Samsung’s latest Chrome OS laptop, the Galaxy Chromebook 2, is now available for purchase at Best Buy. The Chromebook 2 was first announced at CES in January and features a new QLED display, 360-degree hinge, and a striking red paint job. It starts at $549.99 for a Celeron model and goes up to $699.99 for a Core i3 version, putting it at the higher end of Chromebooks.
That price is the most significant thing about the Chromebook 2 because it’s considerably less than the Galaxy Chromebook that debuted a year ago. The older Chromebook had an 4K OLED screen and came with a stylus — neither of which you’ll fine with the new model — but it also cost just under $1,000 when it came out. In our review, we found despite the gorgeous screen and striking paint job, the original Galaxy Chromebook didn’t justify its cost, particularly thanks to abysmal battery life.
Samsung Galaxy Chromebook 2
$550
Prices taken at time of publishing.
The Galaxy Chromebook 2 is Samsung’s flagship Chrome OS laptop for 2021. It has a new QLED screen, either Intel Celeron or Core i3 processors, and comes in a striking red paint job.
$550
at Best Buy
We’ve yet to put the new Chromebook 2 through its paces, but we did get to see the machine in person back in January and it certainly seems like it will be competent. The QLED screen isn’t quite up to the marks of the OLED panel, but you’d be hard-pressed to notice without putting them side-by-side, and the rest of the Chromebook 2’s fit and finish are appropriate for the price Samsung is asking. Importantly, it still comes in that amazing red color, as well. You might notice the extra weight — the Chromebook 2 is about half a pound heavier — but it still falls under three pounds total and should be easily portable.
We will have a full review of the Chromebook 2 in the near future, but if you don’t want to wait and grab one yourself, you might be able to find one in stock at your local Best Buy right now. Let’s just hope Samsung improved the battery life over last time.
With Rocket Lake’s release date approaching, testers are getting their hands on more and more SKUs from Intel’s future Rocket Lake lineup; this time, we have benchmark results of Intel’s future Core i5-11600K (thanks to @Leakbench). The 11600K was found running the Geekbench 5 benchmark with mediocre performance at best, though, as usual, pricing will determine if it lands on our list of Best CPUs.
According to the spec sheet found on Geekbench 5’s browser, the Core i5-11600K packs 6 cores and 12 threads with a 3.9GHz base frequency along with a max turbo frequency of 4.9GHz. Nothing is unusual here; this is where we would expect a 11600K to land. Excluding the rare unlocked Core i3 and Pentium, the unlocked Core i5s have traditionally been the lowest clocked chips out of all the “K” SKUs.
That’s not all that will be slowing down Intel’s 11600K, unfortunately. The system configuration for the 11600K shows it being paired with super-slow DDR4-2133 memory. This will noticeably hamper performance, so take the upcoming benchmark results with another dose of salt — they certainly won’t represent what we’ll see in our CPU benchmark hierarchy when these chips come to market.
Image 1 of 2
(Image credit: Geekbench 5)
Image 2 of 2
(Image credit: Geekbench 5)
In the Geekbench 5 results, the Core i5-11600K scores 1565 points in the single-threaded test and 6220 points in the multi-threaded benchmark. These results are quite underwhelming, especially in the multi-core department where even AMD’s older Ryzen 5 3600 beat the 10600K by 7.6% (or roughly 400 points).
When it comes to single-core performance, the 11600K fares better, but it’s still the slowest CPU out of all known Rocket Lake SKUs and AMD Zen 3 CPUs to date. Luckily, the 11600K does take a major win against Comet Lake-S parts like the 10900K, beating that chip by 11%.
Again though, take these results with a huge grain of salt. Geekbench 5 already has a poor reputation for translating well to real-world results, and adding in slow memory complicates the findings.
The Rocket Lake release is coming soon next month, so hopefully, by that time we’ll have a review sample of the 11600K to test for ourselves and give you an in-depth look into how this chip really performs against our best gaming CPUs.
Intel’s recently announced Core i3 Comet Lake refresh CPUs have already made it to Malaysia, according to a Reddit post. A user shared images of what appear to be two Core i3-10105F CPUs in newly designed product packaging that had apparently arrived at a Malaysian retailer. These chips are presumably being stocked up in preparation for release next month alongside 11th Gen Rocket Lake.
The new refreshed Core i3 lineup will live alongside Intel’s upcoming Rocket Lake Core i5, i7, and i9 based chips looking to upset today’s best gaming CPUs. It’s been reported that Intel won’t include i3 chips in its Rocket Lake lineup, instead refreshing the 10th Gen Comet Lake-S microarchitecture for the Core i3.
The Core i3-10105F shared by the Malaysian store is equipped with four CPU cores, eight threads and a 3.7 GHz boost frequency. We have yet to see its boost frequency and what model of integrated graphics it will offer. However, we’re expecting Intel HD 630 or 610 graphics.
Frankly, this isn’t much of a performance jump compared to the chip’s predecessor, the Core i3-10100F, which comes with a 3.6 GHz base clock. Hopefully, the i3-10105F will get a much higher boost clock to compete against the i3-10100F’s 4.3 GHz.
The launch date for Rocket Lake is March 2021, and we can expect Intel’s Comet Lake refresh to follow that same timeline, especially with evidence of Malaysian stores already stocking up on the new Core i3 models.
Commell has unveiled one of the industry’s first Pico-ITX motherboards featuring Intel’s Tiger Lake-UP3 processor with built-in Iris Xe graphics core. Not designed to compete with the best motherboards for PCs, The tiny LP-179 board is aimed primarily at embedded systems, yet it can enable everyone to build an ultra-compact form-factor (UCFF) desktop featuring a decent quad-core CPU with an advanced GPU.
