesday, the 12. January 2021, your keynotes. It starts at German time with AMD’s CEO Lisa Su, followed by Nvidia boss Jensen Huang 18 o’clock.
heise online accompanies both press conferences with one own livestream in which we comment on the event and – as far as possible – classify it. The two editors Alexander Spier and Mark Mantel as well as video man Michael Wieczorek are part of the party.
Start at 16: 45 Clock To shortly before 17 Our livestream begins with the embedded streams from AMD and Nvidia – so you don’t have to open the keynotes separately. Probably by 19 clock both events should be over. If necessary, we take a break between the two events; basically we run these via the same stream URL via YouTube so that you don’t have to switch.
Live commentary from heise online on AMDs and Nvidias CES – 2021 – Keynotes.
AMD should tomorrow the mobile processors of the series Ryzen 5000 H and Ryzen 5000 Announce U alias Cezanne. Also included: Zen 3 computing cores with high single-threading computing power. There could also be an outlook on the mid-range Radeon RX 6700 graphics cards. At Nvidia, mobile graphics chips from the GeForce RTX series 3000 for notebooks should be in focus – Leaks for the mobile GeForce RTX 3080 and GeForce RTX 3070 already existed.
In early October last year, AMD introduced the first Ryzen processors 5000, based on the Zen 3 architecture and intended for personal computers. The company in the CPU industry has been doing better and better since 2017 when it showed and launched the first Ryzenes. Intel is expected to respond to the last generation of AMD processors any day and we will see if it can take the initiative. Recent data shows that there is a lot to do. It seems almost certain that production capacity will be of great importance for the success of both companies. The supply is quite fragile recently, because in the pandemic the demand for ready-made PCs and laptops has increased.
In the last two months of last year revenues from sales of processors in the German store increased significantly.
For years one of the largest computer stores in Germany, Mindfactory, has been famous for the systematic sharing of information about the sales of individual processors. Although this cannot be a reference to the global market, it allows at least to follow trends and what CPU models are popular among individual recipients who assemble or modernize their computers on their own. The year 2020, marked by the SARS pandemic CoV2 was a difficult year for practically everyone in the world, and the following months were unpredictable. aw, as well as in production plans.
Cyberpunk 2077 – Performance test of processors and RAM. AMD Ryzen vs Intel Core duel – How many cores do you need?
Also in the Mindfactory store mentioned above, some changes could be observed, compared to previous years. For example, in December, i.e. in the pre-Christmas shopping period, compared to November, the total sales of processors remained at almost the same level 40 thousands of pieces. One of the reasons for this is that the availability of some processors, both from AMD and Intel, is limited. However, it cannot be ignored that in November there was a huge, more than twofold increase in revenues from the sale of processors, which was influenced not only by the appearance of new models, but above all price increases. In December, revenues increased again, but on a much smaller scale.
In the last month of last year, AMD maintained a huge advantage over Intel. On 40, thousands of processors sold in December 35 thousand were AMD chips, and Intel only about 5 thousand. AMD had a sales share of Mindfactory at the level of 83%. Revenue from sales of AMD processors totaled 12 million euros. Intel, on the other hand, generated revenues of EUR 2 million and took 14% of the sales scale. It is worth noting that both values on the AMD side are six times greater than those of Intel. Last November, AMD’s CPU revenue was five times that of its competitor.
Intel Core i5 – 10400 F vs AMD Ryzen 5 3600 – CPU test for 800 PLN
The most popular in December were AMD Ryzen processors R7 3700 X, Ryzen 5 5600 X and Ryzen 3 3600. It should be emphasized that there is not a single Intel model in the top ten best-selling systems. The first in the ranking “blue” processor, Core i5 – 10400 F, is only just climbing up and in December it reached the twelfth position. Another thing worth noting is that sixteen of the top 20 best-selling processors in December are AMD models.
The consumer electronics fair CES 23 opens today 11. January their virtual gates – this year due to the coronavirus pandemic purely virtual in the form of (live) streams. Some manufacturers have already announced their new products in advance; Now the so-called keynotes follow, which interested parties can follow for themselves thanks to YouTube and Co.
For PC users and gamers, the streams from AMD, Intel and Nvidia will be the most interesting ones taking place this Monday and Tuesday. We will report on the events so that you can read all the news when you get the chance.
Intel Intel’s head of the client division, Gregory Bryant, speaking on 11. January 2021 at 22 Clock German time, among other things via desktop and notebook processors (keyword: Rocket Lake and Tiger Lake). Before, from It At the start, Intel embeds the keynotes on its own newsroom website.
