Home/Tech News/Intel ‘Atlas Canyon’ NUC 11 Essential to feature Jasper Lake processors
João Silva 15 hours ago Tech News
A new leak shows that Intel is working on a new affordable NUC powered by Jasper Lake processors. Codenamed ‘Atlas Canyon’, the NUC 11 Essential leak details its specifications and a possible release date, which might be as late as Q1 2022 due to the ongoing chip shortage.
The leak, which was shared by FanlessTech, shows Intel has apparently removed the 2.5-inch drive from its predecessor and replaced it with an M.2 slot. The small and compact casing includes an active cooling system, but a fanless system seems doable given the low TDP.
The slide below shows that there will be three CPU options: the 4C/4T Pentium Silver J6005 (up to 3.3GHz), the 4C/4T Celeron J5105 (up to 2.9 GHz), and the 2C/2T Celeron J4505 (up to 2.7 GHz). The NUC 11 Essential support up to 16GB of DDR4-2933 memory in dual-channel configuration and up to 2x 4K displays. Some models include 64GB of eMMC storage.
Image credit: FanlessTech
Featuring a vast set of connectivity ports and features, the NUC 11 Essential supports Wi-Fi 6, Bluetooth 5.2, and 1Gbps Ethernet connectivity. As for the ports, there’s an HDMI 2.0b port, a DisplayPort 1.4, 2x front USB-A 3.1 ports, 2x rear USB-A 3.1 ports, 2x rear USB-A 2.0 ports, an audio-in 3.5mm jack, and an audio-out 3.5mm jack.
The NUC 11 Essential will be reportedly available as a mini PC, a barebone kit, and as a board only. All should feature a 3-year warranty.
KitGuru says: Despite its entry-level specs, the NUC 11 Essential is very useful as a media PC for the living room or as a work computer that can be mounted on the back of a mid-size monitor to save some desk space.
The specifications for Intel’s NUC 11 Essential (Atlas Canyon) device have emerged, courtesy of FanlessTech. The upcoming NUC utilizes the chipmaker’s 10nm low-powered Jasper Lake processors.
Armed with Tremont cores, Jasper Lake checks in with thermal limits between 6W and 10W, so it doesn’t require any serious cooling. The NUC 11 Essential will be available with three different processor options. The Pentium Silver J6005 and Celeron J5105 are quad-core parts, while the Celeron J4505 is a dual-core chip. Neither processor leverages Hyper-Threading technology.
Intel outfitted the NUC 11 Essential with two SO-DIMM memory slots so you can pair either Jasper Lake processor with up to 16GB of DDR4-2933 memory at 1.2V. Some select models will come equipped with 64GB of eMMC storage, but the NUC 11 Essential offers a single M.2 2280 slot for housing NVMe and SATA drives.
As FanlessTech has noted, this is the first time that an entry-level NUC is arriving with a M.2 slot as opposed previous designs with spacing for a 2.5-inch drive. This helps trim down the size of the NUC as the NUC 11 Essential has a 135x115x36mm footprint.
The NUC 11 Essential lands with one HDMI 2.0b port and one DisplayPort 1.4 output. Both connectors support HDCP 2.2 as well as 4K monitors, so you can connect up to two 4K displays to the NUC 11 Essential. You’ll still be limited by Jasper Lake’s Intel UHD graphics engine. The iGPU is an abysmal gaming performer, but should be sufficient for conventional workloads.
The NUC 11 Essential only has a single Gigabit Ethernet port. If you’re a wireless aficionado, however, you can take advantage of the speedy Wi-Fi 6 AX101 and Bluetooth 5.2 connectivity on the NUC. There are two 3.5mm audio connectors on the front of the device. The NUC 11 Essential supports 7.1-audio through the HDMI port.
Don’t let the NUC 11 Essential’s small body fool you. The device offers enough connectivity options to be your daily driver. There are two front USB 3.1 ports, two rear USB 3.1 ports, and two rear USB 2.0 ports. The NUC sips power through a standard 19VDC 65W power supply.
Intel backs the NUC 11 Essential with a limited three-year warranty. There was no mention of pricing. According to FanlessTech, the NUC won’t arrive until the first quarter of next year.
Samsung announced two entry-level Galaxy Book laptops at its Unpacked event: the Galaxy Book and the Galaxy Book Flex2 Alpha. The former will start at around $800 (according to Samsung, that price is subject to change) and will launch in the second half of 2021, whereas the Flex2 Alpha starts at $849 and is available for preorder now, shipping in mid-May. These round out the fleet of premium models announced today, including the Galaxy Book Pro and Pro 360 with OLED screens that start at $999, and the $1,399 Galaxy Book Odyssey gaming laptop that’s the first to sport Nvidia’s new RTX 3050 Ti graphics card.
Starting with the Galaxy Book, it has a 15.6-inch 1080p TFT LCD display, and it supports up to two fast NVMe SSDs. It has two USB-C ports (one of which can recharge the laptop with the included 65W charger), two USB-A 3.2 ports, an HDMI port, a headphone jack, a microSD card slot, and an optional nano SIM tray for LTE.
The silver color of the Galaxy Book.Image: Samsung
Samsung’s mobile press site shows that the Intel Pentium Gold or Celeron processor may show up in some models globally, but the company hasn’t confirmed what will be in the starting configuration in the US. A Samsung spokesperson told The Verge that the final price and specs will be announced closer to its launch in the second half of 2021.
According to the site linked above, if you need more power, you’ll be able to bump it up to 11th Gen Intel Core i5 or i7 processors, with the option of taking advantage of their Iris Xe integrated graphics, or you can opt for Nvidia’s GeForce MX450 discrete graphics. The Galaxy Book can be upgraded to 16GB of RAM.
Rounding out the specs, the Galaxy Book comes in silver or blue, and every configuration will have a 54Wh battery. Similar to the Galaxy Book Pro lineup, this one supports Dolby Atmos audio. Its webcam is a 720p HD sensor with a dual array mic.
