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At the end of the year, Acer plans to release some notebooks that apart from Intel processors of the eleventh Core-i generation each have their own special features: The Convertible Spin 3 (2020) has a screen in 16 : 10 – format, the Spin 5 (2020) with 3: 2 touchscreen weighs only 1.2 kilograms. The TravelMate (Spin) P4 goes online with an integrated LTE modem, the Book RS was designed by Porsche Design.

Spin 3 & 5 For the 2020 generation of the 2-in-1 device Spin 3, Acer opted for a pen-operated 13, 3-inch touchscreen in the 16: 10 – Format (2560 × 1600 pixels), which means that more image height is available for office work and more page width is available in tablet mode. The pen supplied disappears into the housing and is also charged there. Two Thunderbolt 4 sockets are available for fast peripherals, the WLAN module transmits according to Wi-Fi 6. The Spin 3 (2020) is due in January 2021 and cost from 1000 Euro.

The sister model Spin 5 (2020) also has 360 – Degree hinges, should be in stores before Christmas and off 1100 cost euros. It not only attracts attention with its low weight of 1.2 kilograms and a 14 flat housing, but also with a 3: 2 screen. Thunderbolt 4 is also on board here.

TravelMate (Spin) P4 The approximately one and a half kilos heavy 13 – Zöller TravelMate P4 is available under this name as a normal notebook matt screen and the TravelMate Spin P4 in a variant with 360 hinges and a pen-operated touchscreen. Both screen variants use the narrow 16: 9 format and come with an internal LTE modem on request.

Wi-Fi 6 WLAN and Thunderbolt 4 are both on board; the Windows Hello compatible webcam can be covered with a slider. The TravelMate P4 starts in December from 880 Euro, the spin version costs from 1000 Euro. In the maximum configuration, 32 GByte working

Acer has introduced the Swift 3x to accompany the 1920 version of the Swift 3 . Both notebooks use Intel’s Core-i processors of the 11 . Generation alias Tiger Lake-U, the manufacturer also equips the Swift 3x with Intel’s DG1 graphics chip. It is similar to the integrated graphics unit of the processor, but comes with fast GDDR6 RAM. Brand name: Iris Xe Max.

The additional GPU is noticeable in a direct comparison on the case: According to Acer, the Swift 3x is almost 2 mm thicker than the previous generation and weighs in around 1.3 kg additional 170 grams. Since the GPU has its own energy budget including the associated cooling, the CPU cores should achieve a higher turbo speed under load.

The Iris Xe Max replaces Nvidia’s entry-level graphics chip GeForce MX 350, which Acer last year in the more expensive Swift-3 Models built. Nvidia announced the successor GeForce MX 350 in August 2020, but did not mention any specifications so far – Notebooks with MX 450 does not yet exist.

Acer Swift 3x (4 images) (Image: Acer) Thunderbolt 4 As usual with upper class notebooks with Tiger Lake processors, there is a Thunderbolt 4 connection in the form of a USB-C port on board. The remaining connections fall with two USB 3.2 Gen 2 Type A (10 Gbit / s), once HDMI and audio jack are manageable. The Swift 3x can wirelessly connect to Wi-Fi 6 networks (WLAN 802. 11 ax) connect and transmit via Bluetooth 5.0.

The 11 inch IPS display solves with 1920 × 1080 pixels (Full HD) and covers the NTSC color space to 72 percent. The battery should last for runtimes of up to 17, 5 hours .

Acer wants to bring the Swift 3x on the market at the end of November – so Intel would have to present the Iris Xe Max beforehand. The basic configuration with the four-core Core i5 – 1080 G7, Iris Xe Max, 8 GByte LPDDR4X-RAM and 512 GByte capital S

(Pocket-lint) – Now here’s a collaboration we didn’t expect to see: Acer has teamed up with Porsche Design to make a laptop with a little extra ‘vroom vroom’, in the Porsche Design Acer Book RS.

The German design company has dabbled with tech brands in the past – most notably Huawei, with its RS versions of the Chinese company’s phones – and now it’s turning its hand to laptops.

So what’s special about the Acer Book RS and does that Porsche Design label mean it’ll cost you a small fortune?

Design

Diamond-cut CNC machined 3k carbon fibre cover and silver-colour all-metal chassis
Screen: 14-inch Full HD IPS touchscreen, 90% screen-to-body ratio
Unibody hinge elevates backlit keyboard upon opening
Glass precision touchpad with fingerprint scanner
Thickness: 15.99mm / Weight: 1.25kg

It’s Porsche Design so there has to be carbon fibre, but of course. Here it’s the lid of the machine, adding that classic look to the all-metal chassis. It’s really these materials and cuts – look at the edging around the trackpad, for example – that help the Porsche Design version stand apart from typical laptops.

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Being that it’s partly made from carbon fibre means the weight is low, too, at 1.25kgs. While that’s not the lightest ever laptop – something like the Huawei MateBook X is impressive; even Acer’s own Swift 7 series is among the lightest ever at sub-1kg – it’s befitting of a device that’s 15.99mm thick and packs in enough smarts and battery to keep you going. It’s all fuel for the engine, if you will.

There are other subtle details that make the laptop stand out: upon opening that lid – which is emblazoned with an embossed Porsche Design logo – the whole laptop’s backlit keyboard elevates, thanks to a unibody hinge, which helps the typing experience. It’s got decent key travel, not too sunk into the body.

The trackpad, which is glass-topped – none of that plastic nonsense here – also comes with a fingerprint scanner built-in towards its upper corner. An odd place for such a scanner, we think, but it’ll be useful for rapid login – or there’s Windows Hello for facial recognition login instead, if preferred.

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The screen is a 14-inch Full HD panel, so not a fancy Quad HD offering, nor does it benefit from the higher refresh rates that you’ll find in Acer’s gaming laptop ranges. That’s because, well, day-to-day workloads just don’t need such features. And at this scale we find the panel is resolute enough. It’s battery life that matters more anyway.

Specs

Ports: 1x USB-C (Thunderbolt 4), 2x USB-A (3.2), 1x HDMI, 3.5mm jack
Up to 11th Gen Intel Core i7 processor, up to 16GB RAM
Intel Iris Xe graphics, Optional Nvidia GeForce MX350
Dual copper heat pipes cooling system
15 hours battery life, fast-charging
Dual-band Intel Wi-Fi 6 (Gig+)
Optional accessories

Just how well battery life will last we don’t yet know, having only handled the Porsche Design Acer Book RS for a short period of time. But the companies promise up to 15 hours – which is decent innings. This figure is based upon the machine being a collaboration between Porsche Design and Intel – the latter introducing Intel Evo, which it says is designed to optimise performance and real-world battery life.

Pocket-lint

The Porsche Design Acer Book RS comes with Intel’s latest chipsets, its 11th Gen Core i processors – up to i7 with Intel Iris Xe graphics. Or you can go the whole nine yards and add a turbo in the form of Nvidia’s GeForce MX350 discrete graphics card.

Inside there’s a dual copper pipe system for cooling, designed to draw heat away from the processor and graphics units to keep the machine cool for the aid of battery life. There’s even fast-charging here, with just 30-minutes at the plug said to deliver over 25 per cent of the laptop’s battery life – to deliver 4 hours of use. We expect such features in our phones, so it’s good to see it in a laptop.

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The array of ports is fast too, Thunderbolt 4 fast, meaning 40Gbps is possible – four times the already impressive 10Gbps of Thunderbolt 3 (which you don’t find on all that many machine as it stands anyway). We can see where the ‘RS’ badge – which means Racing Sport in German – earns its place here.

Porsche Design being that high-end company, the Acer Book RS doesn’t just finish there – there are optional bundled accessories too. What’s called the Porsche Design Acer Travel-pack RS, this travel pouch – made from fancy leather, of course – connects to a notebook sleeve, which doubles-up as a mousepad for the also included Porsche Design Mouse RS (complete with more fancy carbonfibre).

Best laptop 2020: Top general and premium notebooks for working from home and more

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So how much will you pay for this fancy schmancy machine? It’s from £1,899 for the laptop only ($1,399 in the US / €1,799 in Europe), or £2,099 with the Travel-pack included ($1,999.99 in the US / €2,399 in Europe).