AMD Tuesday afternoon of 12. On January 1st at 15 AMD’s keynote with company boss Lisa Su follows. Interested parties tune in via YouTube. An announcement is expected about AMD’s upcoming mobile processors Ryzen 5000 U and Ryzen 5000 H with Zen 3 architecture alias Cezanne. In addition, there could be a first preview of the mid-range graphics cards Radeon RX 6700.
Nvidia Directly afterwards, i.e. on 12. January at 17 clock German time, starts Nvidia’s stream with CEO Jensen Huang, also via YouTube . The event runs under the motto “Game On” and should focus on the mobile graphics chip series GeForce RTX 3000 for notebooks . Entries in benchmark databases already have an outlook on the mobile GeForce RTX 3080 and GeForce RTX 3070 given.
LG, Microsoft, Samsung and Sony There will be a few more streams running over the next few days, but due to the numerous advance notice, they should only be of limited interest. LG’s keynote, for example, starts today 11. January at 14 o’clock. Messages about LGs 2021 he TVs, including smart TVs with mini LEDs and OLED gaming that can be bent at the push of a button -Displays, as well as the particularly light Gram notebooks are already online.
To 15 o’clock follows an event by Samsung’s television division – here too there was an advance notice. On Thursday the 14. January, a “Galaxy Unpacked” event will take place separately, in which Samsung will launch the next generation of smartphones, the Galaxy S 21.
Samsung’s 2021 Smart TVs introduced.
(Source: Samsung) Sony’s keynote will start tonight of 11. January at 23 o’clock. Sony has already presented the smart TVs for the year 23 in advance. Big news in the gaming environment is not to be expected as the Playstation 5 console has only just appeared. Microsoft is on the afternoon of 13. January at 14, usually with a view of Surface devices.
IVA Computer Hardware Group (via Twitter user HXL) is reportedly selling an engineering sample of AMD’s forthcoming Zen 3 (Cezanne) APUs on Weixin. The seller isn’t absolutely certain of the exact model, but it could be the Ryzen 7 5700G or Ryzen 7 5750G.
A lot of excitement surrounded AMD’s Ryzen 4000 (Renoir) pre-launch as the Zen 2 chips would usher in eight cores to the APU segment. However, the chipmaker broke many hearts when it decided to restrict the sales to OEMs. While you could still pick up a Ryzen 4000 chip on the black market, desktop Renoir pretty much ended up in disappointment. With Ryzen 5000 (Cezanne), AMD might take a different course because, well, it’s Zen 3 in the conversation here.
Ryzen 5000 (or Cezanne as many call it) will come wielding Zen 3 cores, the same ones that have debuted on the Ryzen 5000 (Vermeer) desktop parts. The discrepancy between AMD’s processors and APUs has been around for a while now. It appears that the chipmaker may finally consolidate both product lines under the same branding to avoid any confusion.
While there is a considerable improvement on the processing side, Ryzen 5000 is rumored to retain the Vega graphics engine. A mobile Ryzen 5000 sample from last year alluded to the continued utilization of Vega iGPU, and if accurate, the design should shift over to the desktop variants as well.
AMD Ryzen 7 5700G Specifications
Processor
Cores / Threads
Base / Boost Clocks (GHz)
L2 Cache (MB)
L3 Cache (MB)
TDP (W)
Ryzen 7 5700G
8 / 16
? / 4.4
4
16
65
Ryzen 7 4700G
8 / 16
3.6 / 4.4
4
8
65
Ryzen 7 3700X
8 / 16
3.6 / 4.4
4
32
65
The Ryzen 7 5700G (100-000000263-30) reportedly comes equipped with eight cores and 16 threads. This was expected since the APU lineup recently got upgraded to eight cores, so it’ll be a few more generations before an AMD APU breaks the octa-core threshold. Once again, the Ryzen 7 5700G appears to have 4MB of L2 cache but seemingly sports 16MB of L3 cache (twice that of the Ryzen 4000).
According to the CPU-Z screenshot, the Ryzen 7 5700G clocked up to 4.4GHz (4,441MHz), which we suspect is the boost clock speed. Now, you may think that sounds underwhelming since the Ryzen 7 4700G already boosts up to 4.4 GHz. However, we shouldn’t overlook the fact that the Ryzen 7 5700G is armed with Zen 3, which has very powerful IPC (instruction per cycle) enhancements.
The seller also claimed that he had no problems overclocking the Ryzen 7 5700G to 4.7 GHz with a 1.468V Vcore. However, he didn’t provide any graphical benchmarks since the Ryzen 5000 APUs are unreleased hardware and lack a proper display driver.