The Galaxy Book Flex2 Alpha will launch in black, blue, or silver.Image: Samsung
If you want a 2-in-1 laptop with a better QLED screen that’s still not as expensive as the Galaxy Book Pro, Samsung also announced two sizes (13.3 and 15.6 inches) of the new Galaxy Book Flex2 Alpha. Each model has a 1080p QLED display, and either Intel’s 11th Gen i5 or i7 processors. The price for the 13-inch model starts at $849.
The starting configuration includes 8GB of RAM, but supports up to 16GB, and the storage tops out at 512GB. It has a standard selection of ports, including two USB-A 3.0 ports, a USB-C port, a headphone jack, a power plug, HDMI, and a microSD slot. Like the Galaxy Book, this model also has a 54Wh battery.
Matthew Wilson 1 day ago Featured Tech News, General Tech
MSI has been dabbling in the world of all-in-one PCs for a while now and this week, we’re getting some brand new models. Today, MSI announced the Modern AM241 and Modern AM271 series of all-in-one PCs, featuring Intel 11th Gen processors.
The new Modern 24 and 27 series PCs are designed with efficiency and productivity in mind, while also looking rather elegant. Each system comes with an OPS display for wide viewing angles and better colours. Under the hood, you’ll find an Intel 11th Gen Core series processor, with MSI offering up to an Intel Core i7-1165G7, but Core i3 and Core i5 configurations are also available.
In the table below, you can see the full specification list for the MSI Modern AM241 and AM271 PCs:
Specification
Modern AM241
Modern AM241T
Modern AM241P
Modern AM241TP
Modern AM271
Modern AM271P
CPU
Up to Intel® Core™ i7-1165G7
OS
Windows 10 Home – MSI recommends Windows 10 Pro for business
23.8″ IPS Grade Panel LED Backlight (1920*1080 FHD) with MSI Anti-Flicker technology
23.8″ IPS Grade Panel LED Backlight (1920*1080 FHD) with MSI Anti-Flicker technology
27″ IPS Grade Panel LED Backlight (1920*1080 FHD) with MSI Anti-Flicker technology
27″ IPS Grade Panel LED Backlight (1920*1080 FHD) with MSI Anti-Flicker technology
TOUCH PANEL
Non-Touch for Modern AM241 /
In-cell 10-Point Touch for ModernAM241T
Non-Touch for Modern AM241P /
In-cell 10-Point Touch for ModernAM241TP
Non-Touch
Non-Touch
ADJUSTABLE STAND
-5° ~ 15° (Tilt)
-4° ~ 20° (Tilt) ;
0 ~ 130mm (Height)
-5° ~ 15° (Tilt)
-4° ~ 20° (Tilt) ;
0 ~ 130mm (Height)
OPTICAL DRIVE
N/A
AUDIO
2 x 2.5W Speakers
LAN
1 x RJ45 (10/100/1000)
WIRELESS LAN
Intel 9462 AC / AX201 AX (either one)
BLUETOOTH
5.1
USB 3.2 PORT
4 (2x USB 3.2 Gen 2 Type C, 2x USB 3.2 Gen 2 Type A)
USB 2.0 PORT
3
HDMI IN
1
HDMI OUT
1
AUDIO
1x Mic-in/Headphone-out Combo
5-WAY NAVIGATOR
1
KEYBOARD / MOUSE
Optional
AC ADAPTER
90W / 120W (Core i3 above)
AIO WALL MOUNT KIT III
Support Standard VESA Mount (75x75mm)
DIMENSION (WXDXH)
541.40 x 175.09 x 406.86 mm (21.31 x 6.89 x 16.02 inch)
541.40 x 194.68 x 534.92 mm (21.31 x 7.66 x 21.06 inch)
611.75 x 169.96 x 436.06 mm (24.08 x 6.69 x 17.17 inch)
611.75 x 169.96 x 553.52 mm (24.08 x 6.69 x 21.79 inch)
NET WEIGHT
4.65 kg (10.25 lbs)
6.16 kg (13.58 lbs)
5.82 kg (12.83 lbs)
7.42 kg (16.36 lbs)
GROSS WEIGHT
7.35 kg (16.20 lbs)
8.45 kg (18.63 lbs)
8.60 kg (18.96 lbs)
10.00 kg (22.05 lbs)
With more people working from home and relying on virtual meetings, MSI has bumped up the specs of the webcam, delivering 1080p quality. The option to remove the webcam is also there for those concerned about privacy.
Using MSI Instant Display Technology, the Modern AM series can also be used as a standalone monitor for a second system, meaning you don’t have to boot up the PC hidden behind the display. These all-in-one systems also support using a second monitor through an additional HDMI output. Standard VESA mounts are supported for those who prefer having a monitor arm – MSI even has a ready to go solution for that with the VESA Arm MT81.
We’re still waiting on pricing and availability information, but we’ll update if/when we hear more. Discuss on our Facebook page, HERE.
KitGuru Says: Do any of you use an all-in-one PC for work at all? What do you think of the new MSI Modern series systems?
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Popular CPU temperature monitoring utility Core Temp recently got patched to version 1.17 with a few new updates, including support for not only Intel and AMD’s latest and best CPUs, but some chips yet to be released as well.
Core Temp version 1.17 adds full support for Rocket-Lake-S, which includes chips like the new Core i9-11900K. It also brings preliminary support for both Intel’s 12th Gen Alder Lake desktop CPUs, which aren’t expected to arrive until late 2021 or early 2022, and Intel’s 3D-stacked Meteor Lake chips, poised for a 2023 release.
It’s very interesting to see Alder Lake support already because this new CPU architecture is radically different from anything Intel has produced so far. That means it will need some new types of monitoring to measure CPU core temperatures. Similar to the design of Arm chips, like the Apple M1 and other smartphone chips from Qualcomm and Samsung, the line will introduce a hybrid architecture. In the case of Alder Lake, this is a hybrid x86 architecture with two tiers of CPU cores: One set of high-performance cores and one set of high-efficiency cores.