First Impressions

The Porsche Design Acer Book RS is a surprise launch indeed, bringing some more standout – maybe outlandish, depending on your viewpoint – design language to Acer’s laptop line-up.

It brings lots of up-to-the-minute technologies, too, from Intel’s 11th Gen Core i processors, to Intel Evo for battery life assurance, and Thunderbolt 4 speeds to boot. We can see where it got that ‘RS’ badge from.

Whether all that translates to real-world worth for most people – given the high asking price of £1,899/€1,799/$1,399 for the laptop only – is a whole other big question. Recession, what recession? Gimme the fancy carbon fibre stuff already.

(Image credit: Acer)

Porsche Design has a long history in the PC / tech space, including partnerships with LaCie, AOC, and even BlackBerry, as well as striking out on its own with the Surface Book-like Book One a few years back. Now the automobile-adjacent design house has teamed up with both Acer and Intel for the Porsche Design Acer Book RS, a premium 14-inch laptop that looks like someone stuck the carbon fiber lid from a Thinkpad X1 on a shinier old-school MacBook Pro. Only time (and our testing) will tell if it will find a place on our best premium laptops list.

(Image credit: Acer)

Acer says the high-end laptop will include up to 11th Gen Intel Core i7 processors with Iris Xe integrated graphics, up to 16GB of RAM and an optional Nvidia GeForce MX350 dedicated GPU. On paper, one of the more impressive aspects of the Porsche Design Acer Book RS is that Acer manages to keep the weight down to either 2.65 or 2.76 pounds (Acer’s press release mentioned both weights) while keeping the thickness of the “all metal” chassis at 0.63 inches.

Those who like densely pixel-packed screens will be let down by the laptop’s FHD (1080p) display, but it is listed as IPS and includes touch support. You also get Thunderbolt 4 and USB 3.2 Gen 2 ports, a glass precision touchpad and the carbon fiber top. And some models will be

Evo verified

by Intel. To that end, battery life is listed at 17 hours (video playback at 150 nits in Battery Saver mode with Wi-Fi off, according to press release footnotes), and next-gen Wi-Fi 6 should make for speedy, robust wireless connectivity.

(Image credit: Acer)

For those who want to go all-in on the Porsche Design aesthetic, Acer will also sell matching accessories for the Porsche Design Acer Book RS, including a mouse, leather carrying pouch, and a separate notebook sleeve with a detachable lid that’s designed to serve as a mousepad.

(Image credit: Acer)

Acer says the Porsche Design Acer Book RS will be available in December 2020 in North America, starting at $1,399 (EUR 1,799). A premium package, which includes the laptop with an i7 CPU as well as the travel pack and mouse, will sell for $1,999 (EUR 2,399). And if you opt for the laptop and want the travel pack after the fact, you can pick up the mousepad, mouse, carrying pouch and sleeve for $329.99 (EUR 299) separately.

Toshiba aims to become a leader in a branch of quantum cryptography called “quantum key distribution”, particularly useful in the industrial, government and military fields. Goal: $ 3 billion in 2030

by Riccardo Robecchi published on 21 October 2020 , at 13: 14 in the Innovation channel

Toshiba Quantum Computer

The transition to a computing model based on quantum computers it involves great challenges and great risks, but also great opportunities. cryptography is one of those areas that will be changed by the progress in the development of quantum computers, but this has also interesting implications in terms of opportunities. Toshiba is aware of this and has revealed how it intends to bring its division dedicated to quantum cryptography services to invoice $ 3 billion by 2030 thanks also to the collaboration with the US Verizon and with the British BT Group .

Toshiba aims to invoice $ 3 billion by 2030 thanks to quantum cryptography

The quantum computer under development in Intel’s labs

The ups and downs of the economy and the strong uncertainties forced Toshiba to revise its plans, ending the notebook division last August (sold to Sharp and now under the name of Dynabook) and operations in the TV market in March 2019. The company would therefore like, according to Reuters , find a source of income that is more resistant to market unexpected events consumer and would have identified one in quantum cryptography.

To be more specific, the company would be specializing in a sector called quantum key distribution or QKD for short (in Italian “quantum key distribution”). It is a method for distributing cryptographic keys created from quantum states of a system; these keys, being of a quantum nature, allow to detect interception attempts by third parties since the measurement act necessary to read the information would change their quantum state and would therefore be detectable.

This approach has an intrinsic advantage over the high security systems adopted today: it is automated, fast and does not require human intervention. As a yardstick, communication between the National Composites Center (NCC) and the Center for Modeling and Simulation (CFMS) in Bristol, UK, takes place through the physical movement of data contained on storage devices. Toshiba has partnered with BT to replace this system with a quantum one, capable of generating keys believed to be secure and impossible to tamper with using traditional computers.

Toshiba expects the global QKD market arrive at 12 billions of dollars within the next ten years and that a significant portion in China, where the government is pointing

The concept incorporates what was shown by Intel at CES 2020 with the Horseshoe Bend prototype: a large flexible screen that adapts transforming itself from tablet to notebook, obviously all touch

by Paolo Corsini published 21 October 2020 , at 10: 03 in the Portable channel

Core Windows Samsung Microsoft Intel

Among the many innovations presented at CES in Las Vegas, Intel had shown a notebook prototype of the future i ndated with the name of Horseshoe Bend . It was a mobile solution with a mirror form factor to that of a notebook with a 13 inches diagonal, but in fact made up of a single flexible screen of 17 inches that could be completely opened to operate as a tablet, or partially closed to turn into a notebook with a touch keyboard.

Intel Horseshoe Bend prototype, shown at CES 2020 of Las Vegas

ETNews, a Korean day, reports how Samsung, Intel and Microsoft are working to bring notebooks with flexible screens to market similar in design and mode of operation to the Intel prototype seen at CES 2020. The 3 companies will contribute to the initiative with different components: from Samsung the flexible screen and from Intel the processors of the Core family, while Microsoft will provide a specific version of its operating system that is well suited to the specific methods of use of this product. .

A screen of this type, according to forecasts, should only be available in production during the 2011; for this reason a notebook of this type could be released during the 2022 , year in which Microsoft should make the Windows operating system available 10 X. This is a version of Windows 10 specifically developed for the needs of mobile devices with flexible screen

This is an undoubtedly interesting approach to design, which replicates on a large scale what we have seen over the past 18 months with smartphones with a flexible screen. In terms of flexibility of use a screen of this type represents a very important innovation but it remains to be seen in the extent to which this feature will affect robustness and image quality.

The Fujitsu LifeBook series is known for being very light and mobile. The new Fujitsu LifeBook UH-X follows this path and comes with only 638 g , at a 13, 3 inch display. The thickness is 15, 5 mm. Overall, the dimensions are 307 mm x 197 mm x 15, 5 mm. Unfortunately, this information is mainly achieved at the expense of the battery, which is one of the heaviest components. The capacity only includes 25 Wh, which is roughly half of what competing products have to offer. Nevertheless, according to the manufacturer’s information, the battery life is up to 11 hours. As a rule, however, this will hardly be achieved. You have to wait until independent reviews are created.

The remaining equipment includes a 13, 3 inch size 1 . 080 p IGZO panel and an Intel Core i7 – 1165 G7 with integrated Intel Iris Xe Graphics. With 8 GB of LPDDR4X – 2017 – the RAM is sufficiently large for office applications and beyond. A 1 TB PCIe SSD is available for storage. A fingerprint sensor is also available for logging in. There is also a 1 MP webcam on the front for occasional video calls. There is Wi-Fi 6 and Bluetooth 5.0 for connections.

The connections are quite generous for such a small notebook. There are two USB-C ports (3.2 Gen 2 / 10 Gbit / s), two USB-A ports (3.2 Gen 1/5 Gbit / s), Ethernet, HDMI, one SD Card reader and an AUX connection.

The Fujitsu LifeBook UH-X / E3 starts in this version in Japan at an impressive price of 241. 780 Yen, converted about 1. 938 Euro. Whether there will be a release in Europe – and if so, at what price is currently unknown.

