An insufficiently communicated certificate change obviously leads to problems.
Heise Security is currently receiving a lot of messages about errors when establishing HTTPS / TLS connections. The cause is apparently a revoked intermediate certificate from QuoVadis Intermediate CA. The following certificate is affected:
QuoVadis Global SSL ICA G3 Obviously (on the server?) This must be replaced by a new version. QuoVadis recommends exchanging these two intermediate certificates in a reference to “infrastructure problems”:
QuoVadis Global SSL ICA G3: http://trust.quovadisglobal.com/qvsslg3.crt QuoVadis Global SSL ICA G2 http://trust.quovadisglobal.com/qvsslg2.crt digicert + Quovadis is a certification authority that signs SSL / TLS certificates, among other things. The browser can then trace their authenticity back to the actual root CA using the intermediate certificate (ICA) supplied with the certificate. Their certificate is in the list of trusted root CAs.
It is the current one Apparently a planned change, which many customers had no knowledge of. The Australian AusCERT has created an auxiliary document: AusCERT statement “QuoVadis Global SSL ICA G3” issue impacting multiple customers
A bot at Telegram is supposed to spit out the phone numbers of Facebook users on request and for a small fee. That should be possible with several hundred million accounts. It is unclear where exactly the data came from. However, there have already been multiple data leaks and other problems on Facebook, which led to telephone numbers being freely available.
About the bot, who throws out the numbers at Telegram, reports threadreaderapp.com . To get the phone number, all you have to do is enter the Facebook ID. This can be found foolproof on websites on which you only have to enter the public URL of a profile. If you have a phone number, it also works the other way around and the associated profile is specified. In Germany, the profiles and numbers of six million Facebook users should be available.
Where did the Facebook data come from? According to the report, the phone numbers could be via a Vulnerability to be tapped that showed up at the beginning 2020. 533 Millions of users were affected. But it is not the only chance there has ever been to get the data. Already at the end 2019 it was said that 419 Millions of Facebook users’ phone numbers including ID were freely available on a server. Real names, gender and nationality are also said to have been assigned there. It is also unclear who maintained this database. It went offline shortly afterwards. But it could of course have been copied.
Facebook suspected at the time that someone had collected the number by searching for a user. Up to 2012 it was possible to find profiles by phone number or email address. Advertisers were also able to gain access to the telephone numbers later, although this should not have been the case. Facebook is actually only allowed to use the numbers for two-factor authentication. Inappropriately, there has already been abuse for advertising purposes.
Taiwan Semiconductor Manufacturing Co. said this week that it would significantly increase its capital expenditures this year as it needs to build and equip new fabs to ramp up its existing and next-generation leading-edge process technologies. Demand for advanced fabrication nodes is on the rise. In Q4 2020, revenue for N5 (5 nm) and N7 (7 nm) technologies accounted for nearly half of TSMC’s revenue, so it makes a great sense for the manufacturer to continue investing in leading-edge capacities. Furthermore, as Apple and Intel plan to increase orders to TSMC, the foundry will also need more capacity.
TSMC to Spend Up to $28 Billion on Production Facilities in 2021
TSMC’s management plans to spend from $25 billion to $28 billion on capital expenditures in 2021, the world’s largest contract maker of semiconductor announced this week.
(Image credit: TSMC)
If TSMC’s board approves all the investments proposed by the management, then TSMC’s CapEx will rise by 45% ~ 62% year-over-year from $17.2 billion in 2020. The lion’s share of TSMC’s capital budget will be spent on expanding production capacities for the company’s N5 and N7 nodes as well as equipping a leading-edge fab for its N3 (3 nm) node that will be used starting from the second half of 2022.
“Out of the $25 to $28 billion CapEx for 2021, about 80% of the capital budget will be allocated for advanced process technologies, including 3 nm, 5 nm and 7 nm,” said Wendell Huang, chief financial officer at TSMC, during this week’s earnings call with analysts and investors. “About 10% will be spent for advanced packaging and mask making and about 10% will be spent for speciality technologies.”
“The 2021 CapEx is largely for N5 expansion (at least 2x its current 55-60k WPM capacity), and N3 build is limited to pilot line/initial production (+10-15k WPM, though we expect N3’s capacity to be similar to N5’s upon full ramp-up),” Szeho Ng, an analyst with China Renaissance Securities, wrote in a note to clients on Friday.
Production of semiconductors is an extremely capital-intensive business and as process technologies get more advanced and manufacturing tools get more expensive, chipmakers have to increase their CapEx budgets to build fabs that cost as much as $20 billion or even more. Because of increasingly high R&D and fab costs, numerous contract makers of semiconductors had to pull out from the leading-edge and focus on specialized technologies in the recent years.
N5 & N7 Accounted for 49% of TSMC’s Revenue in Q4 2020
But with a number of rivals out of the game, TSMC now has more clients than ever. And considering the fact that there are a number of ongoing megatrends — such as 5G, AI, high-performance computing (HPC), and edge computing — that require advanced chips produced using the most sophisticated technologies possible, demand for TSMC’s higher-end production services is on the rise today and will continue growing in the coming years.
