by Jordi Bercial 7 hours ago …

Micron today announced the launch of its uMCP5, the first MCP chip ( Multi Chip Package ) in the industry that combines UFS mass storage memory with LPDDR5 RAM in the same package , being a of the most suitable applications, its installation on smartphones or embedded applications, allowing to manage workloads based on 5G connections with greater energy efficiency and speed.

Thanks to this, in a small package we can integrate up to 128 GB of UFS 3.1 memory, its controller and up to 12 GB of LPDDR5 memory , all configurations being the following: 128 GB of storage to with 8 and 12 GB of RAM, and 256 GB of storage along with 8 and 12 GB of RAM memory.

Among the features of the Micron uMCP5, we have a 20% more energy efficiency in LPDDR5 compared to LPDDR4 , as well as a consumption a 40% lower consumption in UFS 3.1 memories with respect to UFS 2.1. Also, this will bring download speeds a 20% higher , a 66 % longer lifetime and LPDDR5 memory bandwidth of up to 6400 Mb /s.

Last but not least, these uMCP packages can be installed in any application that requires a small set, as the required PCB size has been reduced by 55% compared to discrete solutions.

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Jordi Bercial

Avid enthusiast of technology and electronics . I messed around with computer components almost since I learned to ride. I started working at Geeknetic after winning a contest on their forum for writing hardware articles. Drift, mechanics and photography lover. Don’t be shy and leave a comment on my articles if you have any questions.