The extremely flat 15, 6-inch Lenovo Legion Y 740 It comes in gaming regalia, but you have to buy a graphics card suitable for gaming as an external GPU dock.

Flat notebook with 14, 6-inch display: Lenovo Legion Y 740 You in the test External graphics unit Technical details Conclusion and test table Items in c’t 22 / 2020 read Thin notebooks are nothing special in themselves, with the Len gaming notebook ovo Legion Y 740 You still notice the slim design: In the only one centimeter flat hull of the 13, the 6-inch device does not have a U processor typical of flat notebooks (15 Watt TDP, Thermal Design Power), but with the Core i7 – 10750 H an H-CPU (45 – Watt class) from Intel’s tenth Core-i generation. It provides decent computing power for a gaming notebook, but is a chip with an aged core architecture and 13 – Nanometer transistors. The core comes to the multithreading performance of AMD’s Ryzen 4000 processors i7 – 10750 H not approaching; And when it comes to single-threading computing power, even the U models of the recently introduced eleventh generation of Core i are ahead.

The flat design has two special features. In order to dissipate the waste heat generated under load, four fans are required, and they start to rustle audibly even with short load. If the processing load continues, it gets very loud with over 3 sones. The cooling system has an impact on weight: You have to lug around 1.7 kilograms.

Although the notebook is assigned to Lenovo’s gaming brand Legion, it does not have an additional graphics chip. The UHD graphics unit, which is integrated in the processor and is too weak for all 3D worlds beyond Google Earth, takes care of the screen control.

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So far, Intel has only used the first Xe GPU based on the economical Xe LP architecture in the mobile Tiger Lake processors. The GPU benchmarks show a doubling of the performance compared to the predecessor. As with AMD’s Renoir processors, such a powerful integrated graphics unit means that the slow, discrete combination solutions are superfluous.

It is already known that Intel has integrated the DG1 (Discrete Graphics 1) into an end customer product wants to convict. So far, this has only existed as a Software Development Vehicle (SDV) or in an integrated forum in the Tiger Lake processors. Now there are the first concrete indications. ASUS has the product page of the Vivobook Flip 14 put online. This speaks of “First Intel Discrete Graphics” . The exact product name is Iris Xe Max.

In the ASUS Vivobook Flip 14 the Iris Xe Max with the Tiger Lake models Core i5 – 1135 G7 or Core i7 – 1165 G7 combined. There are also 8 or 16 GB to LPDDR4X. Usually the integrated graphics unit also uses this memory, which starts with 61 GB / s is connected to the Xe-LP architecture. This bandwidth is one of the reasons why the Iris-Xe graphics are twice as fast as its predecessor.

For the Iris-Xe-Max variant, the GPU has its own memory. ASUS specifically speaks of 4 GB of video memory. This is likely to be GDDR6, which Intel will also use for the larger Xe-HPG variant in the coming year. This means that the memory bandwidth should also be higher, although we have no information about the width of the memory interface.

There are no more precise technical details about the Iris-Xe-Max-GPU. According to previous information, the same expansion stage comes here with 96 EUs are used, as with the fastest Tiger Lake processors. However, a dedicated GPU with the same expansion level should clock much higher, since it can produce a higher power consumption and waste heat. For the Tiger Lake processors we have for a Core i7 – 1185 G7 with a measure of 1, 35 GHz one power consumption maximum 14 W measured – only for the integrated GPU. The dedicated variant should be allowed to accept significantly more without compromising the CPU package.

Whether and when Intel will officially present the Iris Xe Max is currently not known. The question is also open whether ASUS will be offering the Vivobook Flip 14 has only been advanced and whether or when there will be other models.

Update: Iris Xe Max uses LPDDR4X

With the assumption that the dedicated Iris-Xe-Max-GPU would use GDDR6 memory, we were probably not entirely correct. With the Swift 3X, Acer now also has a notebook with dedicated Intel graphics and mentions 4 GB of LPDDR4X as graphics memory in the technical details. This is also used here for the RAM of the Tiger Lake processor and Intel also uses an LPDDR4X memory interface for the Xe-LP-GPU.

Introduction

In this article, which our team will regularly update, we will maintain a growing list of information pertaining to upcoming hardware releases based on leaks and official announcements as we spot them. There will obviously be a ton of rumors on unreleased hardware, and it is our goal to—based on our years of industry experience—exclude the crazy ones. In addition to these upcoming hardware release news, we will regularly adjust the structure of this article to better organize information. Each time an important change is made to this article, it will re-appear on our front page with a “new” banner, and the additions will be documented in the forum comments thread. This article will not leak information we signed an NDA for.

Feel free to share your opinions and tips in the forum comments thread and subscribe to the same thread for updates.

Last Update (Oct 19th):

Added AMD Lucienne APU
Updated AMD Cézanne / Ryzen 5000 APU
Update AMD Ryzen 5000
Updated Intel Alder Lake
Updated Intel Ice Lake Server
Added Intel Grand Ridge
Updated Intel Meteor Lake
Updated Intel Jasper Lake
Updated AMD Big Navi
Updated AMD RDNA2
Updated NVIDIA RTX 3070
Added NVIDIA RTX 3060 Ti
Added NVIDIA Ampere Mobile
Added AMD Radeon RX 6500
Updated AMD Radeon RX 5300 XT
Updated Intel Xe Graphics
Updated AMD CDNA / CDNA2
Updated Intel 500-Series chipsets
Updated HBM2E memory
Added HBMNext memory
Updated DDR5 memory
Updated TSMC 5 nanometer, 4 nanometer, 3 nanometer, 2 nanometer
Removed launched products: Intel Comet Lake KA, Tiger Lake, NVIDIA RTX 3080 / 3090, Ampere, MX450

Processors

AMD Lucienne Zen 2 APUs / Ryzen 5000 [added]

Release Date: Probably 2021
Successor to “Renoir”
Built on Zen 2 CPU cores, but still branded “Ryzen 5000”
Uses Vega iGPU
Built on slightly refined 7 nm process, but not N7P or N7+
Ryzen 3 5300U: 4c/8t, 2.6 GHz base, 3.85 GHz boost, 4 MB L3, 10-25 W TDP, 6 CU @ 1.5 GHz
Ryzen 5 5500U: 6c/12t, 2.1 GHz base, 4.0 GHz boost, 8 MB L3, 10-25 W TDP, 7 CU @ 1.8 GHz
Ryzen 7 5700U: 8c/16t, 1.8 GHz base, 4.3 GHz boost, 8 MB L3, 10-25 W TDP, 8 CU @ 1.9 GHz
Built on TSMC 7 nm process, N7

AMD Cézanne Zen 3 APUs / Ryzen 5000 [updated]

Release Date: Probably 2021
Successor to “Renoir”
Built on Zen 3 CPU cores, paired with Vega iGPU
Ryzen 3 5400U: 4c/8t, 2.6 GHz base, 4.0 GHz boost, 8 MB L3, 10-25 W TDP, 6 CU @ 1.6 GHz
Ryzen 5 5600U: 6c/12t, 2.3 GHz base, 4.2 GHz boost, 12 MB L3, 10-25 W TDP, 7 CU @ 1.8 GHz
Ryzen 7 5800U: 8c/16t, 2.0 GHz base, 4.4 GHz boost, 16 MB L3, 10-25 W TDP, 8 CU @ 2.0 GHz
Built on slightly refined 7 nm process, but not N7P or N7+
Similar core counts as predecessors
19% IPC uplift on Zen 3 models
Comes in 15 W and 45 W SKUs
“Van Gogh” APU is based on Zen 3, too, but uses RDNA2 iGPU, for ultra-low-end

AMD Ryzen 5000 Desktop / Zen 3 [announced]