Image 1 of 3
AMD Ryzen 7 5700G (Image credit: Weixin)
Image 2 of 3
AMD Ryzen 7 5700G (Image credit: Weixin)
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AMD Ryzen 7 5700G (Image credit: Weixin)
At stock, the Ryzen 7 5700G scored 613.8 points in the CPU-Z single-thread test and 6,296.2 points in the multi-thread test. When overclocked to 4.7 GHz, the scores increased to 647.4 points and 6,960 points, respectively. To be clear, the merchant used DDR4-3000 memory to perform the tests, so the Ryzen 7 5700G’s performance could certainly improve with faster memory.
The Ryzen 7 3700X is a fitting comparison since it’s 65W, and the Ryzen 7 5700G, like AMD’s other APUs, will likely be limited to the same TDP as well. The Ryzen 7 3700X puts up single-and multi-thread scores of 511 points and 5,433 points, respectively. Regarding single-thread workloads, the Ryzen 5 5700G delivered up to 20.1% higher performance than the Ryzen 7 3700X at stock and up to 26.7% when overclocked. For multi-core, we’re looking at margins up to 15.9% at stock and 28.1% with a 4.7 GHz overclock.
It’s very normal to find unreleased hardware for sale in the Chinese market, especially the engineering samples. For the Ryzen 7 5700G, the seller asks for 1,888 yuan (~$291.56), which is bulk pricing. While the listing seems unimportant, it does tell us that Ryzen 5000 has been out in the wild for quite some time, so it shouldn’t surprise us if AMD suddenly drops a bomb on us at, say, CES 2021 next week.
So far, AMD has only presented four processors from the Ryzen series 5000, but we can be sure that soon the Vermeer family will grow significantly. Which models will join the rest first? Will these be the next medium-budget Ryzen 5 or maybe cheap Ryzen 3 for those who are saving? It turns out that the Reds are going to continue to the higher shelf and are preparing slightly lower clocked versions 12 – and 8-core models. The network already features the specification of AMD Ryzen 9 5900 and Ryzen 7 5800 processors, which compared to the models with the letter X available for sale, they will differ slightly with a lower clock speed and a lower demand for electricity.
Although the AMD Ryzen 9 systems 5900 and Ryzen 7 5800 announce an economical option for enthusiasts, unfortunately, there are many indications that these processors will be available for OEM market only.
Rumor: AMD is going to release 16 – Ryzen Threadripper series core processor 5000 Premiere already during CES 2021?
As reported by leakster @momomo_us, AMD Ryzen 9 5900 is 12 – core / 24 – threaded processor equipped with 70 MB cache which will run at a maximum frequency of 4.7 GHz (100 MHz slower by model 5900 X). AMD Ryzen 9 5800 is 8-core / 16 – threaded process or with 36 MB cache with a maximum of 4.6 GHz (100 MHz slower than 5800 X). The TDP coefficient of both these systems is 65 W. Interestingly, we still do not know anything about the 6-core / 12 – threaded Ryzenie 5 5600, which has already appeared in various leaks. It is only said that it will be priced at ~ 220 dollars.
pic.twitter.com/VG65 pMZ6aM
– 188 号 (@momomo_us) January 9 , 2021
Computer Test ACTINA with AMD Ryzen 5 5600 X and Gigabyte GeForce RTX graphics card 3060 Ti Eagle
Although potentially the slightly lower clocked Vermeer models could be a good choice for frugal enthusiasts, unfortunately there are many indications that these processors will be only available for the OEM market. In this case, we will have to count on the fact that only after some time they will be made available to ordinary consumers (such as some Ryzen 5 models from the series 3060 ). So far, we do not know when the Reds will show the models discussed above. AMD will soon focus on the debut of the Cezanne APU models (Ryzen 7 5700 G and Ryzen 5 5600 G) or mobile units based on Zen 3 architecture.
A Chinese site has published some results testing preliminary obtained on a Ryzen 7 APU 5800 U based on Zen 3 architecture. This and other models will be officially announced by AMD la next week at CES 2021.
by Manolo De Agostini published 08 January 2021 , at 17: 41 in the Processors channel AMD RyZen
Tuesday 12 January AMD will announce the new range of Ryzen mobile APU 5000 , both the proposals of the U series for the thinnest laptops and the H solutions for the gaming world. While waiting to have all the details of the case, the Uniko’s Hardware website has published the results obtained from anonymous sources of a laptop (a prototype) based on the new APU Ryzen 7 5800 U , tested with CPU-Z and Cinebench, two tests to broadly understand the breakthrough compared to the Ryzen 4000 based on Zen 2 architecture announced last year.
Ryzen 7 5800 U is based on Zen 3 architecture (codenamed Cezanne-U), the same we saw on board the first Ryzen CPUs 5000 desktop late last year (here and here). As this is a U series CPU, the nominal TDP of this model is 15 / 25 W, unlike the 35 / 45 W of the H series models.
