Intel plans to create chips with competitive manufacturing processes in its facilities
Source: Geeknetic added 12th Jan 2021
by Antonio Delgado 3 hours ago …
Intel CEO, Bob Swan , has made some striking statements to Toms Hardware where he assures that the company would be open to using his facilities and factories to create chips using a competitor’s manufacturing technology. That would mean using the company’s manufacturing capacity, the only one in the processor industry x 86 which has its own factories, to create processors and chips for themselves or third parties using a technology
Manufacturing chips with third-party technology would represent a surprising change in strategy at Intel
Behind this surprising change of strategy (until recently, anyone who h If this option was raised, it would be crossed out as crazy), it would find the problems that the company has had to get off the 14 nanometers in its high-performance desktop chips , and the lag of its nodes from 7 nm to late 2022 or early 2023. Recall that their initial plans were to have the 7 nm ready in 2018. While the competition has already had a 7 nm node for a long time, despite the fact that at the node size level, the equivalence is not direct as we already mentioned in this article. In fact, it seems that the company is already considering subcontracting the production of part of its chips to third parties.
Beyond the image of possible weakness that could lead to a giant like Intel being forced to outsource part of its production, or considering using its manufacturing capacity For competing nodes, it is still a way to take advantage of their resources and their facilities, so it could be a profitable strategy while they remain in this situation.
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Antonio Delgado
Computer Engineer by training, editor and hardware analyst at Geeknetic since 2011. I love gutting everything that comes my way, especially the latest hardware that we get here for reviews. In my spare time I fiddle with 3d printers, drones and other gadgets. For anything here you have me.