Commell’s LP-179 motherboard will initially be available with Intel’s Core i7-1185G7E (4C/8T, 1.80/4.40GHz, 12MB cache, 96 EU, 15W) or Celeron 6305E (2C/2T, 1.80GHz, 4MB cache, 48 EU, 15W) processor addressing premium and entry-level markets. The SoC may be accompanied by up to 32GB of DDR4-3200 memory using one SO-DIMM module, an M.2-2280 SSD featuring a PCIe 4.0 x4 interface, and one SATA drive.
The tiny LP-179 — which measures 100×72 mm — has a rather decent connectivity department that includes an M.2-2230 slot for a Bluetooth + Wi-Fi adapter, two GbE ports (2.5 GbE Intel I225-LM, GbE I219-LM), two display outputs (one DisplayPort, one HDMI) and two USB 3.2 Gen 2 Type-A ports. Being aimed at embedded systems, Commell’s internal headers for USB 2.0, RS232, audio (controlled by the Realtek ALC262 chip), SMBus, a battery, and an LVDS or VGA.
(Image credit: Commell)
Motherboards from companies like Commell are rarely available in retail, but it is still possible to get them from stores like Alibaba, usually together with Pico-ITX cases. In addition, LP-179 boards will likely find themselves inside various UCFF PCs from second and third tier makers.
Pricing of Commell’s LP179 motherboards has not been announced.
Parties that need a midrange 11th Generation Core SoC, can opt for Core i5-1145GRE/1145G7E and Core i3-1115GRE/1115G4E, yet these boards will be built-to-order.
HP announced today that it has refreshed its Pavilion x360 line of 14- and 15-inch convertible laptops, making them smaller, lighter, and more geared toward streaming entertainment. The 15-inch version is available today. With an 11th Gen Intel Core i3 processor, 8GB of memory, and 256GB of storage, it starts at $750. The 14-inch version will be available later this spring; no pricing was available.
In view of marketing to “Gen Z” during a streaming-heavy pandemic, HP says it has optimized the new line for entertainment. The bezels have been reduced — something you’ll likely appreciate when watching videos — and HP has included a simplified version of its Omen Gaming Hub, which allows you to customize your keystrokes, lighting, and other features.
The two new Pavilion x360 laptops also have a smaller footprint than before. For example, the 14-inch version has been shrunk down from a width of 221mm to 209mm, and its weight has dropped from 1.61kg (3.5 pounds) to 1.50kg (3.3 pounds).
Other specs include an 11th Gen Intel Core i3/i5/i7 processor, storage up to 1TB, Intel Iris Xe graphics (in the i5 / i7 systems), and optional Wi-Fi 6. HP also is promoting the sustainability of the new computers, claiming they use post-consumer recycled and ocean-bound plastic and recycled aluminum.
The 14-inch Pavilion x360 will come in three colors: “natural silver,” “warm gold” (premium only), and “spruce blue” (non-premium only). The 15-inch version comes in “natural silver.”
AMD’s Ryzen 3000 and Athlon processors (including the unlocked $49 Athlon 3000G) have shaken up the low-cost landscape and made a splash on our CPU Benchmark Hierarchy, but crushing shortages of chips has gripped the industry, which impacts the low end of the market in a particularly painful way. So even though quad-core models with gaming-capable integrated graphics have an MSRP for a mere $100, and the Athlon lineup now dips below 50 bucks (although it’s not always easy to find the 200GE at the moment), supply is short. Intel’s response to AMD’s challenge has brought Hyper-threading to its low-end Pentium processors and two additional cores to the Core i3 line, which greatly improves performance for its budget chips even though they’re still limited in terms of their graphics.
AMD hasn’t released its Ryzen 5000 chips for the low-end yet; the series bottoms out at the Ryzen 5 family. We expect that Ryzen 3 models will come in due course, shaking up our low-end rankings. Intel also has its Rocket Lake processors incoming next month, but these chips will use the refreshed Comet Lake architecture for the Core i3 and below chips, so they probably won’t have much impact on our rankings.
The 200-series AMD chips are surprisingly capable at gaming even without a dedicated card. For more details about how the 200GE stacks up against Intel’s comparable budget chip, see our feature AMD Athlon 200GE vs. Intel Pentium Gold G5400: Cheap CPU Showdown.
For those looking for something with a bit more gaming prowess without having to resort to a dedicated graphics card, AMD’s Ryzen 5 3400G is tough to beat. While the Ryzen 4000 APUs are faster, they’re not readily available and cost a lot more. The 3400G is a solid option but doesn’t offer a big performance boost over previous-generation chips like the Ryzen 5 2400G.
If your budget is a bit more flexible and you’re looking to pair your processor with dedicated graphics for gaming, AMD’s Ryzen 3 3300X is great if you can find it at retail around the MSRP of $120, and Intel’s new Core i5-10600KF is impressive at about twice that amount. But like so many other PC components, both of these processors are hard to find in stock at reasonable prices. Hopefully availability will improve over time, but it probably won’t happen until later in 2021, at which time we’ll have new processors.
When choosing a CPU, consider the following:
You can’t lose with AMD or Intel: Both companies offer good budget chips, and overall CPU performance between comparative parts is closer than it’s been in years. You can see how the chips stack up in our CPU Benchmark Hierarchy. That said, if you’re primarily interested in gaming, Intel’s chips will generally deliver slightly better performance (and consume more power) when paired with a graphics card, while AMD’s Raven Ridge models (like the AMD Ryzen 3 2200G) do a better job of delivering gaming-capable performance at modest settings and resolutions without the need for a graphics card.
Clock speed is more important than core count: Higher clock speeds translate to snappier performance in simple, common tasks such as gaming, while extra cores will help you get through time-consuming workloads faster.
Budget for a full system: Don’t pair a strong CPU with weak storage, RAM and/or graphics.