Announced: Oct 8, 2020
Market availability: Nov 5
Reviews: Nov 5
Design completed as of Aug 2019
Codename: Vermeer (CPU)
CCX removed, so that all cores on the CCD share a single large L3 cache
Continues to use Socket AM4 for desktop
Redesigned chiplets with 32+ MB shared L3 on each chiplet, as opposed to 2x 16 MB shared between CCX groups
Zen 3 processors are compatible with B450, X470, B550 and X570 motherboards (after BIOS flash)
Ryzen 5 5600X: 6c/12t, 3.7 GHz base, 4.6 GHz boost, 65 W TDP, 32 MB cache, $299
Ryzen 7 5800X: 8c/16t, 3.8 GHz base, 4.7 GHz boost, 105 W TDP, 32 MB cache, $449
Ryzen 7 5900X: 12c/24t, 3.7 GHz base, 4.8 GHz boost, 105 W TDP, 64 MB cache, $549
Ryzen 9 5950X: 16c/32t, 3.4 GHz base, 4.9 GHz boost, 105 W TDP, 64 MB cache, $799
Ryzen 5 5600: Launches 2021 at $220
Far Cry 6 game bundle included (in select markets)
PCIe Gen 4
Up to 19% IPC improvement
24% better energy efficiency, 2.8x efficiency vs. Core i9-10900K
Up to 50% faster floating point
New CPU core

AMD Zen 3 [announced]

Release date: 2021 (Server / Threadripper)
Design completed as of Aug 2019
Codename: Vermeer (CPU), Dali (APU w/ IGP), Milan (Server), Grey Hawk (Embedded), Genesis Peak (Threadripper)
Zen 3 refresh, possibly based on improved tech called “Warhol”
CCX removed, so that all cores on the CCD share a single large L3 cache
Redesigned chiplets with 32+ MB shared L3 on each chiplet, as opposed to 2x 16 MB shared between CCX groups
Server platform codename “Genesis SP3”
Up to 64-cores (128-threads) across eight 8-core chiplets
120 – 225 W TDP
Clock frequencies: up to 3.8 GHz base, up to 4.9 GHz boost
64-core EPYC Milan clocked at 3.0 GHz
PCIe Gen 4
8-channel DDR4 memory
New process tech: 7 nm Plus (probably not 7 nm+ EUV)
20% increase in transistor density, 10% lower power consumption
Up to 15% IPC improvement + more from higher clock frequencies
Up to 50% faster floating point
Possibly support for AVX-512
New CPU core

AMD Zen 4

Release Date: 2021
“In Design” as of Nov 2018
“On Track” for 2021 launch as of Dec 9, 2019
5 nm TSMC process
DDR5 memory support
Improves IPC
Server platform codenamed “Genoa”
PCI-Express Gen 5
More cores per chiplet
Uses 3rd generation Infinity Fabric, which adds cache-coherent unified memory
Uses Socket SP5 for EPYC, new mainstream socket expected (AMD Socket AM5)

AMD Zen 5

Release Date: 2022
5 nm or 3 nm TSMC process
DDR5 memory support
PCI-Express Gen 5
Desktop codename: “Raphael”
APU codename: “Rembrandt”
Uses Socket SP5 for server, desktop uses Socket AM5

Intel Ice Lake Server [updated]

Release date: late 2020, re-confirmed as of Q2 2020
Ice Lake mobile was launched in late 2019
Ice Lake desktop was scrapped because it wasn’t competitive with Comet Lake
Xeon codename “Whitley”
Uses new 4189-pin LGA socket
8-channel DDR4 interface
10 nanometer DUV (deep-ultraviolet) process
Brand-new CPU core design codenamed “Sunny Cove”
PCI-Express Gen 4.0
“GenuineIntel Family 6 Model 106 Stepping 4” processor: 24c/48t, 2.2 GHz base, 2.9 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 36 MB
“GenuineIntel Family 6 Model 106 Stepping 5” processor: 28c/56t, 1.5 GHz base, 3.5 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 42 MB
2x 28c CPU Geekbench SP = 3424, MP = 38079, EPYC 7742: SP = 4398, MP = 35492
Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI
20-30% broadening of various number crunching resources, wider execution window, more AGUs
18% IPC gains vs Cascade Lake
SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. “Skylake”
Supports unganged memory mode
Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance
Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support
Gen11 also features tile-based rendering, one of NVIDIA’s secret-sauce features
Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this
Ice Lake introduces Intel TME (Total Memory Encryption), also Intel Platform Firmware Resilience (Intel PFR)

Intel Core i9-10990XE

Release Date: unknown, originally early 2020, seems cancelled now
22-cores + HyperThreading
Uses Cascade Lake-X architecture
LGA2066 Socket
1 MB L2 cache per core, 30.25 MB shared L3 cache
4 GHz base, up to 5 GHz boost
Roughly matches Threadripper 3960X in Cinebench

Intel Rocket Lake [updated]

Release Date: Q1 2021
Succeeds “Comet Lake”
Variants: Rocket Lake-“S” (mainstream desktop), -“H” (mainstream notebook), -“U” (ultrabook), and -“Y” (low power portable)
14 nanometer production process
Seems to be limited to eight cores (2 less than 10-core Comet Lake)
Some indication of mixed HyperThreading configurations, for example 8-core, 12-thread
Uses “Cypress Cove” core, which seems to be a backport of “Willow Cove” to 14 nm process
Up to 10% IPC improvement over Skylake
No FIVR, uses SVID VRM architecture
125 W maximum TDP
Compatible with 400-series chipsets
Possible they release 500-series chipsets with added features
Socket LGA1200 (just like Comet Lake)
Supports PCI-Express 4.0
20 PCIe lanes
Intel Xe integrated graphics, based on Gen 12 with HDMI 2.0b and DisplayPort 1.4a
Xe EU count only 32, Tiger Lake will have 96
2.5 Gb/s Ethernet, Thunderbolt 4, USB 3.2 20G
iGPU with up to 32 EUs
Memory support: DDR4-2933
32 KB L1I cache, 48 KB L1D cache, 512 KB per core L2 cache, and 16 MB shared L3 cache (8-core chip)
Engineering Sample: Family 6, Model 167, Stepping 0, 8c/16t, 3.4 GHz base, 5.0 GHz boost
Engineering Sample: Family 6, Model 167, Stepping 0, 8c/16t, 3.2 GHz base, 4.3 GHz boost

Intel Willow Cove and Golden Cove Cores

Release Date: 2021
Succeeds “Sunny Cove”
Willow Cove improves on-die caches, adds more security features, and takes advantage of 10 nm+ process improvements to increase clock speeds versus Sunny Cove
Golden Cove will add significant single-thread (IPC) increases over Sunny Cove, add on-die matrix multiplication hardware, improved 5G network-stack HSP performance, and more security features than Willow Cove

Intel Alder Lake [updated]

Release Date: H2 2021
Mixes CPU cores of various processing power (and energy consumption), similar to the Big.Little-like designs for mobile devices
Combines up to eight Golden Cove with up to eight Gracemont (Atom) cores
These cores have two different instruction sets, for example Golden Cove has AVX-512, TSX-NI and FP16, which Gracemont lacks
10 nm process
Uses Socket LGA1700
Alder Lake for desktop: 37.5 mm x 45 mm package
Desktop CPUs come in 125 W and 80 W
Could use Foveros 3D Stacking technology
Possible CPU configurations 8+8+1 (8 big cores, 8 small cores, GT1 integrated), and 6+0+1 (6 big cores, no small cores and GT1 integrated)
Includes Gen12 Xe iGPU
DDR5 memory support
PCI-Express 5.0 support
Includes CLDEMOTE instruction, to invalidate cache lines

Intel Sapphire Rapids

Release Date: H2 2021
Successor to Cooper Lake
8-channel DDR5
Uses Socket LGA4677
For enterprise / data center
10 nm+ production process
Willow Cove CPU cores
PCIe 5.0
Probably 7 nm process
Platform name: Eagle Stream
Includes CLDEMOTE instruction, to invalidate cache lines

Intel Grand Ridge [added]

Release Date: 2022 or later
Produced on 7 nm HLL+ process
Successor to Atom “Snow Ridge”
24 cores across 6 clusters with 4 cours each
4 MB L2 per cluster, plus L3 cache
Uses Gracemont CPU core
Dual-channel DDR5
PCI-Expres Gen 4 with 16 lanes

Intel Elkhart Lake

Release Date: Unknown
Produced on 10 nm process
Designed for next-gen Pentium Silver and Celeron processors
CPU cores use Tremont architecture
GPU uses Gen 11
Dual-core and Quad-core configurations
Single-channel memory controller with DDR4 and LPDDR4/x support
Engineering sample: 1.9 GHz, 5/9/12 W TDP