Alder Lake will also be Intel’s first desktop architecture to finally move off the super mature 14nm process and will instead use Intel’s newly refined 10nm SuperFin process. SuperFin promises to achieve much higher performance-per-watt compared to 14nm.
So to monitor temperatures, programs like CoreTemp will have to monitor both the high-performance cores and the low-power cores, plus all the other sensors like CPU die and package temperature. Hopefully, CoreTemp will figure out a way to give users all this data without being overwhelming or confusing.
This same logic should also apply to Meteor Lake, which (for now) is also believed to have a hybrid x86 architecture featuring low-power and high-performance cores. Unlike Alder Lake, Meteor Lake is expected to be shipped on Intel’s new 7nm EUV process. We don’t know the exact details on this node, but it should provide a hefty efficiency upgrade over 10nm SuperFin if Intel wants to maintain its competitive edge against TSMC’s 7nm and 5nm nodes.
Speaking of TSMC, Intel is planning on using some of TSMC’s silicon for select Meteor Lake products in the future to offset recent delays related to its homebrewed 7nm node. To make this a reality, Meteor Lake will come with a 3D-stacked architecture, which will allow Intel to swap out Intel silicon for TSMC silicon and vise-versa.
Other Updates and Bug Fixes
In addition to new support for Intel CPUs, Core Temp version 1.17 also adds full support for AMD’s latest Ryzen 5000 processors, as well as its for Zen 2 -based APUs, which include all of AMD’s Ryzen 4000 mobile CPUs and some of AMD’s Ryzen 5000 mobile processors.
The update also brings numerous bug fixes, which we’ve listed below.
“Unsupported CPU” message when only some cores have HT enabled
AMD Epyc Rome/Threadripper 3rd gen platform detection
Gemini Lake platform detection
Whiskey Lake codename
Incorrect VID reporting on some Celeron/Pentium processors
Crash on Intel Banias based (Pentium/Celeron M) processors
Turbo multiplier detection on Nehalem/Westmere
Bugs related to response to DPI changesVID reporting on some AMD Athlon64 processors
Changes:
AMD Bulldozer based processors now display the amount of modules/threads instead of cores/threads
Improve accuracy of information on unsupported Intel CPUs
With Rocket Lake’s release date approaching, testers are getting their hands on more and more SKUs from Intel’s future Rocket Lake lineup; this time, we have benchmark results of Intel’s future Core i5-11600K (thanks to @Leakbench). The 11600K was found running the Geekbench 5 benchmark with mediocre performance at best, though, as usual, pricing will determine if it lands on our list of Best CPUs.
According to the spec sheet found on Geekbench 5’s browser, the Core i5-11600K packs 6 cores and 12 threads with a 3.9GHz base frequency along with a max turbo frequency of 4.9GHz. Nothing is unusual here; this is where we would expect a 11600K to land. Excluding the rare unlocked Core i3 and Pentium, the unlocked Core i5s have traditionally been the lowest clocked chips out of all the “K” SKUs.
That’s not all that will be slowing down Intel’s 11600K, unfortunately. The system configuration for the 11600K shows it being paired with super-slow DDR4-2133 memory. This will noticeably hamper performance, so take the upcoming benchmark results with another dose of salt — they certainly won’t represent what we’ll see in our CPU benchmark hierarchy when these chips come to market.
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(Image credit: Geekbench 5)
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(Image credit: Geekbench 5)
In the Geekbench 5 results, the Core i5-11600K scores 1565 points in the single-threaded test and 6220 points in the multi-threaded benchmark. These results are quite underwhelming, especially in the multi-core department where even AMD’s older Ryzen 5 3600 beat the 10600K by 7.6% (or roughly 400 points).
When it comes to single-core performance, the 11600K fares better, but it’s still the slowest CPU out of all known Rocket Lake SKUs and AMD Zen 3 CPUs to date. Luckily, the 11600K does take a major win against Comet Lake-S parts like the 10900K, beating that chip by 11%.
Again though, take these results with a huge grain of salt. Geekbench 5 already has a poor reputation for translating well to real-world results, and adding in slow memory complicates the findings.
The Rocket Lake release is coming soon next month, so hopefully, by that time we’ll have a review sample of the 11600K to test for ourselves and give you an in-depth look into how this chip really performs against our best gaming CPUs.
AMD’s Ryzen 3000 and Athlon processors (including the unlocked $49 Athlon 3000G) have shaken up the low-cost landscape and made a splash on our CPU Benchmark Hierarchy, but crushing shortages of chips has gripped the industry, which impacts the low end of the market in a particularly painful way. So even though quad-core models with gaming-capable integrated graphics have an MSRP for a mere $100, and the Athlon lineup now dips below 50 bucks (although it’s not always easy to find the 200GE at the moment), supply is short. Intel’s response to AMD’s challenge has brought Hyper-threading to its low-end Pentium processors and two additional cores to the Core i3 line, which greatly improves performance for its budget chips even though they’re still limited in terms of their graphics.
AMD hasn’t released its Ryzen 5000 chips for the low-end yet; the series bottoms out at the Ryzen 5 family. We expect that Ryzen 3 models will come in due course, shaking up our low-end rankings. Intel also has its Rocket Lake processors incoming next month, but these chips will use the refreshed Comet Lake architecture for the Core i3 and below chips, so they probably won’t have much impact on our rankings.
The 200-series AMD chips are surprisingly capable at gaming even without a dedicated card. For more details about how the 200GE stacks up against Intel’s comparable budget chip, see our feature AMD Athlon 200GE vs. Intel Pentium Gold G5400: Cheap CPU Showdown.
For those looking for something with a bit more gaming prowess without having to resort to a dedicated graphics card, AMD’s Ryzen 5 3400G is tough to beat. While the Ryzen 4000 APUs are faster, they’re not readily available and cost a lot more. The 3400G is a solid option but doesn’t offer a big performance boost over previous-generation chips like the Ryzen 5 2400G.