Overclocking isn’t for everyone, but the ability to squeeze more performance out of a budget offering is enticing. Intel doesn’t have overclocking-capable processors for the sub-$125 market, but AMD’s processors allow for tuning, and in most cases the bundled AMD cooler is sufficient for the task. Automated overclocking features in most motherboards make the process easy, so even the least tech-savvy users can enjoy the benefits.
For even more information, check out our CPU Buyer’s Guide, where we discuss how much you should spend for what you’re looking to do, and when cores matter more than high clock speeds. If you can expand your budget and buy a mainstream or high-end processor, check out our lists of Best CPUs for Gaming and Best CPUs for Applications. Below, you’ll see our favorite budget picks.
The Ryzen 3 3300X unlocks a new level of performance for budget gamers with four cores and eight threads that can push low- to mid-range graphics cards to their fullest. This new processor wields the Zen 2 architecture paired with the 7nm process to push performance to new heights while enabling new features for low-end processors, like access to the speedy PCIe 4.0 interface. The 3300X’s four cores tick at a 3.8 GHz clock rate and boost to 4.3 GHz, providing snappy performance in lightly threaded applications, like games.
AMD includes a bundled Wraith Spire cooler with the processor. Still, you might consider budgeting in a better low-end cooler to unlock the full performance, particularly if you are overclocking. Speaking of which, the Ryzen 3 3300X can overclock to the highest all-core frequencies we’ve seen with a Ryzen 3000-series processor, making it a great chip for enthusiasts. Unlike AMD’s other current-gen Ryzen 3 processors, you’ll need to pair this processor with a discrete GPU, but the low price point leaves extra room in the budget for a more capable graphics card.
You can stick with the value theme and drop this capable chip into existing X470 of B450 motherboards, but you’ll lose access to the PCIe 4.0 interface in exchange for a lower price point. Better yet, AMD will have its new B550 motherboards on offer in June 2020. These new motherboards support the PCIe 4.0 interface but provide lower entry-level pricing that’s a better fit for this class of processor.
When money is tight, being able to game without a graphics card can lead to serious savings. And with RAM prices continuing to soar, those working with small budgets need to tighten the strings anywhere they can.
That makes the four-core, four-thread Ryzen 3 2200G particularly appealing for budget gaming builders and upgraders. The $99 chip delivers solid 720p performance thanks to its Vega on-chip graphics, decent CPU muscle for mainstream tasks, and can be dropped into an existing inexpensive 300-series motherboard (after a requisite BIOS update), to form the basis of a surprisingly capable low-cost PC. It’s also unlocked, so with proper cooling you can tune the graphics or the CPU to best suit your needs.
Overclocking is possible, though officially unsupported
All models provide similar performance after overclocking
Reasons to Avoid
Graphics engine and memory can’t be overclocked
Weak single-threaded performance
AMD’s Athlon 240GE serves as the flagship of the company’s budget lineup, but it still packs a convincing punch for low-end gaming systems. The integrated Radeon Vega 3 graphics facilitate playable frame rates at lower resolutions and quality settings, but the 3.5 GHz base clock is the only differentiating feature between the Athlon 240GE and its counterparts. Due to the unofficial support for overclocking, that means you can tune the Athlon 200GE to the same top performance as the more expensive chips, but at a $20 price savings.
If overclocking isn’t in your plans, the Athlon 240GE is the best budget chip in its price band. Intel’s competing Pentium lineup lacks the graphical horsepower to be serious contenders for the extreme low-end of the budget gaming market, but they are attractive if gaming isn’t your primary goal. That is, of course, if you can find them.
Overclocking is possible, though officially unsupported
All models provide similar performance after overclocking
Reasons to Avoid
Graphics engine and memory can’t be overclocked
Weak single-threaded performance
AMD’s sub-$60 Zen-based Athlon is a good all-around value, thanks to its four computing threads and Vega 3 graphics that are capable of light gaming at lower resolutions and settings. Lightly threaded performance isn’t great, but when you’re spending this little on a CPU, you should expect compromises somewhere. And while it isn’t officially supported by AMD, if you have a compatible motherboard, this chip can be overclocked to eke out some extra CPU performance.
If your build budget can swing it, the $100 Ryzen 3 2200G is a much better chip with more cores and beefier graphics. But if you can only spend $60 or less on your CPU and you aren’t adding a dedicated graphics card, the Athlon 200GE is tough to beat. Intel’s competing Pentiums, the Gold G5400 and G4560, deliver better CPU performance. But they have higher MSRPs, and production shortages have made them hard to find unless you’re willing to spend close to $100 or more, making them incomparable in terms of budget CPUs.
Read: AMD Athlon 200GE Review
Integrated Graphics Gaming Performance
Image 1 of 11
Image 2 of 11
Image 3 of 11
Image 4 of 11
Image 5 of 11
Image 6 of 11
Image 7 of 11
Image 8 of 11
Image 9 of 11
Image 10 of 11
Image 11 of 11
You won’t find many game titles that will play well at the popular 1920X1080 resolution on the sub-$80 chips, but there are a few. As we can see, AMD’s $100 Ryzen 3 2200G is the undisputed king of the hill for 1080p gaming on integrated graphics, but the Athlon chips also push out playable frame rates in a few titles (if you’re willing to tolerate lower graphics quality settings).
Switching over to 1280×720 finds the Athlon processors providing up to 50 FPS at stock settings and experiencing a decent performance boost from overclocking. Remember, all of the Athlon chips will benefit equally from overclocking, meaning the Athlon 200GE and 220GE will achieve the same level of performance as the overclocked Athlon 240GE. That’s an amazing value for these low-cost chips. It should go without saying, but the Ryzen 3 2200G’s Radeon Vega 8 graphics engine blows through the 1280×720 tests with ease.