(Image credit: TSMC)
In the fourth quarter, sales of wafers processed using N5 accounted for 20% of TSMC’s total wafer revenue, whereas sales of N7 and 12 nm/16 nm accounted for 29% and 13% respectively. In general, leading-edge N5 and N7 nodes commanded 49% of TSMC’s wafer revenue, whereas advanced nodes (N5, N7, N12/N16) accounted for 62% of the company’s total wafer revenue.
TSMC’s N5 process technology in Q4 2020 was primarily used by Apple, which uses it for its A14 system-on-chips for smartphones and tablets as well as M1 SoCs for its latest PCs. The company’s N7 is used more widely by companies like AMD, Apple, Nvidia, Qualcomm, and Xilinx, whereas N12/N16 is used by dozens of companies for all kinds of applications.
“Our fourth quarter business was supported by strong demand for our industry-leading 5 nm technology, driven by 5G smartphone launches and HPC-related applications,” said Mr. Huang. “Moving into first quarter 2021, we expect our business to be supported by HPC-related demand, recovery in the automotive segment, and a milder smartphone seasonality than in recent years.”
TSMC’s N5 is a major improvement over N7 node that enables a 15% higher performance (at the same power and complexity) or a 30% lower power consumption (at the same frequency and complexity), and an up to 1.8X higher transistor density (not for all structures). In addition, N5 uses extreme ultraviolet (EUV) lithography on more than 10 layers to reduce mask count to 81 as well as reduce or even avoid usage of multipatterning, which optimizes yields and costs. Considering all the advantages that N5 has over N7, the majority of TSMC’s clients that use N7 now will migrate to N5 over time.
Later this year TSMC will offer its customers a performance-enhanced version of N5 that is called N5P. The latter is projected to enable a 5% performance gain and/or a 10% power reduction over N5 while staying generally compatible. Yet, N5P will be used by select chip designers only as next year TSMC will offer N4 that will provide further PPA (power, performance, area) enhancements while being compatible with N5 on design rules, IPs, and SPICE levels. TSMC’s fabs that currently process wafers using its N5 technology will also be able to use N5P as well as N4, so any investments going there will be used for years.
N3 Could Be More Successful Than N5 and N7
TSMC’s next major step after N5 will be N3 (3 nm). This technology promises an up to 15% performance gain (at the same power and transistor count), or an up to 30% power reduction (at the same speed and transistor count), along with an up to 20% higher SRAM density as well as an up to 70% higher logic density. This technology is still in development and will be used starting from the second half of 2022.
(Image credit: TSMC)
TSMC says that it sees more interest in N3 from potential clients in the HPC (TSMC considers ‘HPC’ all CPUs, GPUs, FPGAs, non-mobile SoCs, special-purpose accelerators, etc.) and smartphone spaces than it did with N5 and N7 when they were at a similar stage of development.
“We are seeing a much higher level of customer engagement for both HPC and smartphone application at N3 as compared with N5 and N7 at a similar stage,” said C. C. Wei, Chief Executive Officer of TSMC. “Risk production is scheduled in 2021, and volume production is targeted in the second half of 2022.”
TSMC does not disclose any actual numbers that would quantify interest for N3 from its clients, but since many new applications are going to emerge in the coming years, it is not surprising that more players with more designs will be opting for a leading-edge process technology in 2022 ~ 2025 than they did several years ago. Furthermore, since N3 continues to rely on FinFET transistor structures with predictable performance and costs, the fabrication process will be a very long node as its successors will move to GAAFETs (gate-all-around field effect transistors), which is going to have a significant impact on design costs. For example, TSMC’s 28 nm node that relies on planar transistors accounted for 11% of its wafer revenue in Q4 2020, nine years after the fabrication process was introduced.
“We note the bold expansion reflects N3-5 as long- lasting big nodes with expected robust future demand beyond the initial wave from key clients,” Szeho Ng, an analyst with China Renaissance Securities, wrote in a note to clients on Friday.
While eventually dozens of companies will use TSMC’s N3 and N5, there are two customers that are going to have a significant impact on TSMC’s CapEx budgets in the coming years: Apple and Intel.
Apple: More Chips Needed
Traditionally, the bulk of Apple’s orders to TSMC have been its SoCs for smartphones and tablets. Many of its suppliers produce their chips at TSMC as well, but those semiconductors are not made under Apple’s orders and are not made exclusively for the company. As Apple transits its PCs to its own SoCs, starts to use its own modems inside its smartphones and tablets, and increases sales of its accessories that rely on its own system-in-packages (SiPs), it will significantly increase its orders to TSMC.
(Image credit: TSMC)
Apple is the world’s No. 4 PC supplier that shipped 23.102 million computers last year and commanded about 7.6% of the PC market. Sales of PCs in 2020 totalled 302.6 million units, according to IDC. Once the technology giant completes transition of Macs from Intel CPUs to its Apple Silicon SoCs, it will need at least 23.102 million fairly big chips (the M1 is at 120 sq. mm, which is 26 sq. mm smaller compared to Intel’s Tiger Lake-U) every year assuming that the market stays flat and Apple stops gaining market share (something that it has been doing for years).