Intel Meteor Lake [updated]

Release Date: 2022 or 2023
Succeeds “Alder Lake”
New microarchitecture, more advanced than “Willow Cove”, possibly “Golden Cove”
As of late 2020 Intel is adding support for Meteor Lake to the Linux Kernel
Produced on 7 nm EUV Intel process

Intel Jasper Lake [updated]

Release Date: Unknown
Uses Tremont architecture
10 nm production process
Successor to Gemini Lake
ES: 4c/4t, 1.1 GHz Base, 1.12 GHz Boost
DDR4 memory support
Pentium Silver J6005: 4c/4t, 2 GHz base, 3 GHz boost, 4 MB L2
Celeron J5105: 2 Ghz vase, 2.8 GHz boost, 4 MB L2
Celeron J4505: 2c/2t, 2 GHz base, 2.9 GHz boost 4 MB L2
Pentium Silver N6000 Mobile: 4c/4t, 1.1 GHz base, 3.1 GHz boost, 4 MB L2
Celeron N5100 Mobile: 1.1 GHz base, 2.8 GHz boost
Celeron N4500 Mobile: 2c/2t, 1.1 GHz base, 2.8 GHz boost

Intel Granite Rapids

Release Date: 2022
Successor to Sapphire Rapids
8-channel DDR5
For enterprise / data center
PCIe 5.0
Probably 7 nm+ process
Platform name: Eagle Stream

VIA CenTaur / Zhaoxin KaiXian

Release Date: H2 2020
Eight-core 64-bit CPU, 2.5 GHz
AVX-512 supported
16 nm FinFET TSMC
195 mm² die size
Use LGA socket
Codename: “CHA”, pronounced “C-H-A”
Separate AI co-processor “NCORE”
All cores + NCORE connected using a ring bus
Integrated VIA S3 graphics with DirectX 11.1
16 MB shared L3 cache
Four-channel DDR4-3200 memory support
44 PCI-Express 3.0 lanes
Sold as Zhaoxin KaiXian KX-6780A in China (end of Jan 2020): 8 core, 8 threads, 2.7 GHz, 8 MB cache, dual-channel DDR4-3200
Southbridge integrated
Multi-socket capable

Graphics / GPUs

NVIDIA RTX 3070 [updated]

Release Date: Oct 29 2020
Based on GA104 GPU
GA104-400 for RTX 3070, 5888 CUDA cores, 1.5 GHz base, 1.73 GHz boost, 256-bit GDDR6 memory, $499
RTX 3070 Ti rumored with 16 GB, GDDR6X, GA104-300

NVIDIA RTX 3060 [added]

Release Date: 2020 or 2021
8 GB GDDR6
Matches RTX 2080 performance

NVIDIA RTX 3060 Ti [added]

Release Date: 2020 or 2021
GA104 GPU, same as RTX 3070
4864 shaders, 38 RT cores, 152 tensor cores, 152 TMUs
8 GB GDDR6, 256-bit
180 – 200 W TDP, 1x 8-pin power
Gigabyte GeForce RTX 3060 Ti Aorus Master 8G (GV-N306TAORUS M-8GD), Gigabyte GeForce RTX 3060 Ti Gaming OC 8G (GV-N306TGAMING OC-8GD), Gigabyte GeForce RTX 3060 Ti Eagle OC 8G (GV-N306TEAGLE OC-8GD), and the Gigabyte GeForce RTX 3060 Ti Eagle 8G (GV-N306TEAGLE-8GD)

NVIDIA Ampere with more VRAM

Release Date: December 2020
RTX 3080 with 20 GB memory (instead of 10 GB)
RTX 3070 with 16 GB memory (instead of 8 GB)

NVIDIA RTX 3000 Mobile Ampere [added]

Release Date: 2021
RTX 3070 Mobile (Max Q), H56C8H24AIR GDDR6 memory

NVIDIA Ampere Refresh

Release Date: unknown
NVIDIA is moving their existing designs from Samsung 8 nm to TSMC 7 nm

NVIDIA Hopper

Release Date: unknown
Successor to “Ampere” architecture
MCM (multi-chip module) GPU packages
Seems to be for workstation/compute only

AMD Radeon RX 5300 XT [updated]

Release date: unknown
Non-XT version has launched on Aug 31, 2020 (1408 cores, 3 GB GDDR6, 96-bit, 1448 MHz game clock, 1645 MHz boost, 100 W TDP)
24 Compute Units / 1536 Stream Processors
3 GB GDDR6 memory, 96-bit
7 nanometer production process
Probably based on Navi 14 GPU

AMD Radeon RX 5600M and RX 5700M

Release date: unknown
Based on Navi 10 silicon
7 nanometer production process
RX 5700M: 2304 shaders, 144 TMUs, 64 ROPS, 8 GB GDDR6 memory, 256-bit, 1620-1720 MHz
RX 5600M: 2304 shaders, 144 TMUs, 64 ROPS, 6 GB GDDR6 memory, 192-bit, 1190-1265 MHz

Big Navi / Navi 20 / Navi 21 / Radeon RX 6000 Series [updated]

Release Date: Late 2020
Announcement: October 28
Uses RDNA2 graphics architecture
7 nanometer, possibly 7 nm+ EUV
Codename could be “Sienna Cichlid”
Goes up against NVIDIA high-end Ampere
Radeon RX 6000 Series: Radeon RX 6900, RX 6900 XT, RX 6900 XTX
Navi 21: 2x Navi 10, 80 CU, 5120 Stream Processors, 16 GB GDDR6, 255 W TGP, 2.4 GHz Game Clock, 536 mm² die size, dual 8-pin power inputs, 2x DP, 1x HDMI, 1x USB-C
4K performance slightly below RTX 3080, Borderlands 3: 61 FPS, COD MW: 88 FPS, Gears 5: 73 FPS
Aims to provide playable 4K framerates
Features “Infinity Cache”
Lisa Su in a CES 2020 interview said “we will have a high-end Navi […] it is important”
AMD CFO: “Big Navi” will be a halo product and not merely a lofty performance increase over the RX 5700 XT to make AMD competitive against GeForce “Ampere.”
Adds support for DirectX 12 Ultimate: variable-rate shading and hardware-accelerated ray-tracing (DXR version 1.1)

AMD RDNA 2 [updated]

Announcement: October 28
Lisa Su: “we will have our new next-generation RDNA architecture that will be part our 2020 lineup”
TSMC, 7 nm Plus (probably not 7 nm+ EUV)
Up to 18% higher transistor density
Higher clock speeds than RDNA
50% better performance per Watt than RDNA, twice the efficiency as GCN
Adds variable rate shading
Adds support for BFloat16
Adds AV1 video decode hardware acceleration
Adds hardware raytracing acceleration (DXR version 1.1)
Supports Microsoft DirectX 12 Ultimate API /DXR, VRS, Mesh Shaders & Sampler Feedback)
Same GPU architecture powers PlayStation 5 & Xbox Series X

AMD Radeon RX 6500 [added]

Release date: unknown
40 Compute Units / 2560 Stream Processors
192-bit GDDR6 memory
7 nanometer production process
RDNA2 architecture
Codename “Navy Flounder”
Below $250

AMD RDNA 3

Release Date: Late 2021 or 2022
“Advanced Node”, probably TSMC 6 nm or 5 nm

AMD CDNA and CDNA2 [updated]

Release Date: 2020 for CDNA and 2021-2022 for CDNA2
New architecture that focuses on compute for “Radeon Instinct”
TSMC 7 nm or 7 nm+
128 Compute Units = 8192 shaders
Arcturus engineering sample has 120 CUs (7680 shaders), 878 MHz for the core clock, 750 MHz SoC clock, and 1200 MHz memory clock
Compute only—Rasterization, display controllers and media encoding hardware removed
Product name: Radeon Instinct MI100, 120 CU / 7680 cores, 32 TFLOP FP32
1000 MHz memory clock: 1 TB/s memory bandwidth
GPU clock up to 1334 MHz
200 W TDP
CDNA seems to be very similar to Vega
Add Tensor cores like on NVIDIA
Uses 32 GB HBM2 or HBM2E memory from Hynix and Samsung
Infinity Fabric link to pool multiple GPUs
CDNA2 implements Infinity Fabric gen 3.0 to support vast memory pools and cache-coherent unified memory access
Adds support for BFloat16