Intel’s Pentium lineup, and even the Core i3-8100 for that matter, struggle tremendously under the weight of these titles. Gaming at 1920×1080 is a painful experience: You won’t find many games that are playable on Pentium processors at that resolution. Switching over to the 1280×720 resolution brings the Core i3-8100 and Pentium G5600 into acceptable territory, but those chips still can’t match the Athlon’s performance, not to mention the crazy good savings. Intel’s Pentium G5400 is particularly disappointing, though, due to its pared-down UHD Graphics 610 engine. We wouldn’t recommend this processor for gaming on integrated graphics.
But it’s hard to recommend Pentium processors at all right now. Intel is struggling with a shortage of 14nm production capacity, so these chips are extremely hard to find, and when you do find them, they are subject to severe price gouging.
Discrete GPU Gaming Performance
We focus primarily on integrated graphics gaming performance for ultra-budget chips, but these processors are also a great pairing with low-end discrete graphics cards. Below, we’ve tested the chips paired with an Nvidia GeForce GTX 2080 at the 1920×1080 resolution to remove any GPU limitations from our tests below. We tested with an Nvidia GeForce 1080 FE graphics card to remove graphics-imposed bottlenecks, but the difference between the processors will shrink with the cheaper graphics cards that are commonly found in budget builds. Provided the performance deltas are small, you can select less expensive models and enjoy nearly the same gaming experience with graphics cards on the lower-end of the GPU benchmarks hierarchy.
Image 1 of 11
Image 2 of 11
Image 3 of 11
Image 4 of 11
Image 5 of 11
Image 6 of 11
Image 7 of 11
Image 8 of 11
Image 9 of 11
Image 10 of 11
Image 11 of 11
Intel’s Coffee Lake Pentium models come with slight frequency improvements, a 3W increase in the TDP rating, and 4MB of L3 cache. These slight adjustments deliver a surprising boost to performance compared to the previous-gen Kaby Lake models. The Coffee Lake Pentium Gold G5600 even beats out the Kaby Lake Core i3-7100 in most of our gaming benchmarks, highlighting the impressive performance gains Intel made within a single generation.
The G5600 grapples with the Ryzen 3 2200G. The Ryzen 3 2200G is relatively simple to overclock with single-click options in the BIOS, and the bundled cooler provides enough headroom for all but the most extreme overclocking efforts. At stock settings, the 2200G trails the Intel Pentium Gold 5600, but the advantage of AMD’s unlocked multipliers is clear: At $99, the tuned Ryzen 3 2200G’s performance nearly matches the $117 Core i3-8100.
The Ryzen 3 2200G also comes with powerful integrated graphics that provide surprisingly strong gaming performance at lower resolutions and quality settings. That’s a feat the Core i3-8100 simply cannot match. If you’re seeking the absolute best gaming performance (when paired with a dedicated card) regardless of price, the Core i3-8100 fits the bill. If you want the most bang for your buck or plan on gaming on integrated graphics, the Ryzen 3 2200G is the clear value winner.
Productivity Performance
Image 1 of 22
Image 2 of 22
Image 3 of 22
Image 4 of 22
Image 5 of 22
Image 6 of 22
Image 7 of 22
Image 8 of 22
Image 9 of 22
Image 10 of 22
Image 11 of 22
Image 12 of 22
Image 13 of 22
Image 14 of 22
Image 15 of 22
Image 16 of 22
Image 17 of 22
Image 18 of 22
Image 19 of 22
Image 20 of 22
Image 21 of 22
Image 22 of 22
The Core i3-8100’s solid mixture of frequency and IPC throughput delivered to our expectations. The agile processor took the lead in several of our lightly-threaded applications, like the Adobe Cloud suite, but it is also surprisingly powerful in threaded workloads. The Intel Core i3-8100 also offers superior performance in applications that use AVX instructions, like HandBrake, which is a great addition to its impressively well-balanced repertoire. Much like we observed in our gaming tests, the Core i3-8100 offers the best overall performance.
Even after overclocking, the AMD Ryzen 3 1300X isn’t competitive enough with the Core i3-8100 to justify its higher price tag, and the lack of integrated graphics also restricts its appeal.
The Ryzen 3 2200G continues to impress with its lower price point and competitive performance, not to mention the integrated Vega graphics, making it the obvious choice for budget builders who are willing to spend a little extra time on tuning.
The Pentium lineup excels in most applications, but the Athlon processors also offer an impressive level of performance. It’s also noteworthy that Intel’s Pentium processors don’t accelerate AVX instructions, a staple in many types of rendering applications, while the Athlon processors fully support the densely-packed instructions. Intel’s chips lead in lightly-threaded applications, like web browsers, but the competing AMD chips also offer more than suitable performance in those workloads.
Nehalem was the codename for one of Intel’s most successful processor families in recent history. and that gave rise to the current name and classification of the company’s processors “Core i3, Core i5 and Core i7”. Launched at the end of 2008, under this architecture came models as famous as that mythical Intel Core i7 – 920 what good times did overclock lovers go through.
One of the architects of that architecture was Glenn Hinton, an engineer who worked for 35 years at the microprocessor giant until his retirement in the year 2017. Now, however, has decided to come back to work on a new project for a new high-performance CPU.
A new CPU project of high performance, and the new CEO of Intel are the reasons why he returns to the company
Glenn Hilton himself explains the reasons on his LinkedIn that prompted him to come back, reasons that basically boil down to having Pat Gelsinger as the new CEO of Intel, and the new high-performance CPU project that he will work on.
After enjoying my retirement for 3 years, I have decided to return to work at Intel (where I previously worked for 35 years). What prompted me to do something like that? I will be working on an exciting high performance CPU project. Plus, having Pat Gelsinger as CEO also helped me make up my mind to come back. “
End of Article. Tell us something in the Comments or come to our Forum!
Antonio Delgado 10980
Computer Engineer by training , writer and hardware analyst at Geeknetic since . new hardware that we receive here for reviews. In my free time I fiddle with 3d printers, drones and other gadgets. For anything, here you have me.