If your budget is a bit more flexible and you’re looking to pair your processor with dedicated graphics for gaming, AMD’s Ryzen 3 3300X is great if you can find it at retail around the MSRP of $120, and Intel’s new Core i5-10600KF is impressive at about twice that amount. But like so many other PC components, both of these processors are hard to find in stock at reasonable prices. Hopefully availability will improve over time, but it probably won’t happen until later in 2021, at which time we’ll have new processors.
When choosing a CPU, consider the following:
You can’t lose with AMD or Intel: Both companies offer good budget chips, and overall CPU performance between comparative parts is closer than it’s been in years. You can see how the chips stack up in our CPU Benchmark Hierarchy. That said, if you’re primarily interested in gaming, Intel’s chips will generally deliver slightly better performance (and consume more power) when paired with a graphics card, while AMD’s Raven Ridge models (like the AMD Ryzen 3 2200G) do a better job of delivering gaming-capable performance at modest settings and resolutions without the need for a graphics card.
Clock speed is more important than core count: Higher clock speeds translate to snappier performance in simple, common tasks such as gaming, while extra cores will help you get through time-consuming workloads faster.
Budget for a full system: Don’t pair a strong CPU with weak storage, RAM and/or graphics.
Overclocking isn’t for everyone, but the ability to squeeze more performance out of a budget offering is enticing. Intel doesn’t have overclocking-capable processors for the sub-$125 market, but AMD’s processors allow for tuning, and in most cases the bundled AMD cooler is sufficient for the task. Automated overclocking features in most motherboards make the process easy, so even the least tech-savvy users can enjoy the benefits.
For even more information, check out our CPU Buyer’s Guide, where we discuss how much you should spend for what you’re looking to do, and when cores matter more than high clock speeds. If you can expand your budget and buy a mainstream or high-end processor, check out our lists of Best CPUs for Gaming and Best CPUs for Applications. Below, you’ll see our favorite budget picks.
The Ryzen 3 3300X unlocks a new level of performance for budget gamers with four cores and eight threads that can push low- to mid-range graphics cards to their fullest. This new processor wields the Zen 2 architecture paired with the 7nm process to push performance to new heights while enabling new features for low-end processors, like access to the speedy PCIe 4.0 interface. The 3300X’s four cores tick at a 3.8 GHz clock rate and boost to 4.3 GHz, providing snappy performance in lightly threaded applications, like games.
AMD includes a bundled Wraith Spire cooler with the processor. Still, you might consider budgeting in a better low-end cooler to unlock the full performance, particularly if you are overclocking. Speaking of which, the Ryzen 3 3300X can overclock to the highest all-core frequencies we’ve seen with a Ryzen 3000-series processor, making it a great chip for enthusiasts. Unlike AMD’s other current-gen Ryzen 3 processors, you’ll need to pair this processor with a discrete GPU, but the low price point leaves extra room in the budget for a more capable graphics card.
You can stick with the value theme and drop this capable chip into existing X470 of B450 motherboards, but you’ll lose access to the PCIe 4.0 interface in exchange for a lower price point. Better yet, AMD will have its new B550 motherboards on offer in June 2020. These new motherboards support the PCIe 4.0 interface but provide lower entry-level pricing that’s a better fit for this class of processor.
When money is tight, being able to game without a graphics card can lead to serious savings. And with RAM prices continuing to soar, those working with small budgets need to tighten the strings anywhere they can.
That makes the four-core, four-thread Ryzen 3 2200G particularly appealing for budget gaming builders and upgraders. The $99 chip delivers solid 720p performance thanks to its Vega on-chip graphics, decent CPU muscle for mainstream tasks, and can be dropped into an existing inexpensive 300-series motherboard (after a requisite BIOS update), to form the basis of a surprisingly capable low-cost PC. It’s also unlocked, so with proper cooling you can tune the graphics or the CPU to best suit your needs.
Overclocking is possible, though officially unsupported
All models provide similar performance after overclocking
Reasons to Avoid
Graphics engine and memory can’t be overclocked
Weak single-threaded performance
AMD’s Athlon 240GE serves as the flagship of the company’s budget lineup, but it still packs a convincing punch for low-end gaming systems. The integrated Radeon Vega 3 graphics facilitate playable frame rates at lower resolutions and quality settings, but the 3.5 GHz base clock is the only differentiating feature between the Athlon 240GE and its counterparts. Due to the unofficial support for overclocking, that means you can tune the Athlon 200GE to the same top performance as the more expensive chips, but at a $20 price savings.
If overclocking isn’t in your plans, the Athlon 240GE is the best budget chip in its price band. Intel’s competing Pentium lineup lacks the graphical horsepower to be serious contenders for the extreme low-end of the budget gaming market, but they are attractive if gaming isn’t your primary goal. That is, of course, if you can find them.
Overclocking is possible, though officially unsupported
All models provide similar performance after overclocking
Reasons to Avoid
Graphics engine and memory can’t be overclocked
Weak single-threaded performance
AMD’s sub-$60 Zen-based Athlon is a good all-around value, thanks to its four computing threads and Vega 3 graphics that are capable of light gaming at lower resolutions and settings. Lightly threaded performance isn’t great, but when you’re spending this little on a CPU, you should expect compromises somewhere. And while it isn’t officially supported by AMD, if you have a compatible motherboard, this chip can be overclocked to eke out some extra CPU performance.
If your build budget can swing it, the $100 Ryzen 3 2200G is a much better chip with more cores and beefier graphics. But if you can only spend $60 or less on your CPU and you aren’t adding a dedicated graphics card, the Athlon 200GE is tough to beat. Intel’s competing Pentiums, the Gold G5400 and G4560, deliver better CPU performance. But they have higher MSRPs, and production shortages have made them hard to find unless you’re willing to spend close to $100 or more, making them incomparable in terms of budget CPUs.
Read: AMD Athlon 200GE Review
Integrated Graphics Gaming Performance
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You won’t find many game titles that will play well at the popular 1920X1080 resolution on the sub-$80 chips, but there are a few. As we can see, AMD’s $100 Ryzen 3 2200G is the undisputed king of the hill for 1080p gaming on integrated graphics, but the Athlon chips also push out playable frame rates in a few titles (if you’re willing to tolerate lower graphics quality settings).