Intel Xe Discrete Graphics [updated]

Release Date: 2021 for discrete GPU
Intel has scheduled a presentation event for August 13th, also Hot Chips Conference presentation on August 17th
Announcement: Xe DG1-SDV (Software Development Vehicle) announced at CES 2020 (Jan 9th 2020)
First Intel Discrete GPU since ill-fated Larrabee
New architecture built from the ground up, and not an upscale of Gen 11
Developer kit shipping as of Q4 2019, called “Discrete Graphics DG1 External FRD1 Accessory Kit (Alpha) Developer Kit”
Intel DG2: 8 GB GDDR6, Tiger Lake-H CPU, 256-bit memory bus, 512 EU
SDV OpenCL performance in Geekbench: 55373 points, with 3.53 Gpixels/s in “Sorbel,” 1.30 Gpixels/sec in Histogram Equalization, 16 GFLOPs in SFFT, 1.62 GPixels/s in Gaussian Blur, 4.51 Msubwindows/s in Face Detection, 2.88 Gpixels/s in RAW, 327.4 Mpixels/s in DoF, and 13656 FPS in Particle Physics. Roughly matches 11 CU Vega Picasso IGP
SDV is 15.2 cm long, 96 Execution Units, PCI-Express x16, slot only power (so 75 W), 3x DisplayPort, 1x HDMI, high noise levels
Up to 2x performance uplift for Intel Xe integrated graphics over previous Gen 11
Using a multi-chip design approach, with Foveros, Intel Xe scales up to 512 EUs with 500 W
512 EU model is datacenter only, 300 W 256 EU model for enthusiast markets
Targeted at 1080p gameplay, CES demonstration showed working gameplay on Destiny 2
Could be produced at Samsung to leverage their 10 nm tech, while Intel ramps up its own
Future Xe GPUs could be built on TSMC 6 nm and 3 nm nodes
Raytracing hardware acceleration support will definitely be included on the data-center GPUs (and probably on the consumer models, too)
Double-digit TFLOP/s scaling all the way up to 0.1+ PFLOP/s
Will be used in upcoming Cray Aurora Supercomputer for Argonne National Laboratory in 2021
Targeting a wide segment of markets, including consumer (client-segment) graphics, enthusiast-segment, and data-center compute
Uses new graphics control panel that’s being introduced during 2019

Intel Discrete GPU / Arctic Sound

Release Date: 2020
Intel will hold a world tour in 2019, to build enthusiasm for the new architecture
Advanced management for power and clocks
Test chip: 8×8 mm² die area, 1.54B transistors, 14 nm, 50-400 MHz clock, EUs at 2x clock if needed
Raja Koduri who left AMD in late 2017 is somehow involved
Confirmed to support VESA Adaptive Sync

Intel Ponte Vecchio

Release Date: 2021 or 2022
Discrete GPU
Produced on 7 nanometer production process
Probably not 7 nanometer Intel but 7 nm TSMC or even 6 nm TSMC
Multiple GPU dies will be combined into a single accelerator
Architected “for HPC modeling and simulation workloads and AI training”
Workloads can be processed by GPU and CPU at the same time, using Intel oneAPI
Foveros packaging technology
Xe link to combine multiple GPUs (CXL interconnect)

Intel Jupiter Sound

Release Date: 2022
Discrete GPU
Produced on 10 nanometer production process
Successor to Arctic Sound

Zhaoxin Discrete GPU

Release Date: Unknown
Discrete GPU
Produced on 28 nanometer production process
70 Watt TDP
Based on VIA S3 graphics IP

Chipsets

Intel 500 Series Chipsets [updated]

Release Date: 2021, possibly March
For Rocket Lake processors
Models: Z590 (overclockers), H570 (premium desktop), B560 (midrange desktop), H510 (entry-level desktop), Q570 (commercial desktop), W580 (workstation)
Socket LGA1200
PCI-Express 4.0
2.5 Gb/s Ethernet, Thunderbolt 4, USB 3.2 20G

AMD 600-Series Chipsets

Release Date: September 2020, at the same time as Zen 3.
Highly likely these were scrapped when AMD decided to enable compatibility with 400 and 500 series chipsets
Socket AM4
Supporting Zen 3 Ryzen 4000 processors
Support for older CPUs very likely, probably at least Ryzen 3000
PCI-Express 4.0

Memory

DDR5 System Memory [updated]

Release Date: Late 2020, probably 2021
JEDEC standard finalized as of Jul 15th 2020
Demo’d in May 2018 by Micron: DDR5-4400
Samsung 16 Gb DDR5 DRAM developed since February 2018
Samsung has completed functional testing and validation of a LPDDR5 prototype: 10 nm class, 8 Gbit, final clocks: DDR5-5500 and DDR5-6400
Samsung has started 16 Gb LPDDR5 mass production in Aug 2020
SK Hynix 4800 – 5600 Mbps, 1.1 V
SK Hynix also has 16 Gb DDR5-5200 samples ready, 1.1 V, mass production expected 2020
April 2020: Hynix has 8.4 Gbps DDR5, minimum density per die is 8 Gbit, maximum is 64 Gbit
ECC is now supported by all dies (no longer specific to server memory modules)
SK Hynix demonstrated DDR5 RDIMM modules at CES 2020: 4800 MHz, 64 GB
Micron is shipping LPDDR5 for use in Xiaomi phones (Feb 2 2020). 5.5 Gbps and 6.4 Gbps
Samsung has begun production for LPDDR5 for mobile devices (Feb 25 2020). 16 GB, 5.5 Gbps
4800 – 6400 Mbps
Expected to be produced using 7 nm technologies
32 banks, 8 bank groups
64-bit link at 1.1 V
Burst length doubled to BL16
Bank count increased from 16 to 32
Fine grain refresh feature
Improved power efficiency enabled by Vdd going from 1.2 V to 1.1 V as compared to DDR4
On-die ECC
Voltage regulators on the DIMM modules
AMD DDR5 memory support by 2021/2022, with Zen 4

HBM2E Graphics Memory [updated]

Release Date: 2020
Offers 3.2 Gbps per pin (33% faster than HBM2)
Rambus offers a 4.0 Gbps memory interface controller
Samsung Flashbolt: 16 Gb per die, 8-layers stacked, 16 GB per chip with 410 GB/s bandwidth
Hynix: 460 GB/s, 3.6 Gbps, eight 16 Gb chips are stacked for a single 16 GB chip
Hynix: mass production has started as of July 2020

HBM3 Graphics Memory

Release Date: Not before 2019
Double the memory bandwidth per stack (4000 Gbps expected)
Expected to be produced using 7 nm technologies

HBMNext Memory [added]

Release Date: Late 2022 or 2023
JEDEC work in progress
Micron involved

GDDR6X Graphics Memory

Release Date: 2020
Will first be used on new GeForce RTX 3000 / Ampere Series

Silicon Fabrication Tech

TSMC 7 nanometer+

Release Date: Q4 2019
TSMC N7+ is successor to original 7 nm node
Uses EUV (Extreme Ultra Violet)
15-20% more density and improved power consumption over N7

TSMC 6 nanometer

Release Date: Unknown
Backwards compatible with 7 nm process—no new design tools needed
Uses EUV (Extreme Ultra Violet), up to four EUV layers
18% higher logic density than N7

TSMC 5 nanometer [updated]

Release Date: March 2020 to tape-out customer designs
Risk production as of Q2 2019
High volume production: Q2 2020
Uses TSMC’s second implementation of EUV (Extreme Ultra Violet)
Up to 1.8x the density of 7 nm
Up to 14 layers
+15% higher clocks
30% better bower than N7
Intel might be a customer of this node
N5P “Plus” node: improvement to N5 while staying on 5 nm, 84-87% increase in transistor densities over N7