Demand for client PCs, consumer electronics, servers, and other high-tech equipment is driving sales of various processors and in the recent quarters semiconductor supply chain has failed to meet demand for chips. Not only do foundries not have enough capacity to build silicon for their clients, but lead times at packaging houses have also increased significantly. Based on media reports, issues with chip packaging will affect supplies of client CPUs and GPUs as well as various consumer-grade electronics throughout the whole year.
Different chips use different types of packaging. Small integrated circuits (ICs) that do not require a complex power supply and do not need many input/output pins tend to use cheap wirebond packages. More complex devices use leadframe packages (quad flat packages (QFP), quad/dual flat no-lead packages (QFN/DFN), thin small outline profile packages (TSOP), etc.), which are generally wirebond packages encapsulated into plastic or other types of mold for added rigidity and reliability.
Chips that use many power and I/O pins — such as CPUs, GPUs, and SoCs — typically use laminated flip chip ball grid array (FC-BGA) packages that provide fine pitches, low inductance, ease of surface mounting, and excellent reliability among other things. Meanwhile, there are BGAs that continue to rely on wirebonding and there are BGAs that use flip chip packaging.
Insufficient Wirebonding Capacities
Wirebonding packages are used by such popular commodity chips as display driver ICs as well as TDDI (touch with display driver integration) chip solutions. Insufficient supplies of DDICs as well as TDDIs affected shipments of monitors and notebooks last year, as some PC makers complained back in the fourth quarter.
(Image credit: Henkel Adhesives)
By now, OSAT (outsourced assembly and test) houses like ASE Technology (the world’s No. 1 chip packaging company), Greatek Electronics, and Lingsen Precision Industries have stretched their lead times for wirebonding packages to two, three, or even more months because of insufficient capacities, reports DigiTimes. OSAT companies did not comment on the news story.
Adding equipment for wirebonding is a relatively straightforward task, but because of high demand manufacturers of such tools, namely Kulicke & Soffa as well as ASM Pacific Technology, have increased their delivery lead times up to nine months. Meanwhile, Advantest, which makes test equipment for DDICs and TDDIs, has also extended its lead times to over six months.
Without sufficient wirebonding capacities, at least some display and PC makers will continue to suffer from shortages of various crucial components, such as display driver ICs, for at least two quarters. Alternatively, they will have to find additional sources of components, or their suppliers will have to find alternative assemble and test partners. In both cases, the actions will take time.
Not Enough ABF Substrates
(Image credit: ASE Group)
Laminated packages are used by a wide variety of semiconductors ranging from cheap SoCs for client PCs all the way to complex high-end CPUs for servers and 5G equipment. Chips that use laminated packaging often use IC substrates featuring insulating Ajinomoto build-up film (ABF), which are made by only one company, Ajinomoto Fine-Techno Co. Apparently, some suppliers of ABF substrates experience yield issues with their products.
Yield rate for ABF substrate production at Taiwan-based suppliers Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology is now about 70% or lower for high-end offerings, according to DigiTimes. The companies are trying to gradually expand production, but they will only be able to boost it by around 10% from 2021 to 2022, the report says.
In particular, Unimicron is reportedly considering repurposing one of its damaged production facilities to make ABF substrates, but the plan has not been finalized, so it unlikely that the new factory will go online earlier that at least a year from now. Neither of the companies has confirmed or denied the story. To a large degree such a small increase is a consequence of the fact that delivery lead time for ABF substrates manufacturing tools are now at now are four to three quarters, the article claims.
Since demand for advanced chips is increasing across the board, processor developers naturally give priority to higher-end products, such as those for supercomputers, datacenters, servers, and advanced client PCs. ABF substrates suppliers have to satisfy demands of their customers, which is why they naturally give priority to higher-end substrates in their production too. As a result of shifting priorities of both chipmakers and substrate suppliers, capacities for entry-level and midrange processors for laptops are shrinking, which creates further shortages on the market.
Not a Catastrophe?
It is not the first time in recent memory when the industry experienced shortages of crucial components.
(Image credit: ASE Group)
In recent years, the industry also faced a tight supply of Intel CPUs as the company could not meet demand for parts produced using its 14 nm fabrication process. The company naturally prioritized supply of its higher-end Xeon Scalable as well as Core i5/i7/i9 processors over entry-level Core i3, Pentium, or SoCs for midrange and low-end PCs. While PC makers were not exactly happy with undersupplies, they did not really struggle. This time around, the situation is different as companies like Dell or HP cannot get enough a variety of components.
Insufficient packaging capacities at some manufacturers and assembly and test services create a tight supply of ABF substrates and an unpleasant situation for the industry. Yet, it is not unfixable.
Increased delivery lead times for equipment makers indicate that there are companies, which have acquired necessary tools and which will obtain them earlier than others. These companies will use this equipment to assemble and test chips, which will reduce load on other OSAT providers. Alternatively, integrated device manufacturers (IDMs) could at least produce chips needed by the industry.
In either case, high demand for PCs, electronics, servers, and other types of equipment means higher prices, so for the next couple of quarters many products will continue to cost more than their MSRP.
The holidays are getting closer, the holidays are getting closer … Maybe not just such traditional holidays, but slowly a great event for equipment enthusiasts is approaching, because on the horizon there are already Intel Rocket Lake processors (Core 11 Gen ). In turn, the recent debut of AMD Ryzen processors 5000 meant that I decided to refresh the test procedure a bit before this duel – new programs will come, some old ones will fall computer games and their place will be taken by newer titles. Oh, a classic update, but as always there are a few dilemmas and one concerns the choice of DDR4 memory. Before I make the final decision, I would like to hear your opinion on what should be included in the test platform.
RAM memory is an important component of any test platform, especially in the case of processors, so they must be chosen carefully so as not to complicate the interpretation of results.