Switching over to 1280×720 finds the Athlon processors providing up to 50 FPS at stock settings and experiencing a decent performance boost from overclocking. Remember, all of the Athlon chips will benefit equally from overclocking, meaning the Athlon 200GE and 220GE will achieve the same level of performance as the overclocked Athlon 240GE. That’s an amazing value for these low-cost chips. It should go without saying, but the Ryzen 3 2200G’s Radeon Vega 8 graphics engine blows through the 1280×720 tests with ease.
Intel’s Pentium lineup, and even the Core i3-8100 for that matter, struggle tremendously under the weight of these titles. Gaming at 1920×1080 is a painful experience: You won’t find many games that are playable on Pentium processors at that resolution. Switching over to the 1280×720 resolution brings the Core i3-8100 and Pentium G5600 into acceptable territory, but those chips still can’t match the Athlon’s performance, not to mention the crazy good savings. Intel’s Pentium G5400 is particularly disappointing, though, due to its pared-down UHD Graphics 610 engine. We wouldn’t recommend this processor for gaming on integrated graphics.
But it’s hard to recommend Pentium processors at all right now. Intel is struggling with a shortage of 14nm production capacity, so these chips are extremely hard to find, and when you do find them, they are subject to severe price gouging.
Discrete GPU Gaming Performance
We focus primarily on integrated graphics gaming performance for ultra-budget chips, but these processors are also a great pairing with low-end discrete graphics cards. Below, we’ve tested the chips paired with an Nvidia GeForce GTX 2080 at the 1920×1080 resolution to remove any GPU limitations from our tests below. We tested with an Nvidia GeForce 1080 FE graphics card to remove graphics-imposed bottlenecks, but the difference between the processors will shrink with the cheaper graphics cards that are commonly found in budget builds. Provided the performance deltas are small, you can select less expensive models and enjoy nearly the same gaming experience with graphics cards on the lower-end of the GPU benchmarks hierarchy.
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Intel’s Coffee Lake Pentium models come with slight frequency improvements, a 3W increase in the TDP rating, and 4MB of L3 cache. These slight adjustments deliver a surprising boost to performance compared to the previous-gen Kaby Lake models. The Coffee Lake Pentium Gold G5600 even beats out the Kaby Lake Core i3-7100 in most of our gaming benchmarks, highlighting the impressive performance gains Intel made within a single generation.
The G5600 grapples with the Ryzen 3 2200G. The Ryzen 3 2200G is relatively simple to overclock with single-click options in the BIOS, and the bundled cooler provides enough headroom for all but the most extreme overclocking efforts. At stock settings, the 2200G trails the Intel Pentium Gold 5600, but the advantage of AMD’s unlocked multipliers is clear: At $99, the tuned Ryzen 3 2200G’s performance nearly matches the $117 Core i3-8100.
The Ryzen 3 2200G also comes with powerful integrated graphics that provide surprisingly strong gaming performance at lower resolutions and quality settings. That’s a feat the Core i3-8100 simply cannot match. If you’re seeking the absolute best gaming performance (when paired with a dedicated card) regardless of price, the Core i3-8100 fits the bill. If you want the most bang for your buck or plan on gaming on integrated graphics, the Ryzen 3 2200G is the clear value winner.
Productivity Performance
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The Core i3-8100’s solid mixture of frequency and IPC throughput delivered to our expectations. The agile processor took the lead in several of our lightly-threaded applications, like the Adobe Cloud suite, but it is also surprisingly powerful in threaded workloads. The Intel Core i3-8100 also offers superior performance in applications that use AVX instructions, like HandBrake, which is a great addition to its impressively well-balanced repertoire. Much like we observed in our gaming tests, the Core i3-8100 offers the best overall performance.
Even after overclocking, the AMD Ryzen 3 1300X isn’t competitive enough with the Core i3-8100 to justify its higher price tag, and the lack of integrated graphics also restricts its appeal.
The Ryzen 3 2200G continues to impress with its lower price point and competitive performance, not to mention the integrated Vega graphics, making it the obvious choice for budget builders who are willing to spend a little extra time on tuning.
The Pentium lineup excels in most applications, but the Athlon processors also offer an impressive level of performance. It’s also noteworthy that Intel’s Pentium processors don’t accelerate AVX instructions, a staple in many types of rendering applications, while the Athlon processors fully support the densely-packed instructions. Intel’s chips lead in lightly-threaded applications, like web browsers, but the competing AMD chips also offer more than suitable performance in those workloads.
Intel recorded slightly lower sales and profits in the fourth quarter of last year. However, they have fallen less than expected. Intel closes the full year 2020 with a new sales record.
As recently as October, Intel had a significant drop in sales for the last quarter 2020 to 17, $ 4 billion feared. It turned out to be 20 billion dollars. Nevertheless, sales are one percent below the same quarter last year. Operating profit fell percent to $ 6.3 billion. The net profit in the fourth quarter 2020 is even by 15 percent also fell to 5.9 billion dollars.
Fifth record year in a row In the entire year 2020 Intel 39 has turned over 9 billion dollars, eight percent more than 2019. According to outgoing Intel boss Bob Swan, it is the fifth record year in a row. Operating profit increased seven percent to 23 $ 7 billion. Net profit is slightly lower at 20 .9 billion dollars.
Main reason for the increased numbers is Intel’s PC division. Sales of PC products increased by 23 percent in the fourth quarter and by 15 percent increased. Here, Intel recorded higher revenues, especially in the notebook area, and slightly less in the desktop segment. However, the average sales prices of notebook products have fallen somewhat, while they have increased minimally in the desktop area.
Intel was able to offer professional products for data centers 2020 also achieve record sales. However, sales fell by 20 percent. With the Internet of Things (IoT), Intel has to see a sales decrease of 15 percent in the quarter or 21 Accept percent for the full year. Mobileye, which offers optical recognition systems for vehicles, posted an increase in sales of 39 percent in the most recent quarter. However, the Israeli subsidiary is the smallest reported group unit with annual sales of less than one billion US dollars.