Apple was also the third largest supplier of smartphones in 2019 with 191 million units shipped, based on IDC’s data. When the company ceases to use third-party 5G modems (which happen to be made using a leading-edge process technology) and transits to its own, it will increase its orders to TSMC by another ~200 million of chips every year.
Apple’s transitions to its PC SoCs and modems will be completed within the next couple of years. While it is hard to quantify Apple’s orders to TSMC in terms of wafers today, it is safe to say that the addition of ~25 million PC SoCs and ~200 million modems to around ~200 million smartphone SoCs that TSMC produces today will significantly increase the number of wafers that the foundry processes for Apple.
Intel: A Wildcard
Intel already outsources manufacturing of multiple products to TSMC and has confirmed officially and unofficially that it would produce Atom and Xeon SoCs as well as GPUs at TSMC. What nobody knows at this point is whether Intel intends to make client and server CPUs at TSMC and if it has such plans, what percentage of its CPUs will be made at TSMC.
(Image credit: Intel)
Since Intel’s outsourcing plans are unclear and perhaps are even undecided, it is not good business to make too many assumptions at the moment. Yet, there are a couple of things to keep in mind. Intel sells hundreds of millions of processors and chipsets for client PCs every year and even if the company decides to outsource 10% ~ 15% of its client CPU/chipset output to TSMC, it will still be tens of millions of units added to Intel’s existing orders to the foundry.
Intel traditionally uses advanced nodes, so to land its orders, which are going to be significant, TSMC will need to have enough capacity to serve the CPU giant along with other customers.
Summary
TSMC’s management plans to increase its 2021 CapEx budget by 45% ~ 62% year-over-year to record $25 billion ~ $28 billion in a bid to expand its leading-edge production capacities and prepare to ramp up production using its N3 process technology in the second half of 2022.
(Image credit: TSMC)
The company sees the ongoing megatrends like 5G, artificial intelligence, high-performance computing (HPC), and edge computing as the main drivers for advanced semiconductors demand in the coming years.
Apple, which is already TSMC’s main customer for advanced nodes, will likely significantly increase its orders to the foundry in the coming years as it transits to its own Apple Silicon SoCs for PCs and in-house designed modems, which will further drive demand for TSMC’s leading-edge manufacturing technologies.
Intel is also going to outsource more of its products to TSMC in the coming years, which will be another factor that will increase demand for the foundry’s sophisticated fabrication processes.
With the corona crisis, many new words have found their way into everyday language: no one has to look up incidence, intensive capacities or R-value. In the school sector, the word creations and paraphrases for the new pandemic-related non-normality are particularly diverse: “presence operation”, “restricted regular operation”, “alternate model” or “hybrid teaching”. And meanwhile it is called “homeschooling”, “distance learning” or “distance learning” again. With some parents and students, however, the hairs on the back of their necks stand up when they hear this. There are complaints that there can be no talk of “teaching”.
“Effective teaching looks different.” Sabrina Wetzel, Deputy Chairwoman of the Federal Parents’ Council, reports on emails from parents describing various problems. “Many parents are overwhelmed by supporting their children, school administrators, teachers and students are frustrated because the programs are not yet really running smoothly.” Crashes, poor WiFi, sound and picture failures – “effective lessons look different”, says Wetzel.
Frustration also resonates with Dario Schramm, Secretary General of Federal Schoolchildren Conference. The 20 – year old goes to the 10. Class of an integrated comprehensive school near Cologne. “The federal and state governments now have to take money into their hands and massively expand server capacities. Otherwise these weeks will end in disaster.” For many, everyday school life is currently looking very dreary: Download documents in the morning, edit them and upload them again in the afternoon. “This process is just as terrible as it sounds. The social and communal learning, which should be a core component of education, is currently massively lacking.”
Whether there is feedback and video conferences depends very much from the teacher, says the student representative, who also takes the pedagogues into protection. “How are you supposed to set up the” perfect “digital teaching without any reasonable further training and functioning technology?”
Federalism as a brake This is where a topic comes into play that has been discussed since the summer, but on which obviously nothing is moving: service laptops for teachers. A program for 500 million euros for the acquisition of the devices was agreed in August at a “school summit” in the Chancellery. Not a single cent has flowed from this, as is evident from a response from the federal government to a request from the FDP parliamentary group that the dpa has received. The answer comes from 13. January. It states that no funds have yet been paid out because the corresponding agreement between the federal and state governments on the 500 million package has not yet been reached has been signed by all federal states.
Nationwide projects in education are repeatedly slowed down by federalism. The federal states are each responsible for education and schools. The federal government is actually not allowed to have a say and simply inject money, which is why so-called administrative agreements between the federal government and all 16 countries are negotiated and then all have to be signed individually. That takes.
“The fact that the federal and state governments have not yet managed to sign the agreements for the purchase of teachers’ laptops is just shameful,” says the FDP chairman for digital infrastructure Bundestag, Torsten Herbst. “While parents, children and teachers have been doing their utmost for weeks to compensate for the loss of face-to-face classes as much as possible, politicians do not even manage to do the simplest administrative homework.”
