The first information about the new One Mix 4 Mini-Convertible from One Netbook was released a few weeks ago. Now the first pictures and specifications are finding their way to the public. The One Mix 4 has a 10, 1-inch touch screen with a resolution of 2. 560 x 1. 600 pixels, resulting in a pixel density of 300 PPI leads. The display has a 16: 10 – format and lights up with a maximum brightness of up to 320 nits. In addition, the screen can be completely folded back using the hinge, which enables it to be used as a tablet.
An Intel Tiger Lake processor works inside the One Mix 4. Customers can choose between an Intel Core i5 – 1130 G7 and a Core i7 – 1160 G7. Both processors have four cores and a TDP between 7 and 10 W as well as an integrated Intel Iris Xe Graphics G7. In addition, depending on the configuration, up to 16 GB LPDDR4X – 4266 – RAM.
The One Mix 4 has two Thunderbolt 4 ports and a USB Type-C port. In addition, an AUX connection and a microSD card reader are available. Both WiFi 6 and Bluetooth 5.1 are available for wireless connections. A fingerprint sensor in the power button is also on board. Unfortunately, a webcam is not integrated, which is why customers have to use an external camera for use in a video conference.
The One Netbook One Mix 4 is to be delivered this spring. The price at JD.com is currently quoted as 5 699 Chinese yuan – converted to around 727 euros.
Intel’s next-generation minicomputer is equipped with both the company’s own integrated Xe graphics driver and NVIDIA’s GeForce RTX 2060 graphics card.
Intel’s processor announcements at the CES 2021 virtual fair ignored many smaller releases. One of these was the company’s next-generation Phantom Canyon NUC computer.
Phantom Canyon’s official name is NUC 11 Enthusiast Mini PC that follows more traditional lines as a ready-made configuration instead of the NUC 9 Extreme’s modular design. As expected, the minicomputer is equipped with the company’s latest generation of iron.
NUC 10 At the heart of the Enthusiast is a 4-core Core i7 based on Intel’s Tiger Lake architecture – 1165 With the G7 Xe graphics driver. The company has chosen NVIDIA’s GeForce RTX 2060 as a separate video card. The computer will be available as well as the so-called. Barebone putty that fully equipped 11 with GB memory (2x 8 GB DDR4 – 3200), Optane Mem H 11 hybrid SSD drive (32 Gt Optane + 512 Gt SSD) and Windows 10 Home license. GeForce RTX 2060 is also part of the Barebone version.
Intel has also made slightly more special solutions in its new minicomputer. Although the video card chosen by the company only supports the PCI Express 3.0 standard, it is connected to the processor’s PCIe 4.0 lines, making only PCIe 3.0 lines available for M.2 drives. The computer has two M.2 ports, the first supporting only NVMe drives and the second supporting both NVMe and SATA drives.
On the interface side, there are two Thunderbolt 4 connectors, which are also the only USB Type-C connectors in the configuration. In addition to Thunderbolt, the computer has two USB 3.2 Gen 2 Type-A connectors on the front panel and four on the back panel and an SDXC UHS-II card reader. One of the front panel USB connectors supports fast charging. Intel 2.5 Gbps 512 – LM network controller and Wi-Fi 6 AX 3200 is responsible for network connections , which supports both Wi-Fi 6 and Bluetooth 5.1. There are two or four display connections, depending on the calculation method. One mini-DP 1.4 connector and an HDMI 2.0b connector are connected to the separate video card, but the Thunderbolt 4 connectors connected to the integrated Xe graphics driver also support the DisplayPort 1.4a standard.