For the current first quarter 2021 Intel expects sales of 18 6 billion dollars. That would be six percent less than in the first quarter 2020, than Intel 19, achieved sales of 8 billion.
7-nanometer products 2023 – Hinton returns back The upcoming Intel boss Pat Gelsinger took part in the presentation of the quarterly results, although he won’t officially take up his post until mid-February. In a question and answer session with financial analysts, Gelsinger underscored Swan’s previous 7-nanometer plans. 2023 most Intel products will be based on 7 nanometer technology, but according to Gelsinger, Intel will also use external chip factories. Gelsinger will only decide more details after internal discussions and detailed analyzes.
Intel veteran Glenn Hinton will also return after three years of retirement. The CPU architect says he has been thinking about it since November; Gelsinger’s commitment made the decision easier. Hinton was instrumental in the development of the Pentium Pro over the past millennium. Its P6 architecture can still be found in the core versions such as the still current Skylake processors.
In a sign that Intel’s efforts to rebuild its engineering corps might be swift under the new incoming CEO, Glenn Hinton, the lead architect of Intel’s Nehalem processors and several other programs, announced that he is returning to the company after a three-year retirement. In a LinkedIn post announcing his return, Hinton cited the return of Pat Gelsinger, Intel’s new CEO, as a prime motivator for his return.
Hinton also remarked that he will be working on a high performance CPU project, and “If it wasn’t a fun project I wouldn’t have come back. As you know, retirement is pretty darn nice.” (Hat tip to @DylanLJMartin for the spot.)
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(Image credit: LinkedIn)
Intel has been criticized for losing much of its top engineering talent over the last several years, with activist hedge fund Third Point recently penning a letter to Intel decrying its loss of semiconductor leadership, saying, “The Company has lost many of its most inspiring and talented chip designers and leaders, and our sources indicate that those who remain (several of whom are highly regarded in the industry) are becoming increasingly demoralized by the status quo.”
The majority of Intel’s slow erosion of talent hasn’t been as outwardly visible as public-facing figures like Jim Keller and Murthy Rendunchintala that have recently left the company. Rebuilding the company’s technical backbone will be among incoming CEO Gelsinger’s most pressing priorities as he seeks to re-establish the company’s dominance in the semiconductor market, and bringing back experienced hands like Hinton is a good start.
Intel CEO Bob Swan, who was roundly criticized for his lack of engineering experience, will leave the company next month. Ex-VMware CEO Pat Gelsinger, who previously had a 30-year stint at Intel, will replace Swan, marking the return of an engineer to Intel’s top spot. Gelsinger served as Intel’s first Chief Technical Officer, developed the company’s tick-tock methodology, and helmed the creation of 14 generations of Xeon and Core processors.
Hinton, an Intel Senior Fellow, also has an impressive track record with the company, having been one of three senior architects for the P6 design that led to the Pentium I, II, and III processors. He later led the development of the Pentium 4 CPU and was one of two lead architects of the i960 CA, the first super-scalar processor. Hinton was also the lead architect of the Nehalem processors, and after 34 years at Intel, has more than 100 patents spanning 8 CPU microarchitectures. Hinton holds bachelor’s and master’s degrees in electrical engineering from Brighton Young University.
As with any CPU design, the development and validation cycles often take several years, meaning it could be some time before we see Hinton’s next design come to market. It’s also possible that Hinton could intercept a design already in flight, which means we could see his next project come to market sooner.
After Bob Swan had to resign as CEO of Intel and has now taken over Pat Gelsinger as a longtime, former engineer and later CTO, further new hires are on the horizon. Glenn Hinton, the head behind the development of the Nehalem architecture, is also returning to Intel after three years of retirement.
Hinton announced on LinkedIn:
“After enjoying a real retirement for 3 years I have decided to go back to work at Intel (where I previously worked for 35 years). What would entice me to do something like that? I will be working on an exciting high performance CPU project. Having Pat Gelsinger coming back as CEO also helped me finalize my decision to come back. “
In his post, Hinton announces that he will be working on a” high performance CPU project “will work. Just like Gelsinger, Hinton worked for Intel for several decades. After his first ten years at Intel, he 1990 first became better known as the chief developer for the Pentium 4 processor. Previously, he was one of three lead architects for the P6 architecture in 1990. This became the Pentium Pro, Pentium II and Pentium III. The P6 architecture forms the basis for the Nehalem architecture and the first core processors.
With Pat Gelsinger at the helm and staff like Glenn Hinton, Intel is returning to the roots of a successful era. Internal and external calls for a new leadership orientation have been getting louder for a long time. Bob Swan was a man of numbers, but a company like Intel should be run by someone with a technical background. Gelsinger as the new CEO is likely to fulfill this role, but whether the desired goals can also be implemented depends on the rest of the management staff.
Demand for client PCs, consumer electronics, servers, and other high-tech equipment is driving sales of various processors and in the recent quarters semiconductor supply chain has failed to meet demand for chips. Not only do foundries not have enough capacity to build silicon for their clients, but lead times at packaging houses have also increased significantly. Based on media reports, issues with chip packaging will affect supplies of client CPUs and GPUs as well as various consumer-grade electronics throughout the whole year.
Different chips use different types of packaging. Small integrated circuits (ICs) that do not require a complex power supply and do not need many input/output pins tend to use cheap wirebond packages. More complex devices use leadframe packages (quad flat packages (QFP), quad/dual flat no-lead packages (QFN/DFN), thin small outline profile packages (TSOP), etc.), which are generally wirebond packages encapsulated into plastic or other types of mold for added rigidity and reliability.
Chips that use many power and I/O pins — such as CPUs, GPUs, and SoCs — typically use laminated flip chip ball grid array (FC-BGA) packages that provide fine pitches, low inductance, ease of surface mounting, and excellent reliability among other things. Meanwhile, there are BGAs that continue to rely on wirebonding and there are BGAs that use flip chip packaging.