Technology not up to the number of users According to the digital association Bitkom, the fact that the learning platforms of the federal states sometimes get stuck and jerky is due to the fact that the technology is not up to the user because these platforms are not up to the large number of users. Another obstacle to good distance learning is, according to Bitkom President Achim Berg, “the lack of pragmatism in data protection”. Worldwide leading IT companies have been investing hundreds of millions in conference and learning systems for years. “It’s not easy to recreate. In the pandemic, high-performance systems that are customary on the market should also be made available to schools.” So why don’t they also take place as standard distance learning so that teachers and students stay in touch? That is not the free decision of the individual teacher, said Heinz-Peter Meidinger, President of the German Teachers Association. The prerequisite is that the school has a corresponding license for software and that the necessary data protection is guaranteed. “It is therefore not permissible for a teacher, for example, to invite the students to a zoom session from home.” And with the state learning platforms there is usually no really functional video system.
One must also free oneself from the thought that the digital transmission of lessons in video conference systems is automatically the most effective form of teaching alone or even primarily says the former head of a grammar school who retired in the summer. “A mere transmission of a lesson by video without an intensive feedback culture is not very effective. An intensive exchange via e-mail with worksheets and student contributions can be quite effective and successful.”
Not all bad Meidinger also warns against blanket judgments about distance learning. Given more than 10 million students and 40. 000 Schools should not create an impression that is entirely justified in individual cases is not representative. “My impression is that things are going better overall than in the spring, also because many, but unfortunately by no means all, loan devices have been given to children who have not been able to use a keyboard-compatible computer at home.” Student representative Dario Schramm also sees positive developments: “The truth certainly also includes the fact that there are individual pioneering schools that can offer their students really good distance learning.”
From today’s perspective, Wikipedia always seems to have belonged to the Internet. It goes without saying, especially for younger people, to get all possible information about Goethe, hypotenuses and the Basic Law for homework there. And yet – Wikipedia is actually a late development of the first dotcom boom.
The concept of the “wiki” was already six years old old when Jimmy Wales and Larry Sanger on 15. January 2001 started Wikipedia; with everything that was needed: a web server, a database and some PHP.
A crazy experiment Nobody knows exactly which articles were the first in the new encyclopedia or who the first authors were – only a few screenshots have survived. After all, you can leaf through the contents of Wikipedia in a nostalgic edition of 2001. In the early days, the project received relatively little public attention: The first dotcom crash had weakened the feverish curiosity of the first few online years.
The first news ticker articles followed: about the 100000. Wikipedia article in the English edition, den 20000. Article in the German Wikipedia, the first cooperation with a search engine provider and the first appeal for donations. Wikipedia had not only established itself as a serious project, but also set the course for the first time, which justified the later rise. A series of articles appeared on Telepolis on the dance of the brains in the young Wiki scene, penned by Erik Möller, who later became one of the leading collaborators of the Wikimedia Foundation. Concepts like the “neutral user point of view” of the Wikipedia articles became known to a wider public.
Founded less than a year ago and already valued at a ten-digit figure: Mobile processor manufacturer Qualcomm wants to take over the start-up Nuvia. Both companies have agreed on a purchase price of 1.4 billion US dollars – now only the authorities have to approve the takeover.
Reason for the high price, Nuvias are engineers, as the company employs many people who previously worked for AMD, ARM, Apple, Broadcom, Google and Intel, often in high-level technical positions. Founder and CEO Gerard Williams III was at Apple for almost 10 years until the beginning 2020 as CPU chief architecture, previously 12 years at ARM. So he is very familiar with the development of high-performance ARM computing cores.
So far, Nuvia has only talked about its own CPU core with the code name Phoenix, which is actually in ARM server processors should land. Performance per watt and the absolute power should be above the offer from AMD (Zen 2), Intel (Sunny Cove) and Apple (A 13 Lightning), however So far there was no finished silicon, let alone independent tests.
Better Snapdragon processors Will the Nuvia takeover come about , all employees switch to Qualcomm. The expertise gained is to be used in all of its own processors – from smartphone systems-on-chip (SoCs) to notebook models and automotive chips. A re-entry into the server market would be conceivable, but does not address Qualcomm in the announcement.
Since the switch to 64 – Bit processors Qualcomm only uses slightly adapted standard ARM computing cores in its own Snapdragons. The chip manufacturer was previously successful with the self-designed 32 bit cryo-cores. With Nuvia, Qualcomm could build on old times and compete with Apple in high-performance ARM processors. Apple is currently converting its Macs to its own ARM SoCs, against which Qualcomm has not yet had an adequate answer. The Snapdragon 8cx for notebooks is significantly slower than the competition.
Almost anything is possible on an iPhone with a jailbreak. A user on Reddit has now succeeded in booting the Linux distribution Ubuntu on an Apple smartphone. The device was an iPhone 7 from the year 2016, which is one of the Apple products on which the Apple unpatchable “checkm8 “-Bug is present – this applies to iPhones up to the X. The error in turn allows the execution of the popular jailbreak checkra1n, which is regularly updated and also already for iOS 14 is available.
