G.SKILL released new low latency memory kits for DDR4 – 3600 CL 14 – 15 – 15 – 35 with 64 GB GB (4x 16 GB) and with 32 GB (2x 16 GB). The modules will be available for the Trident Z Neo, Trident Z Royal, Trident Z RGB and Ripjaws V series. These new memory modules will be equipped with Samsung B-Die components. The new low-latency memory offers compatibility with both Intel processors (tested with ASUS ROG MAXIMUS XII HERO (WI-FI) Z 490 and MSI MEG Z 490 GODLIKE motherboards), as well as with the ASUS PRIME X 570 – P, which is 3rd generation AMD Ryzen processors . Generation supported.

Recently, kits were also presented that are compatible with DDR4 – 4000 CL 16 with 32 GB (2x 16 GB) and as DDR4 – 4400 CL 16 with 16 GB (2x 8 GB) but are somewhat slower and have a somewhat smaller capacity.

The new memory kits will also support Intel XMP 2.0 and should enable easy overclocking. The exact availability is not yet known, but a release should take place this quarter. The price is also still unknown, the distribution should go through the usual partners and therefore the memory kits should be available in stores shortly.