There is one goal and there are four balls, so read carefully and think about the possible scenarios I have analyzed briefly, because some dependencies come out only after a few (a dozen) tests and could escape with purely theoretical considerations. The survey is posted at the bottom of the page, open until the end of February, then I start with the processor tests and complaints will not be considered.However, it will be a valuable tip, as you see the issue of selecting components for hardware platforms. Honestly, a much bigger problem than choosing DDR4 memory turns out to There is a choice of computer games that use more than a modest six cores . Although in recent years we have had a real festival “winyj rdzyniuf”, the developers have not yet adapted their engines to the capabilities of modern equipment, which results in a waste of its potential. Moving to the newer API (Vulkan / DirectX 12 has also flipped some calculations from the CPU to the graphics chip, which further complicates the situation. Apart from a few titles, there is simply nothing to test for multi-threading …
DDR4 clock speed for all processors would be 3200 MHz, representing the group of the most frequently chosen modules with the widest availability (you can check it on the skinflint), and at the same time corresponding to the fastest controllers officially used in processors. DDR4 kits – 3200 with various latencies are standard nowadays for all platforms that do not have rigid restrictions in the above scope, e.g. through the motherboard, therefore such settings seem to be the most universal. there would be additional tests of ed The performance of processors with slower modules, which will ultimately hit platforms with top-down blockades (e.g. Intel Core i3 – 10100 and DDR4 – 2666 on H 410). Similarly, additional performance tests would be performed with faster modules for processors, which allow the use of high-clocked DDR4 without major problems and additional costs (surcharges to the motherboard).
Option 2 – DDR4 settings depending on CPU controller
Timing DDR4 memory would be selected based on the official maximum supported by the controller installed in the processor. For example, AMD Ryzen 7 5800 X would work with DDR4 modules – 3200, while Intel Core i7 – 10700 K would get DDR4 – 2933, because such parameters were selected by manufacturers using the JEDEC guidelines. Rigid adherence to the specifications, at least theoretically, guarantees the highest stability, but does not take into account the full potential of the platform and causes the so-called the advantage of distorting the results. Why? Since the DDR4 memory clock significantly affects the performance of processors, therefore, by introducing a variable, even directly resulting from the specifications of the controllers, we distort the measurement methodology in the assumptions aimed at unifying the conditions for all tested components.
Option 3 – DDR4 Settings 3600 MHz
DDR4 memory clock for all processors would be 3600 MHz, responding to the so-called sweet spot – a frequency that provides a noticeable increase in performance over DDR4 – 3200, although the sets with the selected timing do not yet belong to the most expensive ones, and most of the DDR4 – 3200 can achieve such MHz (the issue of timings remains open). Oh, DDR4 memory overclocking is possible on most modules without any special knowledge and regulating delays further. However, there is a risk that some older platforms and / or processors may be unable to work stably with these settings (AMD AM4 and Ryzen series models 5000 ). In addition, the base results for Intel processors, paired with boards that prevent the installation of faster DDR4, will be really badly shot. Therefore, additional tests with lower divisors will be necessary (e.g.: 2666 MHz), nevertheless high output settings will no longer have higher dividers.
Option 4 – How much did the factory give (well almost)
The DDR4 memory clock would be adapted to the capabilities of the controller in the processor, the capabilities of the platform and the modules themselves. For example – AMD Ryzen 3000 and 5000 could work with DDR4 clock speed – 3800 in synchronous mode (asynchronous allows higher frequency, but at the expense of performance), while Intel Core 6 – 10 generation 4200 – 4400 MHz depending on timings. Here it was also advisable to calibrate the first, second and third order lags, that is, higher driving school. The problem is the inability to find a golden mean for the AMD and Intel platforms, as the memory controllers work very differently in both cases. It also introduces additional variables that affect performance scores. Besides, such results strongly distort the average, because most users limit the interference with the memory parameters to enable the XMP profile.
Survey – What DDR4 memory would you see in the CPU test routine?
The freshly baked new Intel boss does not want to be stolen from the bread in Apple’s processor business. In an address to employees reported by the Oregonian local newspaper in the US state, Patrick P. Gelsinger said his company had to deliver “better products” to the PC ecosystem as “every possible thing a lifestyle company from Cupertino could deliver”. “We must be so good in the future.”
Apple Silicon rushes ahead The slightly condescending formulation naturally refers to the Mac manufacturer, which started with its first desktop and notebook processor ARM-Basis, the M1, had caused a stir in the IT scene – both with its performance and with its diverse possibilities. For example, Intel code sometimes runs faster on ARM Macs than on Pentiums via the Rosetta 2 translation software. In addition, the M1 is very energy-efficient and develops comparatively little heat – so the MacBook Air with Apple Silicon works completely without a fan.
Apple was not quite 15 years ago in the Intel universe switched to its own processors, as they are already in the iPhone and iPad. This switch could be completely finished by 2022, various other models with Apple Silicon are expected this year. Intel currently has nothing to counter this, as industry observers believe.
“The best times are still ahead of Intel” Gelsinger will soon inherit his predecessor Bob Swan. Only then should new central decisions be made. The manager who is currently in charge of VMware is not a newcomer to Intel – until 2009 he worked for the chip giant for a good three decades and was chief among other things Technology Officer. In his opinion, Intel has “the best of days ahead”. The group has already taken the first steps towards changes under Swan.
So he began to issue the production of high-quality CPUs to contract manufacturers for the first time. Apple has been pursuing this strategy from the start – all Apple silicon products currently come from TSMC’s Taiwanese fabs, previously also from Samsung. Oddly enough, Intel is now also using the services of TSMC – Core i3 chips with a structure width of 5 nm are initially produced there, and later top CPUs in 3 nm production are also manufactured. It is unclear whether this is sufficient to stand up to the increasingly powerful ARM chips. (bsc)
2Compute, a retailer over in Belgium, recently added Intel’s approaching 11th Generation Rocket Lake-S processors to its product catalog. The store has reportedly revealed the basic specifications and pricing for the 14nm chips. As is customary, we recommend approaching listings about unreleased hardware with caution, even if the listings come from a trusted retailer. It’s also important to highlight that computer hardware is typically more expensive outside the U.S.