Intel NUC 10 The strategic dimensions of the Enthusiast Mini PC are 221 x 142 x 42 mm and 1.3 liters. The housing cover is equipped with RGB lighting and is replaceable. Price information is not yet official, but according to AnandTech, SimplyNUC sells a partially customized configuration 128 on a GB NVMe SSD and 16 with GB memory 1349 for a dollar pre-order price and another anonymous store Barebone version 1130 for the dollar price. Deliveries of SimplyNUC pre-orders will begin in March
Just a few days ago, during the CES conference 2021, AMD has officially unveiled the fourth generation of APUs from the Cezzane family. It is a family based on the new Zen 3 architecture, which boasts, among other things, doubled the amount of L3 cache and reduced latency. The new AMD Cezanne-H processors are to hit machines from different price and performance shelves, also to top gaming laptops. We have already learned the performance of one of the leading models in the form of AMD Ryzen 9 5900 HX. To the delight of fans of the “red power side”, the new chip takes the top place in the multithreading test in PassMark, beating Intel processors.
AMD Ryzen 9 5900 HX scores 7 in the PassMark multithreading test 445 points more than last year’s Intel Core i9 10980 HK.
AMD Ryzen 5000 – premiere of Cezanne processors for laptops Zen 3 architecture enters the top notebook
AMD Ryzen 9 5900 HX is 8- core and 16 – threaded, unlocked processor with TDP 45 W + which works with clocks from 3.3 to 4.7 GHz. This is the second the best chip from the AMD Cezanne family, and only AMD Ryzen 9 5980 HX with 100 MHz with higher boost clock. The system went to the ASUS ROG Strix SCAR laptop 17 G 733 (32 GB of RAM + GeForce R TX 3080), and this one was tested in PassMark in the multi-threaded performance test. Currently from 24 039 he takes first place with points. For comparison, the top chip from the competition, Intel Core i9 10980 HK, has only in the same test) 594 points.
New test procedure for gaming laptops with Intel Tiger Lake-H, AMD Cezanne-H and NVIDIA GeForce RTX 3000
For the sake of fairness, however, it must be emphasized that the CPU from the Blue was tested at 2.4 GHz. So let’s take a look at the performance against the previous generation mobile chips from AMD. Here AMD Ryzen 9 5900 HX drops by 21% better than AMD Ryzen 9 4900 HS (19 854 points) and 25% better than AMD Ryzen 7 4800 H (19 180 points). The question is, what will the performance of the upcoming Intel Tiger Lake mobile chipsets, which are expected to be released in the second half of the year 2021, look like?
A big thank you to ASRock for providing the review sample and Kingston for providing the system memory and SSD.
ASRock has become a significant provider of motherboards and graphics cards since its formation in 2002. The company has stuck to their 3C design concept of “Creativity, Consideration, Cost-effectiveness,” which has taken them from humble beginnings to enthusiast favorite. Over time, their product portfolio has also expanded from simple motherboards to high-end offerings, alongside graphics cards, routers, components, mini-PCs, and industrial systems.
Today, I look at the ASRock NUC BOX-1165G7 barebones system with an Intel i7-1165G7 at its core. The processor is an Intel 10 nm 4-core, 8-thread Tiger Lake offering with the company’s Iris Xe Graphics, which has 96 execution units. Overall, the CPU has a maximum turbo frequency of 4.7 GHz with a base clock of 2.8 GHz. Meanwhile, it can support up to 64 GB of DDR4-3200. To test the system, Kingston provided both 16 GB (2x 8 GB) and 32 GB (2x 16 GB) kits of DDR4 3200 MHz memory, which retail for $80 and $160 respectively as I am writing this, along with a 500 GB KC2500 M.2 NVMe SSD, which retails for $107. To be thorough, I have tested both sets of memory to see if going big has any tangible benefits.
Since the summer 2020, entries on Intel’s upcoming desktop processor generation Alder Lake-S alias Core i have been appearing in online benchmark databases. 12000 on – the first desktop series with 10 – nanometers -Technology. In the case of a new run with SiSoftware Sandra, DDR5-SDRAM is now also used, and the clock frequencies are higher.
The tested processor is it is a 16 Kerner. For the Alder Lake series, Intel relies on hybrid computing with a mix of eight large Cove and eight smaller, but more efficient Atom computing cores when the load is low. As a result, the software reads 24 threads: The large CPU cores can handle Hyper-Threading, the small ones not.