Netbooting with Linux In the case of Reddit user newhacker 1746 there was a problem with his iPhone 7 the internal NAND memory, this is “dead”. So it was no longer possible to run iOS. For this reason, he decided to run Linux via netboot. This actually succeeded with a largely unmodified Ubuntu version 14. 04 for ARM 64. The boot process took place via USB gadget Ethernet.
The prerequisite was the installation of checkra1n 0. 10. 2-beta, a directory that can be written via NFS including a DHCP server in the local network, the kernel fork for h9x / A 10, an ARM 64 – cross-compiler or a native ARM 64 – Device and a setup script including udev rules that newhacker 1746 has provided on Github.
Android also worked If Linux is running on a jailbroken iPhone, this is also possible with Android. In fact, this has already been demonstrated on an iPhone 7. As part of the “Project Sandcastle”, Corellium, which is legally at odds with Apple, demonstrated that this is possible via jailbreak. A multi-shoot with Androod and iOS would also be conceivable here. Pack volume.
If you want to try Ubuntu on the iPhone, you can take a look at the corresponding step-by-step instructions here. In the meantime it was even possible not only to boot up to a prompt, but also to the default GNOME desktop. This would also make practical use of the iPhone under Linux conceivable.
Intel has just advanced on this release that Bob Swan will step down from his current role as CEO of Intel Corporation on 15 February 2021 and will be replaced by Pat Gelsinger , current CEO from VMWare.
Bob Swan was promoted to interim CEO of Intel after Brian Krzanich was ousted for having relationships with an employee. However, in the industry that expulsion sounded like an excuse and there were many voices that indicated that Brian’s dismissal was more related to the different failures that the company was reaping with the launch of its process of 10 nm.
After 7 months as interim CEO, Bob Swan was officially proclaimed CEO by Intel’s board of directors in January 2019. However, Bob, who was previously CFO (Chief Financial Officer) of the company, does not have a technology background and has been harshly criticized for it.
That is why perhaps the board of directors considers that Pat Gelsinger, a computer engineer who was Intel’s first CTO, is a more appropriate person to lead the one who for years was the world’s most innovative chip maker. This has been demonstrated by investors in the stock market, causing Intel shares to grow by 13% from ad .
That Intel needs a change in depth starting at the head, is obvious to investors. The leadership of Bob Swan does not seem to have borne the expected results as we have seen during the time that the company has been governing:
During 2020 we have seen how Intel accumulated various blows in the market . On the one hand, its loss of leadership in manufacturing processes has become more present and TSMC and Samsung have increased the gap considerably . A gap that Intel’s great competitor, AMD, has been able to take advantage of.
Since AMD launched its first generation of Zen architecture they have not stopped eating Intel’s ground in market share on all platforms: Desktop, Laptops, Server, Workstation, etc.
Without However, one of the biggest hits Intel has suffered recently has been when they have been forced to delay their highly anticipated 7nm process until late 2022 or early 2023, which is where the company’s hope to once again lead the market was located.
Another important setback is the breaking of the agreement with Apple, which after 15 years being their sole supplier of CPUs, those from cupertino have dispensed with Intel to create their own processors for their Mac computers.
Do you think Intel will do better with this new CEO? We await your comments.
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The new Ryzen 7 5800 and 9 5900 will only be available through OEMs, at least for the time being, while Threadripper Pro, which has so far been exclusive to OEMs, processors, in turn, will be released for free sale.
Yesterday, AMD released the new Ryzen 5000 series APUs for laptops. In addition to the new APUs, the company had prepared for CES 2021 with new Ryzen 5000 desktop models, Ryzen Threadripper Pro processors availability news and teasing for 3rd generation Epyc processors.
New members of the Ryzen 5000 family desktop collection obey the names Ryzen 7 5800 and 9 5900. The processors are based on the familiar Vermeer architecture and, like their sister models with the X mark, are 8- and 12 cores. The base and Boost clock frequencies of Ryzen 7 5800 are 3.4 and 4.6 GHz, while those of 9 5900 are are 3.0 and 4.7 GHz. Processors have a TDP value set to 65 watts and will be available, at least for now, only in OEM configurations.
Ryzen Threadripper Pro processors were originally released last summer. Zen 2 core based processors are available from 28, 64 and 65 as cores, but so far they have only been available on OEM workstations. Now AMD has decided to bring the series processors to free sale as well and they are expected to be available on store shelves during March.
Deliveries of Milan, or 3rd generation Epyc processors, have reportedly started last year, but the actual release will still have to wait. However, AMD CEO Lisa Su gave a little taste of future server processors and their performance at the show. Performance was demonstrated with the Weather Research and Forecast weather simulation model and contrasted with Intel’s two 28 core Xeon Gold 6258 R configurations and AMD’s dual 32 core-based Epyc Milan processor configurations. According to the AMD test, its configuration was as much 68% faster than the Intel option. Epyc 3rd generation processors will be officially released later this quarter.