Insufficient Wirebonding Capacities
Wirebonding packages are used by such popular commodity chips as display driver ICs as well as TDDI (touch with display driver integration) chip solutions. Insufficient supplies of DDICs as well as TDDIs affected shipments of monitors and notebooks last year, as some PC makers complained back in the fourth quarter.
(Image credit: Henkel Adhesives)
By now, OSAT (outsourced assembly and test) houses like ASE Technology (the world’s No. 1 chip packaging company), Greatek Electronics, and Lingsen Precision Industries have stretched their lead times for wirebonding packages to two, three, or even more months because of insufficient capacities, reports DigiTimes. OSAT companies did not comment on the news story.
Adding equipment for wirebonding is a relatively straightforward task, but because of high demand manufacturers of such tools, namely Kulicke & Soffa as well as ASM Pacific Technology, have increased their delivery lead times up to nine months. Meanwhile, Advantest, which makes test equipment for DDICs and TDDIs, has also extended its lead times to over six months.
Without sufficient wirebonding capacities, at least some display and PC makers will continue to suffer from shortages of various crucial components, such as display driver ICs, for at least two quarters. Alternatively, they will have to find additional sources of components, or their suppliers will have to find alternative assemble and test partners. In both cases, the actions will take time.
Not Enough ABF Substrates
(Image credit: ASE Group)
Laminated packages are used by a wide variety of semiconductors ranging from cheap SoCs for client PCs all the way to complex high-end CPUs for servers and 5G equipment. Chips that use laminated packaging often use IC substrates featuring insulating Ajinomoto build-up film (ABF), which are made by only one company, Ajinomoto Fine-Techno Co. Apparently, some suppliers of ABF substrates experience yield issues with their products.
Yield rate for ABF substrate production at Taiwan-based suppliers Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology is now about 70% or lower for high-end offerings, according to DigiTimes. The companies are trying to gradually expand production, but they will only be able to boost it by around 10% from 2021 to 2022, the report says.
In particular, Unimicron is reportedly considering repurposing one of its damaged production facilities to make ABF substrates, but the plan has not been finalized, so it unlikely that the new factory will go online earlier that at least a year from now. Neither of the companies has confirmed or denied the story. To a large degree such a small increase is a consequence of the fact that delivery lead time for ABF substrates manufacturing tools are now at now are four to three quarters, the article claims.
Since demand for advanced chips is increasing across the board, processor developers naturally give priority to higher-end products, such as those for supercomputers, datacenters, servers, and advanced client PCs. ABF substrates suppliers have to satisfy demands of their customers, which is why they naturally give priority to higher-end substrates in their production too. As a result of shifting priorities of both chipmakers and substrate suppliers, capacities for entry-level and midrange processors for laptops are shrinking, which creates further shortages on the market.
Not a Catastrophe?
It is not the first time in recent memory when the industry experienced shortages of crucial components.
(Image credit: ASE Group)
In recent years, the industry also faced a tight supply of Intel CPUs as the company could not meet demand for parts produced using its 14 nm fabrication process. The company naturally prioritized supply of its higher-end Xeon Scalable as well as Core i5/i7/i9 processors over entry-level Core i3, Pentium, or SoCs for midrange and low-end PCs. While PC makers were not exactly happy with undersupplies, they did not really struggle. This time around, the situation is different as companies like Dell or HP cannot get enough a variety of components.
Insufficient packaging capacities at some manufacturers and assembly and test services create a tight supply of ABF substrates and an unpleasant situation for the industry. Yet, it is not unfixable.
Increased delivery lead times for equipment makers indicate that there are companies, which have acquired necessary tools and which will obtain them earlier than others. These companies will use this equipment to assemble and test chips, which will reduce load on other OSAT providers. Alternatively, integrated device manufacturers (IDMs) could at least produce chips needed by the industry.
In either case, high demand for PCs, electronics, servers, and other types of equipment means higher prices, so for the next couple of quarters many products will continue to cost more than their MSRP.
Acer is announcing five new laptops aimed at schools today, consisting of four Chromebooks and one Windows convertible. Two of the Chromebooks are Intel-based convertibles, with screens that spin around to turn them into laptops, while the other two feature a more traditional design and are powered by Arm-based processors. All five laptops are designed to be durable, with spill-resistant keyboards and components tested to MIL-STD 810H military durability standards.
The two convertible Chromebooks are the Acer Spin 512 and Spin 511. They’re powered by Intel processors (specifically the N4500 and N5100). The Spin 511 has a 11.6-inch HD 16:9 display, while the Spin 512 has a 12-inch HD+ 3:2 display. Both come with up to 64GB of storage, and 8GB of RAM, while battery life is rated up to 10 hours.
The Spin 511 starts at $399.99 and will be available in North America from April.Image: Acer
Both the Spin 512 and Spin 511 have antimicrobial scratch-resistant displays, but the Spin 512 also features a similar antimicrobial coating on its keyboard and touchpad. The Chromebooks will be available in Europe in March and North America in April. The Spin 512 starts at $429.99 (€399), while the Spin 511 is slightly cheaper at $399.99 (€369).
Next up are the 11-inch Arm-based Chromebook 511 and Chromebook 311, which also have durable designs. The 511 is powered by a Qualcomm Snapdragon 7c processor, features 4G LTE connectivity and can go for up to 20 hours on a charge. Meanwhile, the 311 has a Mediatek MT8183 processor and also runs for up to 20 hours on a charge. The 311 launches this month in North America and is priced starting at $299.99, while the 511 is coming in April starting at $399.99. They’ll launch in Europe in March for €269 and €399 respectively.
The TravelMate Spin B3 is an Intel-based convertible that runs Windows.Image: Acer
Finally, there’s a $329.99 (€409) Windows laptop, the TravelMate Spin B3. It also includes a durable keyboard that can flip around to turn the laptop into a tablet, and is powered by up to an Intel Pentium Silver processor with as much as 12 hours of battery life. The Spin B3 comes with an antimicrobial display as standard, and the option of having a similar coating on its keyboard and touchpad. The laptop will launch in North America in April, and Europe at some point in Q2.