As evidenced by the F-series, Intel will continue to offer iGPU-less models for this generation. In the case of Rocket Lake-S, the processors arrive without the 12th-generation Xe LP graphics engine. Logically, the F-series and KF-series SKUs will cost less than their counterparts due to the lack of an iGPU. If 2Compute’s pricing is even close to Intel’s official MSRP, we could be looking at a price difference up to $29.
Rocket Lake-S debuts with the Sunny Cove microarchitecture and maxes out at eight cores. Therefore, it’s not really fair to compare it to Comet Lake-S, which is based on the aging Skylake microarchitecture and wields up to 10 cores. However, with every new generation, consumers logically want to know how much they’re paying for new technology.
Intel 11th Generation Rocket Lake-S Pricing
Processor
Pricing (Excl. VAT)
Cores / Threads
Base Clock (GHz)
L3 Cache (MB)
Part Number
Core i9-11900K
$604
8 / 16
3.5
16
BX8070811900K
Core i9-11900KF
$575
8 / 16
3.5
16
BX8070811900KF
Core i9-11900
$493
8 / 16
2.5
16
BX8070811900
Core i9-11900F
$464
8 / 16
2.5
16
BX8070811900F
Core i7-11700K
$455
8 / 16
3.6
16
BX8070811700K
Core i7-11700KF
$426
8 / 16
3.6
16
BX8070811700KF
Core i7-11700
$370
8 / 16
2.5
16
BX8070811700
Core i7-11700F
$341
8 / 16
2.5
16
BX8070811700F
Core i5-11600K
$293
6 / 12
3.9
12
BX8070811600K
Core i5-11600KF
$265
6 / 12
3.9
12
BX8070811600KF
Core i5-11600
$250
6 / 12
2.8
12
BX8070811600
Core i5-11500
$227
6 / 12
2.7
12
BX8070811500
Core i5-11400
$205
6 / 12
2.6
12
BX8070811400
Core i5-11400F
$176
6 / 12
2.6
12
BX8070811400F
We’ll use 2Compute’s Comet Lake-S pricing as a reference for an apples-to-apples comparison to Rocket Lake-S. In the interest of keeping it simple, we only compared the three principal K-series models from both processor families.
2Compute sells the Core i9-10900K, Core i7-10700K and Core i5-10600K for $555, $398 and $282, respectively. Therefore, the Core i9-11900K and Core i7-11700K could cost up to 8.8% and 14.3% more, respectively, while the Core i5-11600K may arrive with a 3.9% higher price tag.
Intel 11th Generation Comet Lake Refresh Pricing
Processor
Pricing (Excl. VAT)
Cores / Threads
Base Clock (GHz)
L3 Cache (MB)
Part Number
Core i3-10305
$172
4 / 8
3.8
8
BX8070110305
Core i3-10105
$140
4 / 8
3.7
6
BX8070110105
Core i3-10105F
$94
4 / 8
3.7
6
BX8070110105F
Pentium G6605
$109
2 / 4
4.3
4
BX80701G6605
Pentium G6405
$79
2 / 4
4.1
4
BX80701G6405
So far, rumors have pointed to Intel refreshing its Comet Lake processors for Core i3 and below SKUs. If you’re after PCIe 4.0, you’ll ultimately have to look at the Core i5 and above models. In terms of Comet Lake Refresh, the recipe will be the same except that the reheated chips will come flaunting improve clock speeds.
The Core i3-10300 and Core i3-10100 are available at 2Compute for $161 and $134, respectively. The rewarmed versions are seemingly 6.8% and 4.5% more expensive, respectively.
Although we can’t speak for all models, Rocket Lake-S may cost up to 14% more expensive than Comet Lake-S. Of course, Intel has promised IPC gains up to 19%, and there’s also the matter of PCIe 4.0 support. However, we have to be aware that Rocket Lake-S is most likely the last wave of processors to pass through the LGA1200 socket so an upgrade right now does require a bit of meditation.
With the Fanless Chromebox, ASUS wants to appeal to users who are looking for a silent Chromebox. ASUS uses an aluminum housing with cooling fins for this. In combination with the two W-LAN antennas, the flat Fanless Chromebox has such a design that you could mistake it for a router at first glance.
ASUS installed inside an Intel Core processor of the 10. Generation or a Celeron processor. Specifically, there are three models to choose from: Intel Celeron 5205 U, Core i3 – 10110 U or Intel Core i7 – 10510 U. The latter model is an economical quad-core SoC based on the Comet Lake architecture. The integrated Intel HD Graphics serves as the GPU. With one exception, the selectable CPUs are congruent with those that are also offered for the ASUS Chromebox 4. In the compact Chromebox 4, however, ASUS uses a fan. For the Fanless Chromebox 4 or 8 GB RAM and 10 or 64 GB eMMC storage or a 128 GB M.2 SSD can be configured.
On 207 x 148 x 32 mm (W x D x H) large housing of the 1.2 kg fanless Chromebox shows numerous connections, including five USB Type-A, once USB Type-C, two HDMIs and a network socket. A microSD card reader can also be used. The Fanless Chromebox supports Wi-Fi 6 and Bluetooth 5.0. With its VESA attachment, it can be attached to the back of suitable monitors. A Kensington lock can be used for simple theft protection. ASUS lists both a 65 – and a 90 – watt Power adapter.
Various sources report on a US launch in February and a starting price of 399 dollars. According to Computerbase, the Fanless Chromebox in Germany will initially only be sold to bulk buyers and not to end customers.