TSMC 5 nanometer+

Release Date: 2021
High-volume production in Q4 2020
Uses EUV (Extreme Ultra Violet)

TSMC 4 nanometer [updated]

Mass production: 2023
Codename “N4”
Uses EUV lithography

TSMC 3 nanometer [updated]

April 2020: On-Track
Risk production: 2021
Volume production: H1 2022
FinFET technology
Uses TSMC’s third implementation of EUV (Extreme Ultra Violet)
10-15% speed improvement at iso-power or 25-30% power reduction at iso-speed, compared to N5.
55,000 water per month at the start, 100,000 by 2023

TSMC 2 nanometer [updated]

No details known other than “TSMC has started development”
June 2020: TSMC is accelerating R&D
Sep 2020: Fab construction has begun
Will use Gate-All-Around (GAA) technology

Samsung 6 nanometer

Release Date: Unknown
First product taped out as of Q2 2019
Uses EUV (Extreme Ultra Violet)
Special variant for customers

Samsung 5 nanometer

Release Date: 2020
Ready for customer sample production as of Q2 2019
Mass production in Q2 2020
Yields are challenging as of Q2 2020
Uses EUV (Extreme Ultra Violet)
Up to 25% the density of 7 nm
20% lower power consumption
10% higher performance

Samsung 3 nanometer

Release Date: 2022
50% less power while delivering 30% more performance
45% less silicon space taken per transistor (vs 7 nm)

Intel 7 nanometer

Release Date: 2022 or 2023
Succeeded by 7 nm+ node in 2022, and 7 nm++ in 2023
Uses EUV (Extreme Ultra Violet)
4x reduction in design rules
Planned to be used on multiple products: CPU, GPU, AI, FPGA, 5G networking

Other

Hynix 4D NAND

Release Date: H1 2019
Developed by SK Hynix
Sampling in Q4 2018
Products demonstrated at CES 2020: Platinum P31 M.2 NVMe and Gold P31—PCIe 3.0 x4, using flash, DRAM and controller made by Hynix, over 3 GB/s read/write.
Reduces chip physical size, while increasing capacity at the same time
Supports TLC and QLC
30% higher write and 25% higher read performance
1.2 V
1st generation: 96 stacks, 1.2 Gbps per pin, 512 Gbit TLC
128 stacks in development, scales up to 512 stacks

Toshiba 5-Bit-per-Cell NAND Flash (PLC)

Release Date: Unknown
Stores an additional bit of information per cell (compared to QLC)
32 states per cell
Will enable even cheaper SSDs, probably with a performance cost

Toshiba XL-Flash

Developed by Toshiba
Uses existing SLC flash technology to improve latencies
1/10th the read latency of TLC
Good for random IOPS and better QoS at shallow queue depth
Can combine SLC and TLC/QLC for tiered, cost-optimized storage
Intel Optane memory competitor
128 gigabit (Gb) die (in a 2-die, 4-die, 8-die package)
4 KB page size for more efficient operating system reads and writes
16-plane architecture for more efficient parallelism
Fast page read and program times

Micron 128-layer 3D NAND Flash

Release Date: 2020, taped out as of Q4 2019
CMOS-under-array design, but with Replacement Gate (RG) Technology instead of Floating Gate
Only for few applications, more focused on next-generation RG tech, which brings down cost, too

Toshiba 128-layer 3D NAND Flash

Release Date: 2020 or 2021
Developed by Toshiba and partner Western Digital
Called BiCS 5
According to a press release in Feb 2020, this is actually a 112 layer stacking process
Cells are TLC (not QLC)
Chip density: 512 Gb
Write performance per channel doubled to 133 MB/s

Intel 144-layer 3D NAND Flash

Release Date: 2020
Supports QLC, but can be configured to work as TLC or SLC
SSD codename “Keystone Harbor”
PLC (5-bit per cell) technology development is underway
Optane product codename “Alder Stream”, PCIe Gen4

SK Hynix 128-layer 3D NAND Flash

Mass Production: July 2020
Up to 1 Tb TLC flash per chip
Data rate up to 1400 Mbps at 1.2 V
Products will be 2 TB client SSD with in-house controller and 16 TB / 32 TB NVMe datacenter SSDs.

Samsung 160-layer 3D NAND Flash

Release Date: End of 2020
7th generation V-NAND

Intel CXL Interconnect

New interconnect for high-bandwidth devices like GPUs
Targeted at enterprise and servers
Competitor to NVLink, Infinity Fabric and PCI-Express
Uses PCIe physical layer
Link layer designed for low latency
32 Gbps per lane, per direction (Like PCIe Gen 5.0)

PCI-Express 5.0

Specification released end of May 2019
Products not expected before 2020
32 GT/s bandwidth per lane, per direction (4x the bandwidth of PCIe 3.0)
128/130 bit encoding (= 1.5% overhead)
Implements electrical changes to improve signal integrity and mechanical performance of connectors
Physical connector

There are no more precise technical details about the Iris-Xe-Max-GPU. According to previous information, the same expansion stage comes here with 96 EUs used, as with the fastest Tiger Lake processors. However, a dedicated GPU with the same expansion level should clock much higher, since it can produce a higher power consumption and waste heat. For the Tiger Lake processors we have a Core i7 – 1185 G7 a measure of 1, 35 GHz a maximum power consumption 14 W measured – only for the integrated GPU. The dedicated variant should be allowed to accept significantly more without compromising the CPU package.

Lean, correct code and therefore maximum security are principles that the developers of the BSD operating system (Berkeley Software Distribution) OpenBSD have adhered to since 25 years. Yesterday, Sunday, OpenBSD founder Theo de Raadt published the 49. Version of the free Unix derivative with freely accessible source code.

OpenBSD 6.8 runs on POWER9 Among many large and small innovations, the support for Power-ISA v3.0 (“POWER9”) from the OpenPOWER Foundation under the leadership of IBM stands out. The porting to the modern architecture started with OpenBSD 6.7 in May of this year. OpenBSD 6.8 / powerpc 49 runs on machines from “Raptor Engineering” in the form of the Raptor Talos II (workstation with two 4/8 / 18 / 22 – Core POWER9 CPUs, PCI Express 4.0, auditable OpenBMC firmware) and the Micro-ATX mainboard Raptor Blackbird (single socket Micro-ATX, up to 18 cores, maximum 256 GByte RAM).

OpenBSD 6.8 can also be started on IBM PowerNV systems (non-virtualized), but unfortunately not (yet) under a hypervisor like PowerVM or PowerKVM. The POWER9 developments from Rackspace and Google should be exciting in the future: Barreleye G2 at Rackspace and Zaius at Google are to be rolled out in their gigantic data centers. The high CPU performance per watt and security functions such as the Harvard architecture for the caches (separate data and instruction cache) could be reasons for looking for an alternative to AMD, Intel and ARM.

Scant information about installing deliver the platform documentation for OpenBSD 6.8 / powerpc 64 and the still very clear openbsd -ppc mailing list. According to the developers, OpenBSD 6.8 has not yet been tested on POWER8 systems. OpenBSD 6.8 is still available for older PowerPC platforms (Apple Macintosh G4 / G5, PPC-iMac and Mac mini).

Don’t miss any news! With our daily newsletter you will receive all the news from heise online every morning from the past 24 hours.

Faster time measurement Software such as web browsers and Office programs ran under OpenBSD with the “handbrake on” until now. One of the reasons was the frequent queries of the system time by these programs. Many of these gettimeofday (2) system calls have been optimized by the OpenBSD developers so that important desktop software in the new version can be used on the amd 49, arm 64 and sparc 64 runs noticeably smoother.

For the popular architectures amd 64 and arm 64 got OpenBSD 6.8 many Improvements, new features and more drivers. For example, the Pinebook Pro, which is apparently popular with OpenBSD developers, now runs with a dimmable display, a functioning battery indicator and ES 8316 sound . IoT developers can look forward to the arm 49 disassembler, ported by NetBSD, which works with the kernel debugger ddb (4) cooperates. Older platforms are also maintained at OpenBSD, so i 256 received an NVMe driver.