Lots of L2 cache and DDR5-SDRAM Only the information in the read ID make less sense: It is there 32 threads and 10 × 1, 25 MByte level 2 cache. This is probably due to the different CPU cores, since SiSoftware Sandra simply does not yet know the hybrid approach of desktop processors. 1, 25 MByte L2 cache per Cove core, i.e. eight times, seems likely with a view to the Tiger Lake mobile processor generation. The Atom cores are traditionally content with a fraction.
Unlike in previous entries, SiSoftware Sandra now also shows DDR5 instead of DDR4 SDRAM. We are talking about 4.8 GHz, i.e. DDR5 – 4800 – the lower end of what modules should come onto the market in the second half of the year.
With previous test results DDR4 could have been read incorrectly or Alder Lake can handle both memory standards. In the case of transitional generations, this would not be surprising, but it is questionable what Intel will offer with the upcoming LGA 1700 platform. The focus should be on DDR5.
The CPU clock frequencies are increasing: The base clock rate of 1.8 GHz is still low, but the turbo has reached the 4 GHz mark. Pre-production models traditionally have a lower clock rate than the final retail processors. Intel wants to present Alder Lake-S by the end of the year – the test results that appear fit into the course of time.
In terms of reporting and external perception, a lot in the IT environment is concentrated on processors, GPU accelerators and, if necessary, a few special solutions in the AI area. We often speak of centralized solutions (not in the form of large data centers or supercomputers) in which enormous amounts of data are processed. Another field of applications is plowed by Intel in the form of FPGAs. At the Intel FPGA Technology Day 2021 some announcements were made that we want to shed light on.
But these high ones Data volumes that each user produces themselves or that are created through interaction with the environment make edge computing increasingly important. In edge computing, the calculations and thus the filtering of the data are carried out where they arise. Already today more than 50 zettabytes of data are produced worldwide. This corresponds to an amount of data that is stored on five billion HDDs, each with 10 TB would have to be saved. 2025 according to Intel 175 zettabytes
In order to be able to process this data in a usable way, special hardware is required. For example, NVIDIA introduced the HGX accelerator, which uses the A 50 GPU directly with Mellanox ConnectX-6 Lx SmartNICs is linked. High computing power paired with a fast network connection. Intel offers similar solutions with the Stratix FPGAs.
The chiplet design of the FPGAs from Intel can be adapted to the necessary requirements. A compute tile is combined with a DDR memory controller and high-speed HBM memory. In R, F, P, H and E tiles, for example, PCI Express controllers of different generations or expansion levels of Ethernet controllers can be accommodated. Details can be found in the announcement for the Stratix 10 NX FPGA . For these, Intel is announcing on FPGA Technology Day 2021 that it has started mass production.
The chiplet design of the FPGAs offers more than just one Flexibility in the actual design, but also in production. In this way, the individual tiles can be produced in the manufacturing process in which this is possible or makes economic sense. The chips are then placed on a package via EMIB and Foveros.
The next generation of FPGAs will continue the chiplet design. From the current six series (GX, SX, TX, MX, DX and NX), Intel will then make three series (F, I and M series). These FPGAs originally planned for 2019 should be available in the coming months and use a production specially adapted for FPGAs in 10 nm SuperFin. The 06 nm SuperFin technology is Intel’s lifeline for problematic manufacturing in 10 nm and comes among other things for the tiger Lake processors are used. For the Agilex FPGAs, Intel is planning with DDR5 and PCI-Express 5.0 as well as the CXL interconnect – all of which will be possible as a chiplet add-on.
Intel combines these rather heavyweight FPGAs with the Max – and Cyclone series, which are more cost-effective, but which can also be used closer to the end point of the creation of the data.
The Direct RF FPGA is also being presented as a completely new series. This is explicitly designed for a quick analysis of radio frequency data and should be five times faster than anything else currently available on the market. 64 The chip should be able to record gigasamples per second. However, these performance data are based on projections by Intel, because the Direct RF FPGA has not yet been tested. The Direct RF FPGA is to be used in the field of RF and wireless test equipment, but also in the military. Intel does not specify when the new FPGA series will be shipped.