AMD also confirmed that it will release new Radeon RX 6000 series graphics cards for both desktop and laptop in the first half of the year.
Synology has announced its newest 8-bay rackmounted storage servers, which it claims ‘deliver high performance in a space-efficient manner.’
Today we have not one, but two new servers from Synology – the RS1221+ and the RS1221RP+, the latter of which has power redundancy support thanks to its two PSUs. Designed for small businesses, Synology claims these units can offer impressive performance but at a ‘modest depth for 2U units in their class’, with the RS1221+ measuring 298mm deep, compared to 399mm for the RS1221RP+.
Powered by the AMD Ryzen V1500B processor, Synology says the RS1221+ is up up to 3.6x faster than than its predecessor in terms of compute performance, and 2.3x faster when looking at sequential write performance. On that topic, these units are rated for up to 2315MB/s sequential reads and 1147MB/s sequential writes.
By default, these units ship with 4GB DDR4 ECC memory, but this is upgradeable to 32GB. A PCIe 3.0 4-lane x8 slot is also built in which allows for an upgrade to a 10GbE NIC if you want more than the 4x 1GbE ports which are natively supported. What’s more, if you need more space than can be installed via the 8 bays, the 4-bay RX418 expansion unit is also compatyivle with the RS1221+.
Synology says the RS1221+ and RS1221RP+ are available globally from today. We found the RS1221+ on Span for pre-order, priced at £3797.28.
KitGuru Says: If you own a small business and want to get set up with a storage server, the RS1221+ looks like a good bet.
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Apple is apparently taking back a controversial innovation from macOS 11: An exclusion list that has been integrated into the operating system so far, with which the manufacturer filters its own network services exempting local firewalls is apparently being deleted. Programs like the firewall Little Snitch or the data-saving tool Trip Mode are no longer able to use most of the Apple services in macOS 11 Big Sur block – a nuisance for users as well as developers.
Malware can abuse Apple’s exclusion list A security researcher also pointed out that malware can misuse Apple’s exclusion list to call home unnoticed. Security researcher Patrick Wardle warned last November that he could have easily written a tool that hangs piggyback on one of the exempt Apple services and thus could contact his own server unnoticed and unblocked through local firewalls.
In the most recent beta 2 of macOS 11. 2 Apple’s exclusion list (“Content Filter Exclusion List “) suddenly completely removed, explained Wardle now. His own firewall LuLu can again see and block all network traffic. The Little Snitch developer Objective Development also emphasizes that their own firewall from macOS 11. 2 can “reliably display and filter all network traffic”. Apple itself has not yet commented on the problem.
Exclusion list only really works in Big Sur Already since macOS 10. 15 Catalina puts Apple over 50 its own apps and services on the said exclusion list. It makes their network activities invisible to third-party apps that use Apple’s new network extensions NEFilterDataProvider and NEAppProxyProviders. In macOS 10. 15, the exclusion list usually does not work yet because local firewalls are included a kernel extension can intervene deeper in the system. Kernel extensions are considered obsolete by Apple and can only be used to a limited extent and with additional effort in macOS 11; accordingly, firewalls and other tools must be based on the convert new network expansions.
The Dotnet Doctor 14. 01. 2021 10: 32 o’clock Holger Schwichtenberg – 0 Comments
Microsoft has published a list of features that are available in version 6.0 of the Object Relational Mapper (ORM) Entity Framework Core in the November 2021 should appear.
Microsoft wants Support column types in JSON format and especially for Microsoft SQL Server temporal tables in all database systems. When creating database tables using forward engineering, the order of the columns should now be able to be influenced.
Microsoft now plans to implement the “Migration Bundle” feature planned for version 5.0 in version 6.0. As an alternative to an SQL script, an executable file should be generated that updates the database schema (developers can already build this themselves in just a few steps).
Reverse engineering and batching API With reverse engineering, Microsoft now wants to translate pure intermediate tables into N: M skip navigations. The support for N: M skip navigation was implemented in version 5.0, but only activated for forward engineering. For ADO.NET there should be a new batching API (class DbBatch ); Microsoft also wants to use this in Entity Framework Core.
As in every version of Entity Framework Core, Microsoft also wants to work on performance and compatibility with its predecessor, the classic ADO.NET Entity Framework, improve. Ahead-of-time compilation (AoT) support, which is generally on the agenda for .NET 6.0, should be at least partially supported in Entity Framework Core 6.0.
Supermicro has announced its first workstation based on AMD’s Ryzen Threadripper Pro processor. The new system can pack a CPU with up to 64 cores, up to 2TB of RAM, and up to four double-wide graphics cards or accelerators. The machine is designed for AI/DL, digital content creation, and engineering simulations.