Also at the IEEE 802. 11 – Wireless stack eliminated some problems, so that, for example, the Raspberry Pi 3 (exactly this one!) With a WLAN chip set in HostAP mode, a minimal DHCP server and a few lines in the configuration file pf.conf / 5) of the pf packet filter into a WLAN access point.

With a few modifications and a minimal DHCP server, a Raspberry Pi 3 becomes an access point within a very short time.

(Image: screenshot)

Terminal multiplexer tmux With the terminal multiplexer tmux used in OpenBSD, the Data transmission significantly optimized. Some changes in the front end make working with tmux easier – for example with a new command line completion that shows possible completions as a menu. The search process in tmux has been further adapted to the behavior of emacs – friends of vi will grind their teeth.

The modern and native OpenBSD hypervisor VMM / VMD is now pleasantly stable and has received little news , with LDOM / SPARC 49, however, the VM start process has been improved in many places.

Compared to ZFS (FreeBSD), HAMMER2 (Dragonfly BSD) or Btrfs (GNU / Linux), the FFS2 file system looks much outdated; In view of the primary areas of application of OpenBSD as a secure appliance or developer notebook, the developers see little need for action here. Nevertheless, FFS2 received extensions, can now handle significantly larger file systems and performs faster file system checks.

Security and Networks OpenBSD 6.8 is now supported with LLVM / Clang 10, GCC is included in the heavily patched versions 4.2.1 and 3.3.6 for compatibility reasons – newer versions are not acceptable because of their license for OpenBSD. LibreSSL, the slim and secure alternative to OpenSSL, is available in version 3.2.2, OpenSSH as 8.4 and the OpenSMTPD, which was developed from scratch some time ago, as version 6.8.

As usual, there are countless small ones Innovations and fixes in the areas of security and network have been incorporated. In addition, a lot of old and unsafe code was disposed of: The number of available

Asus rushes ahead and shows the first notebook with Intel’s independent graphics chip DG1 – even before the chip manufacturer even presented the GPU. The VivoBook Flip 14 (TP 470 EZ) is a 14 inch 2-in-1 device with IPS touchscreen (1920 × 802 pixels) and pen support.

Asus combines a Tiger Lake U processor with Intel’s DG1 GPU. On the product page for the upcoming VivoBook Flip 14 the manufacturer only speaks still from “Intel’s first stand-alone GPU”. In an earlier version the brand name Iris Xe Max was noted.

This can also be found in the benchmark database from SiSoftware Sandra, which is attached to the graphics chip 768 attributes to shader cores – as much as the integrated graphics unit from Tiger Lake-U. The separate GPU with its own 4 GB memory, probably faster GDDR6 RAM, could achieve a speed advantage. In the previous VivoBook flip notebooks, Asus dispensed with independent graphics chips and relied solely on Intel processors.

Asus VivoBook Flip 14 (8 pictures) (Image: Asus) Tiger Lake + Thunderbolt 4 In the upcoming VivoBook Flip 14 either a Core i7 – 1165 G7 or Core i5 – 1135 G7. Both use four CPU cores with Hyper-Threading (eight threads) and differ in terms of clock frequencies and the size of the level 3 cache. The CPU accesses either 8 or 16 GByte LPDDR4X – 4266 – RAM back. Asus installs a GB to 1 TB PCI-Express SSD as M.2 Card.

As usual with the Tiger Lake generation, Thunderbolt 4 is available as USB-C Connection included. Two type A ports are available as USB 3.2 Gen 2 (10 GBit / s) or USB 2.0 connected. HDMI, audio jack and micro SD card reader round off the connections. The VivoBook Flip 14 transmits via Wi-Fi 6 (WLAN 802. 11 ax) and Bluetooth 5.0. It is 18, 7

AMD is allegedly mixing two chip designs with the code name Cezanne (Zen 3) and Lucienne (Zen 2). The top model Ryzen 7 5800 U with eight Zen 3 cores, 16 Threads thanks to Simultaneous Multithreading (SMT) and 16 MByte level 3 cache start. AMD doubles the buffer memory compared to its predecessor Ryzen 7 4800 U.

The Ryzen 7 5600 U is supposed to be a new edition of the Ryzen 7 4800 U: nominally only with 100 to 200 MHz less clock frequency and still 8 MB L3 cache, but due to the Zen-2 architecture with less power per cycle. The same game at Ryzen 5 5600 vs. Ryzen 5 5500 U and Ryzen 3 5400 U vs. Ryzen 3 5300 U. The graphics architecture should continue to be based on Vega in both cases, with the top model Ryzen 7 5800 U with 512 but one shader core 250 MHz high clock increase to 2.0 GHz received.

The specifications come from Twitter user “ExecutableFix”. Rumors about a mix of two chip designs in AMD’s upcoming notebook series were circulating according to TechPowerUp as early as September 2020. The code name “Lucienne” and a matching order number (OPN) named Igor’s Lab in August 2020.

processor Architecture Cores / Threads Base / Boost clock L3 cache GPU TDP Ryzen 7 5800 U Cezanne / Zen 3 8th / 16 2.0 / 4.4 GHz 16 MByte Vega 8 , 2000 MHz 15 W Ryzen 7 5700 U Lucienne / Zen 2 8 / 16 1.8 / 4.3 GHz 8 MByte Vega 8, 1900 MHz 15 W Ryzen 5 5600 U Cezanne / Zen 3 6 / 12 2.3 / 4.2 GHz 12 MByte Vega 7, 1800 MHz 15 W Ryzen 5 5500 U Lucienne / Zen 2 6 / 12 2.1 / 4.0 GHz 8 MByte Vega 7, 1800 MHz 15 W Ryzen 3 5400 U Cezanne / Zen 3 4/8 2 , 6 / 4.0 GHz 8 MByte Vega 6, 1600 MHz 15 W Ryzen 3 5300 U Lucienne / Zen 2 4/8 2.6 / 3, 85 GHz 4 Mbytes Vega 6, 1500 MHz 15 W Differentiation by means of CPU architecture In the 2020 AMD differentiates the models through SMT: The Ryzen 7 4800 U is working 16 Threads from Ryzen 7 4700 U 8. The six-core Ryzen 5 4600 U comes on 12, the little brother Ryzen 5 4500 U to 6. With the successors there would be a gradation due to the different performance per measure (Zen 3 vs. Zen 2) with continuously activated SMT.

From next Thursday (22. October 2020) the discounter Aldi has again new desktop PCs and a gaming notebook on offer. If you go shopping at Aldi Süd, you can also purchase another desktop PC with the Medion Akoya E 63007. At Aldi Nord, however, only the Medion Akoya P 67064 and the Medion Erazer Deputy P 10 to be available.

The Medion Akoya E 63007 has an Intel Core i5 9400 processor with Intel UHD graphics 630 over a total of 16 GB RAM and a 512 GB PCIe SSD. In addition, the Aldi PC has a hot-swap hard disk removable frame. A multi-card reader for SD / MS / MMC memory cards is also on board. In addition to Gigabit LAN, the E 63007 Wi-Fi 6 (AX 200 – Gigabit WLAN) with integrated Bluetooth function. Windows Home is used as the operating system. The dimensions are 170 mm x 380 mm x 385 mm (W x H x D) with a total weight of 7 kg. To call the E 63007 his own, around 500 euros are due.

With the Medion Akoya P 67064, both Aldi-Nord and Aldi-Süd customers can purchase a desktop PC that, in addition to an Intel Core i5 – 10400 relies on an NVIDIA GeForce GTX 1660 SUPER with 6 GB GDDR6 VRAM. In addition, the computer has 15 GB of RAM (2. 666 MHz) and a 1 TB PCIe SSD. Here, too, comes Intel’s AX 170 – Gigabit WLAN with integrated Bluetooth function and Windows 10 Home for use. The dimensions of the Akoya P 67064 are 75 mm x 380 mm x 385 mm with a weight of 7, 75 kg. The offer price is 999 euros.

If you, however, use the gaming notebook Medion Erazer Deputy P 10 wants to increase, receives an Intel Core i7 for just under 1. 385 Euro – 10750 H as well as an NVIDIA GeForce RTX 2060 with 6 GB GDDR6 VRAM. The 15, 6 inch Aldi laptop