João Silva 35 mins ago Featured Tech News, Memory, Motherboard, Tech News
It looks like Intel will finally introduce memory overclocking support on non-Z motherboards, starting with the 500-series. By enabling memory overclocking support, systems equipped with H570 or B560 motherboards will allow memory modules to operate above their official specifications for increased performance.
Unlike AMD, which offers overclocking support on almost all of its chipsets, Intel has, up until now, been locking memory overclocking behind its “Z” chipsets. Now it seems Intel has finally changed this position and will introduce memory overclocking to its mid-tier motherboards.
With the Comet Lake-S platform, the Intel Core i9 and i7 CPUs supported DDR4-2933 memory, but the i5, i3, and Pentium chips could only be paired with up to DDR4-2666 memory. Due to the lack of memory overclocking, H470 and B460 motherboards would only run memory at a maximum of DDR4-2933. As per @momomo_us‘ post (via Tom’s Hardware), the Rocket Lake-S platform is expected to be arranged differently from Comet Lake-S, with the Core i9, i7, and i5 supporting up to DDR4-3200, while the Core-i3 and Pentium processors would be maxed at DDR4-2666.
The fact that different maximum supported memory speeds depends on the processor families, might be a sign that the 11th Gen Core processors lineup consists of Rocket Lake-S processors and refresh Comet Lake-S processors. The CPUs supporting up to DDR4-3200 would be Rocket Lake-S processors (Core i9 to i5), while the CPUs featuring a maximum memory speed of DDR4-2666 could be the refreshed Comet Lake-S parts.
Given that users will need at least a Core i5 processor to run DDR4-3200 memory, it is expected that H570 and B560 motherboards will only be capable of memory overclocking when paired with Core i9/i7/i5 CPUs.
KitGuru says: Are you glad to see that Intel has finally started to introduce overclocking features to non-Z motherboards?
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With its 500-series chipsets, Intel has finally broken tradition and enabled memory overclocking on a non-Z chipset. For this generation, motherboards that leverage the H570 or B560 chipset will allow consumers to use memory that’s faster than the official supported specification for Rocket Lake-S.
Intel’s latest move may look insignificant for AMD owners, as AMD was always more accomodating with memory overclocking on its budget chipsets, such as the A-or B-series. Before the 500-series chipsets came along, Intel owners only had access to memory overclocking on the flagship Z-series chipset. It took Intel long enough, but it’s nice to finally see the chipmaker opening the door for the pocket-friendly chipsets.
For Comet Lake-S, Intel utilized a two-level scheme for memory support. The Core i9 and Core i7 SKUs natively support DDR4-2933, while the Core i5 and below tiers are limited to DDR4-2666. Therefore, H470 and B460 chipsets were restricted to DDR4-2933 support.
Intel 500-Series Chipsets (Image credit: Intel)
ASRock’s Z590 Taichi product page (via momomo_us) suggests that Intel is employing a similar tactic with Rocket Lake-S. The description for memory support reads “11th Gen Intel Core™ (i9/i7/i5) support DDR4 up to 3200; Core (i3), Pentium and Celeron support DDR4 up to 2666.”
An early rumor suggested that the 11th Generation branding housed both Rocket Lake-S and Comet Lake Refresh chips. ASRock’s lettering supports this theory. The Core i9 to Core i5 models are Rocket Lake-S chips that support DDR4-3200, and the remnants are Comet Lake Refresh chips that do DDR4-2666, the same as the existing generation.
The H570 and B560 chipsets now support memory overclocking (memory above DDR4-3200), but you still need to pair the respective motherboard with a Core i5 and above processor. Core i3 and below still stick to DDR4-2666. It’s not the full mile, but it’s something nonetheless. In the past, pairing a Core i9 chip on an H-or B-series chipset meant you were locked out from using faster memory.
With the laptop BR 1100 ASUS took part in the digital CES 2021 presented an ultraportable, but very robust notebook, which in times of the corona pandemic is primarily intended to appeal to and support teachers and students in homeschooling. Not even 300 Euros are called for it.
The ASUS Laptop BR 1100 has a robust housing with an easy-to-use design. It has a modular structure for easy on-site maintenance, which enables quick access to important components. This should minimize IT maintenance, but also downtimes. In addition, rubber buffers are attached to all four outer edges. The keyboard is not only splash-proof, but also treated to prevent bacteria.
A mute button is conveniently integrated directly in the housing for video conferences. The ASUS Laptop BR 1100 is a classic notebook format and a convertible with foldable 360 degrees -Display and touchscreen available. Then it also enables handwritten notes and drawings to be made using a stylus that can be stowed in the housing.
Depending on the equipment, there is either an Intel Pentium Silver N 6000 or an Intel Celeron N 5100 under the hood, or Celeron N 4500, which work natively with two to four computing cores and should have sufficient performance for everyday school life. Up to 16 GB of RAM and a storage option of up to 128 GB eMMC and an M.2 SSD with a maximum of 1 TB technically round off the system. The screen has a diagonal of , 6 inches and works with a native resolution of 1. 366 x 768 pixels. The integrated microphone supports the ASUS two-way AI noise canceling technology and should be able to automatically and effectively filter out disturbing background noises.
The device dials into the Internet via WiFi 6 or Gigabit Ethernet. Even an LTE option for mobile data connection is optionally available. The 42 – Wh-battery should the 12 – Zöller can supply electricity for an entire school day. On the connection side, two USB type A interfaces, a modern type C socket, HDMI and a microSD card reader as well as a 3.5 mm jack socket for connecting headphones are offered. Overall, the homeschooling laptop has dimensions of 294, 6 x 204, 9 x 20 mm and around 1, 26 kg on the scales.
The ASUS Laptop BR 1100 should start this quarter at a price from 299 euros in Germany.
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