In recent years, Intel’s strategy regarding its different chipsets for each new generation of processors it was based on separating by ranges, allowing memory and CPU overclock functions only to motherboards with Z series chipsets. In this way, if we had a board with H or B chipset, no matter how much we had a K series processor with an unlocked multiplier, it would not be possible to increase its speed or that of its memories .
That changes from now on, and the company has activated the possibility of overclocking, at least of the DDR4 memories , on their new chipsets H 570 and B 560 for undéci Intel Core processors 3rd generation “Rocket Lake-S” , of which we were able to learn some details at this CES 2021.
Intel joins AMD by allowing memory overclocking on its mid-range chipsets, although the processor OC will only work on the Z 590
It is about for the first time in a long time that it is possible to overclock memory on chipsets that do not belong to the Z line. Unfortunately, the possibility of overclocking the speeds of the different Processor cores will remain exclusive to the Z chipset 590. .
Of course, it will be necessary to use Core i5 or higher range processors, including Core i7 and Core i9, to be able to use memories above 3. 200 MHz DDR4. Core i3 processors will stay with support for DDR4 – 2667 MHz.
End of Article. Tell us something in the Comments or come to our Forum!
Antonio Delgado
Computer Engineer by training, editor and hardware analyst at Geeknetic since 2011. I love gutting everything that comes my way, especially the latest hardware that we get here for reviews. In my spare time I fiddle with 3d printers, drones and other gadgets. For anything here you have me.
Asus simply calls its new Chrome OS computer a fanless Chromebox, which works completely without a fan. It is intended for use in industry and retail, which is why, according to the manufacturer, a robust aluminum housing protects it.
The Asus Chromebox can be used with two and four core processors from Intel 10. Configure the core generation alias Comet Lake-U, specifically with Celeron 5205 U, Core i3 – 10110 U, Core i5 – 10210 U or Core i7 – 10510 U. The former limits the Chromebox to 8 GB of RAM, the Core-i models receive up to 16 GB of RAM .
When it comes to mass storage, the user also has several options: he can use the Celeron computer with an eMMC module with a capacity of up to 64 GByte equip, alternatively stand for all variants 128 or 256 GByte M.2 SSDs ready.
RS – 232 directly ex works Gigabit Ethernet is also on board for connection to the network, and Intel’s Wi-Fi 6 module (WLAN 802. 11 ax) AX 201 – including Bluetooth 5.0 – responsible. The systems offer ports for peripherals, including USB 3.2 Gen 1 (5 GBit / s) Type-A, HDMI 2.0 and RS – 232.
The package includes a VESA adapter and a cable lock. In the USA, the Fanless Chromebox should appear in February 2021 and at least 399 cost US dollars. Asus has not yet given any information about the publication in Germany and the price. ) (fo)
Intel has updated its NUC series. This includes the Phantom Canyon models with dedicated graphics, but also the Tiger Canyon business solution, the simple home user solution Panther Canyon and finally the compute element intended for the industrial sector.
Overall equips Intel 44 NUC models with the new Tiger Lake processors, which differ in terms of the platform as such, or are simply equipped with different processors. Intel offers models that are already equipped with SSD and RAM, but also barebones, in which only the processor is located and the rest of the equipment has to be done by the user.
The NUC based of the Panther Canyon design, Intel packs a case with dimensions of 117 x 112 mm. Depending on the model, the height is 38, 51 or 56 mm. Intel packs either a Core i3 – 100 G4, Core i5- 1135 G7 or Core i7 – 1165 G7. Via two SO-DIMMs up to 58 GB DDR4 – 3200 can be installed. Depending on the height, a 2.5-inch hard drive can be installed in addition to an M.2 SSD. Three Thunderbolt 3 and three USB 3.2 Gen 2 are available for connecting peripherals. The integrated graphics unit is output via HDMI 2.0 and DisplayPort 1.4. Wireless charging with W possible.
NUCs based on the Tiger Canyon design are for business applications provided and therefore use the vPro variants of the Tiger Lake processors. In particular, these are the Core i3 – 1115 G4, Core i5 – 1135 G7, Core i5 – 1145 G7, Core i7 – 1165 G7 and Core i7 – 1185 G7. The integrated graphics unit is used exclusively here. For this, the user gets at least one of the Thunderbolt connections Thunderbolt 4 – Panther Canyon is artificially cropped to that effect.
The Phantom Canyon (NUC 08 Enthusiast) replaces the Hades Canyon, its core processor with Radeon-RX -Vega-M graphics will probably remain a unique collaboration between Intel and AMD. A Core i7 – 1145 G7 with four cores is always installed in the Phantom Canyon. In contrast to all other NUC 11 Intel installs a dedicated graphics card here. It is a GeForce RTX 2017 with 6 GB of graphics memory. Intel’s timing is a bit unfortunate here, because NVIDIA will launch the GeForce RTX 3060 at the end of February, which would certainly have offered better performance.
Additional features include two Thunderbolt 4 and five USB 3.2 Gen 2 as well as a display output via HDMI 2.0a and DisplayPort 1.4. There is also a card reader on the front.
It is currently unclear whether there will be another NUC Extreme (Intel NUC 9 Extreme in the test). It is also open from when and at what price the NUC – 11 – Series will be available.
We use cookies on our website to give you the most relevant experience. By clicking “Accept”, you consent to the use of ALL the cookies.
This website uses cookies to improve your experience while you navigate through the website. Out of these, the cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. We also use third-party cookies that help us analyze and understand how you use this website. These cookies will be stored in your browser only with your consent. You also have the option to opt-out of these cookies. But opting out of some of these cookies may affect your browsing experience.
Necessary cookies are absolutely essential for the website to function properly. This category only includes cookies that ensures basic functionalities and security features of the website. These cookies do not store any personal information.
Any cookies that may not be particularly necessary for the website to function and is used specifically to collect user personal data via analytics, ads, other embedded contents are termed as non-necessary cookies. It is mandatory to procure user consent prior to running these cookies on your website.
