Together with the next core generation alias Rocket Lake-S, Intel will also introduce new chipsets, although the new processors will be based on the existing LGA 1200 – Mainboards will run. Maybe Intel will use the digital CES in the coming week to present the new platform. According to current information, the mainboards and processors will not go live until the end of March. In addition to the Z 590 – there will also be an H 570 -, B 560 – and H 510 – Enter chipset.

Videocardz has now released a photo of the Z 570 Aorus Xtreme by Gigabyte, which got a high -End mainboard with Z 590 – chipset is. Apparently, special attention is paid to the power supply, because compared to the Z 490 Aorus Xtreme with already 16 + 1 voltage phases installed Gigabyte on the Z 590 Aorus Xtreme equals 20 + 1 of the power stages. With regard to the TDP, the Rocket Lake S processors should be on par with the current Comet Lake S models. The PL1 for the top models is still at 125 W and the short-term PL2 can reach 250 W. Nevertheless, Gigabyte seems to be concentrating on a drilled-out power supply.

Most of the current LGA 1200 – Mainboards already support PCI-Express 4.0. The mainboard manufacturers have prepared their boards accordingly, even if they have to hide the official support a bit, as Intel does not yet offer this feature with Comet Lake-S. But this will change with Rocket Lake-S at the end of March. With the 500 – Series chipsets, the support of PCI-Express 4.0 is finally put in the foreground.

But there will be other additions for the new mainboards. In the case of the Z 590 Aorus Xtreme from Gigabyte, this is, for example, an ALC 4080 from Realtek as an onboard audio solution. With regard to the network connection, the user can use 2.5 GbE and 10 Use GbE – there is also Wi-Fi 6E. Also on board is Thunderbolt 4.

In terms of price, the Z 590 Aorus Xtreme in the find the top shelf. It is a high-end circuit board with everything that can currently be packed on a mainboard. Large manufacturers like Gigabyte will introduce a handful or more variants of each chipset. So we can expect a veritable flood of new CPU subsets. It remains to be seen whether the manufacturers will present this next week.