From the point of view of the characteristics, the 5800 U offers 8 cores and 16 threads with a base frequency of 2 GHz and a boost of up to 4.4 GHz (+ 200 MHz with respect to 4800 U). On board there are 16 MB of L3 cache, double than series models 4000, supported by 4 MB of L2 cache. In CPU-Z AMD’s new APU totaled 592 stitches in single-thread and 3812 points in multi-thread: it is the first result to hit because it is higher even than that of the Core i9 – 10900 K (584 points according to the official rankings of CPU-Z).
The multi-thread test is instead very low and seems to be the result of a character problem software, as the Ryzen 7 4800 U scores 4000 points, so it is not possible for the 5800 U to do less. In Cinebench R 20 , the new Ryzen 7 5800 U touches 509 stitches in single-thread and 3614 stitches in multi-thread, while with the new version R 23 is passed respectively to 1311 and 9326 points. For comparison, according to Uniko’s Hardware the Ryzen 4 4800 U on a similarly configured laptop tap 479 stitches in single-thread and 2836 points in Cinebench R 20.
In short, if already the Ryzen 4000 mobile had appeared as finally competitive solutions compared to the Intel range, the Ryzen 5000 are preparing to relaunch thanks to the progress of the Zen 3 architecture and the refinement of the production process to 7 nanometers, especially in terms of single-thread performance. In conclusion, it must be added that based on the rumors that emerged in recent days, not all Ryzen APUs 5000 U will be based on Zen 3 architecture , but there should also be Zen 2 models, a refresh of Renoir solutions called Lucienne. We just have to wait a few days to get a clear and complete picture.
In just five days, the AMD conference will take place, during which Dr. Lisa Su will present the fourth generation of APU for laptops, codenamed Cezanne. We will get new units, both low voltage (Cezanne-U) and full voltage (Cezanne-H). The processors will be characterized by the use of the improved Zen 3 architecture, which in games performs noticeably better compared to Zen 2 (APU Renoir). More information about the upcoming processors has appeared on the web. First of all, one of the Chinese portals published the early performance results of the 8-core AMD Ryzen 9 unit 5900 H. In addition, a diagram showing the location of individual elements of the new Cezanne-H APU has been released to the network.
In the new CPU-Z test, the AMD Ryzen 9 processor 5900 H fares better than AMD Ryzen 7 3800 X. In addition, in the single thread test, the Cezanne-H APU scores comparable to Intel’s Willow Cove architecture.
New test procedure for gaming laptops with Intel Tiger Lake-H, AMD Cezanne-H and NVIDIA GeForce RTX 3000
One Chinese site tested a powerful laptop with an AMD Ryzen 9 processor 5900 H and NVIDIA GeForce RTX graphics card 3000 – the exact model not given, and the test that was released to the network concerns only the processor. AMD Ryzen 9 5900 H is 8-core and 16 – thread representative of the APU Cezanne-H series. The base clock is 3.3 GHz with the possibility of increasing to a maximum of 4.6 or 4.7 GHz. Unlike the Ryzen 9 5900 HX, the CPU discussed here does not have an unlocked multiplier. In the CPU-Z test, the processor achieved 617, 4 points and 6076, 6 points. The tester compared the Cezanne APU results to the AMD Ryzen 7 desktop unit 3700 X, where the mobile APU fared better in both tests.
There was also a test in Cinebench R 20. In the single-thread test, the AMD Ryzen 9 processor 5900 H obtained 584 points – this is noticeably higher than Intel Comet Lake-H processors and in fact comparable to what Intel Tiger Lake-U systems, based on the Willow Cove architecture, offer. In the case of the multi-thread test, the processor scored 5264 points – let me remind you that last year’s AMD Ryzen 9 4900 H fluctuated around 4300 points. Unlike competing Intel Core i7 processor – 10875 H, new AMD Ryzen 9 5900 H is better by an average 17% in single thread test and 22% better in terms of multi-threaded performance. Thus, the new AMD chip will be one of the most efficient notebooks to date.
VideoCardz also revealed the construction of the AMD Cezanne processor, based on Zen 3 cores. We can see that the upcoming APUs will be slightly larger. I am talking about a size around 175 mm². By comparison, the Renoir APU is 156 mm². The larger surface area is mainly due to the noticeably larger Zen 3 cores, which are additionally characterized by twice the L3 cache. We do not expect any changes to the amount of PCIe 3.0 lanes available for the CPU (20 , as in Renoir), in turn, during the AMD conference, we will find out exactly what changes have occurred in the graphics system. It will still be Vega, but we hope it is compatible with all the latest codecs.
Source: VideoCardz
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