Historically, AMD has been quite keen on winning designs with server makers, but when it comes to workstations from professional suppliers, the company has never been truly profound. Perhaps because high-end/corporate workstations is not exactly a high-volume business and spending resources on winning servers is always more fruitful. Yet, with its Ryzen Threadripper Pro 3000WX-series, AMD clearly wants to enter this market. The Supermicro A+ SuperWorkstation 5014A-TT is the industry’s second workstation based on AMD’s Ryzen Threadripper Pro 3000WX-series processor after Lenovo’s ThinkStation P620 machine and it actually has an edge over its only rival as it supports more dual-slot PCIe 4.0 x16 cards, according to its manufacturer.
The A+ SuperWorkstation 5014A-TT workstation is based on the AMD WRX80 platform with all of its advantages, such as an eight-channel memory subsystem that supports up to 2TB of DDR4-3200 SDRAM with or without ECC as well as 128 usable PCIe 4.0 lanes. The M12SWA-TF motherboard that powers the workstation carries six PCIe 4.0 x16 slots, four M.2-2280/22110 slots for SSDs, two U.2 sockets, one GbE port (Intel I210AT), one 10GbE connector (Marvell AQC113C), an ASpeed AST2600 baseboard management controller, a TPM 2.0 header, multiple USB 3.2 Gen 2 Type-A & Type-C ports, and a 7.1-audio codec.
(Image credit: Supermicro)
The machine itself measures 535×222×573 mm and is equipped with an up to 2000W 80Plus Platinum-certified PSU, so it will handle virtually all combinations of AMD’s Ryzen Threadripper Pro CPUs with any graphics cards, compute accelerators, SSDs, and memory modules available today. Meanwhile, since the A+ SuperWorkstation 5014A-TT is listed as ‘coming soon’, Supermicro does not disclose which add-in cards and storage devices it will offer with the system.
(Image credit: Supermicro)
The manufacturer has not yet disclosed pricing of its A+ SuperWorkstation 5014A-TT machines, but it is logical to expect its MSRP to be comparable to that of Lenovo’s ThinkStation P620.
Qualcomm on Wednesday said that it had agreed to acquire Nuvia, a small yet ambitious microprocessor startup. The takeover of Nuvia will get Qualcomm a high-performance CPU design along with a proven CPU and system architecture design team, something that could give a strong boost to the company’s mobile and PC system-on-chip (SoC), and eventually server SoC businesses.
“CPU performance leadership will be critical in defining and delivering on the next era of computing innovation,” said Gerard Williams, CEO of Nuvia. “The combination of Nuvia and Qualcomm will bring the industry’s best engineering talent, technology and resources together to create a new class of high-performance computing platforms that set the bar for our industry. We couldn’t be more excited for the opportunities ahead.”
Qualcomm Gets New CPU Technology
Under the terms of the agreement, Qualcomm will pay $1.4 billion for Nuvia. It will get Nuvia’s CPU designs and technologies. Furthermore, the founders of Nuvia will join Qualcomm’s team, including John Bruno, Manu Gulati, and Gerard Williams III, who previously worked on CPUs and system architectures at Apple, AMD, Arm, and Google.
(Image credit: Qualcomm)
Qualcomm says that Nuvia’s CPU technology will be used for its Snapdragon SoCs for smartphones and next-generation always-connected PCs (ACPCs) running Microsoft’s Windows or Google’s Android. In addition, the same technology will be used for Qualcomm’s platforms for self-driving cars. As Qualcomm plans to address smartphones and PCs with Nuvia’s technologies, it expects to become a much stronger rival for companies like AMD, Apple, Intel, and Nvidia if the latter succeeds in taking over Arm.
“Creating high performance, low-power processors and highly integrated, complex SoCs are part of our DNA,” said Jim Thompson, Chief Technology Officer of Qualcomm. “Adding Nuvia’s deep understanding of high-performance design and integrating Nuvia CPUs with Snapdragon – together with our industry-leading graphics and AI – will take computing performance to a new level and drive new capabilities for products that serve multiple industries.”
Meanwhile, Qualcomm did not disclose whether it has plans to use Nuvia’s processors for SoCs aimed at datacenters that could succeed the company’s ill-fated Centriq CPUs.
All major partners of Qualcomm, including Microsoft, Google, Samsung, Acer, Bosch, HP, Lenovo, LG Electronics, Renault, and numerous others have already endorsed the acquisition of Nuvia and expressed excitement about the prospects.
Ambitious Plans
John Bruno, Manu Gulati, and Gerard Williams III founded Nuvia back in 2019 with a plan to disrupt the cloud server market with a system-on-chip that would offer a significantly higher performance at a fraction of the power of x86 CPUs.
(Image credit: Nuvia)
Nuvia’s very first server SoC that the company described last year is called Orion, and it is based on custom Phoenix cores. The latter is believed to be based on Arm’s Armv9 architecture yet features a revamped pipeline designed to enable the core to scale from power/thermally constrained designs to machines designed for unconstrained performance.
Last year, Nuvia demonstrated its Phoenix core’s simulated performance compared to Apple’s Lightning and Vortex, Intel’s Sunny Cove and Skylake, AMD’s Zen 2, and Arm’s A77 cores in Geekbench 5. Based on the numbers showcased by Nuvia, its Phoenix could deliver at least 50% higher peak performance (2000 points vs. 1300 points) than AMD’s Zen 2 and Intel’s Sunny Cove at 1/3 of power (4.50W vs. 14.80W) or around 2.5 times higher per-core performance at the same (4.50W) power.
Nuvia never announced that it had taped out its Orion SoC or Phoenix core, so nobody outside of the company understands the design’s readiness.
Phoenix to Meet Snapdragon
Assuming that Nuvia’s Phoenix is ready now, it could be used for Qualcomm’s Snapdragon SoCs that will be released sometime in 2022 at the earliest. That said, it will have to compete against Apple’s, AMD’s, and Intel’s cores due in the coming years. Therefore, it remains to be seen how competitive the core will be against next-generation rivals.
(Image credit: Qualcomm)
Historically, Qualcomm has developed its custom Arm cores called Kryo, but they are largely based on Arm’s off-the-shelf designs and do not offer tangibly higher performance than the standard Cortex-A series. With a full-custom core design, Qualcomm will likely be able to offer considerably higher performance, which might make smartphones and laptops running next-generation Snapdragon SoCs more competitive against handsets powered by Apple’s SoCs or notebooks based on processors from AMD or Intel.
What is particularly important is that original designers of the new core will join Qualcomm and will continue to develop their Phonix core architecture, which pretty much guarantees steady performance gains in the coming years, making Qualcomm’s SoCs considerably more competitive going forward.
Zen 3 for laptops AMD has New laptop processors featuring Zen 3 architecture were unveiled at the CES trade show. In addition to the U models for thin notebooks, the company has also unveiled the new HX SKUs for gaming laptops. The new video cards for both laptops and the desktop were also discussed. In addition, there is a hint to the new generation of Epyc server chips.
De Ryzen 7 5800 U is the top model of the economical U-series. With 8 cores and 16 threads will be the title of the only x 86 – octacore claimed in the ‘ultrathin’ class . According to AMD CEO Lisa Su, the new apu performs 7 to 44% better than Intel Core i7 – 1185 G7, depending on the workload. In addition to better performance, the U-line should also ensure a longer battery life. Up to 21 hours claimed when playing video.
In addition, two HX processors have been unveiled, the Ryzen 9 5900 HX and 5980 HX. They feature 8 cores and 16 threads, and a total of 20 MB of L2 and L3 cache. The difference is in the clock speed. The 5900 HX boost up to 4.6 GHz , the 5980 HX achieves a maximum frequency of 4 , 8 GHz. Both SKUs have a tdp of ’45 W + ‘, as it is possible to overclock them.
During the presentation the 5900 HX is compared to the Core i9 – 10980 HK, the best Intel has to offer in the field of mobile gaming processors. The Ryzen chip performs better in all areas. This is how he scores 15% higher in Cinebench R’s single-threaded test 20, the 5900 HX performs 19% better than its Intel counterpart in 3DMark Fire Strike Physics.
The first laptops with Ryzen 5000 – CPUs must already will be available from February. AMD expects such a 250 different models are coming. At the 4000- and 3000 – series was this respectively 150 and 70.
After the end of the presentation, AMD will full lineup of laptop processors posted on its website. It can again be deduced that the 5000 – series consists of both Zen 2 and Zen 3 chips, confirming previous rumors.
Processor Cores / Threads Base Clock Boost Clock Cache TDP Architecture AMD Ryzen 9 5980 HX 8C / 16 T 3.3 GHz 4.8 GHz 20 MB 45 + W Zen 3 AMD Ryzen 9 5980 HS 8C / 16 T 3.0 GHz 4.8 GHz 20 MB 35 W Zen 3 AMD Ryzen 9 5900 HX 8C / 16 T 3.3 GHz 4.6 GHz 20 MB 45 + W Zen 3 AMD Ryzen 9 5900 HS 8C / 17 T 3.0 GHz 4.6 GHz 20 MB 35 W Zen 3 AMD Ryzen 7 5800 H 8C / 16 T 3.2 GHz 4.4 GHz 20 MB 45 W Zen 3 AMD Ryzen 7 5800 HS 8C / 16 T 2.8 GHz 4.4 GHz 20 MB 35 W Zen 3 AMD Ryzen 5 5600 H 6C / 12 T 3.3 GHz 4.2 GHz 19 MB 45 W Zen 3 AMD Ryzen 5 5600 HS 6C / 12 T 3.0 GHz 4.2 GHz 19 MB 35 W Zen 3 AMD Ryzen 7 5800 You 8C / 16 T 1.9 GHz 4.4 GHz 20 MB 15 W Zen 3 AMD Ryzen 7 5700YOU 8C / 16 T 1.8 GHz 4.3 GHz 12 MB 15 W Zen 2 AMD Ryzen 5 5600YOU 6C / 12 T 2.3 GHz 4.2 GHz 19 MB 15 W Zen 3 AMD Ryzen 5 5500YOU 6C / 12 T 2.1G Hz 4.0 GHz 11 MB 15 W Zen 2 AMD Ryzen 3 5300YOU 4C / 8T 2.6 GHz 3.8 GHz 6MB 15 W Zen 2
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