Intel’s FPGAs can work together with Xeon processors via a coherent interconnect. But Intel is also bringing its own products together with FPGAs in other areas. So it is possible to equip them with Optane DC Persistent Memory (instead of DDR memory).
The NEC Lavie range, owned by Lenovo now, has been on the market for a few years with very small, convertible laptops. His latest creation, the Lavie Mini, combines an 8-inch laptop convertible into a tablet with a game console compatible with integrated controllers.
The 8-inch screen has a good resolution of 1. 920 x 1. 90 pixels in 16: 01 together with a refresh rate of 60 Hz. This touch screen is attached to a small QWERTY keyboard by means of hinges that allow the rotation of 360 degrees to become a tablet.
The NEC Lavie Mini integrates an 11th generation Intel Core i7 “Tiger Lake” with Iris Xe graphics
Inside it hides an Intel Core Tiger Lake processor from 11 3rd generation with integrated Iris Xe graphics from the Core i7 range, graphics that manages the screen and HDMI output. You also have USB-C and USB-A, in addition to 16 GB of LPDDR4 memory and 360 GB of integrated SSD. Also offers WiFi 6 and infrared camera for use with Windows Hello on Windows 10 , operating system that integrates as standard.
The battery that powers the Lenovo Lavie Mini is 26 WH and the total weight of the equipment is only 579 grams. The equipment is compatible with controllers similar to those of the Nintendo Switch, as well as other accessories such as docks.
At the moment we do not know its availability and price.
End of Article. Tell us something in the Comments or come to our Forum!
Antonio Delgado
Computer Engineer by training, editor and hardware analyst at Geeknetic since 2011. I love gutting everything that comes my way, especially the latest hardware that we get here for reviews. In my spare time I fiddle with 3d printers, drones and other gadgets. For anything here you have me.
One year ago at CES 2020 in Las Vegas, Alienware made waves with a modular gaming PC that worked like a Nintendo Switch, with a pair of gamepads flanking a powerful Windows 10 tablet. Sadly, Alienware’s UFO was just a concept, as was Lenovo’s take on the idea this year — but two companies are now taking up the torch with a pair of crowdfunded gadgets you might actually see in your lifetime. They look seriously legit.
The 5.5-inch GPD Win 3 and the 7-inch Aya Neo aren’t going about it in quite the same way; while the Ava tries to closely match Nintendo’s console in shape, size, and with strictly gaming controls on board, the GPD sticks to its palmtop computer roots with a slide-up screen that reveals a tiny backlit keyboard. There’s also a fingerprint sensor, a microSD slot and an optional Thunderbolt 4 dock if you want to use the GPD like a full Windows 10 computer.
The GPD Win 3.Images by GPD
What’s the same: both are genuinely trying to deliver a powerful tablet surrounded by joysticks and buttons for under $1,000 each. With Intel’s latest Tiger Lake chips and AMD’s Ryzen 4500U respectively, each has some of the latest and greatest integrated graphics you can buy, and they claim pretty decent performance as a result — Cyberpunk 2077 can reportedly hit 30fps at the Aya Neo’s 1280×800 resolution at low settings, and GPD offers a long list of examples of recent, demanding games that you can coax well over the 50fps mark with its Intel Xe graphics.
As you can see in the spec comparo sheet I whipped up below, each features 16GB of DDR4 memory, a speedy NVMe solid state drive, Wi-Fi 6 and Bluetooth 5.0, a pair of stereo speakers, a genuine headphone jack, and multiple USB ports. Not bad!
Just know that these systems are going to be chonky compared to an actual Nintendo Switch’s 0.55-inch thick frame and 0.88-pound weight, and battery life will be a big question, with both the Aya Neo and GPD Win 3 allowing you to fine-tune the chip’s TDP wattage to get the most out of their tablet-sized cells. NotebookCheck says you shouldn’t expect to get more than 1.5 hours out of the GPD Win 3 while playing a demanding game, though Taki Udon on YouTube claims you can get 2-3 hours out of an early Aya Neo.
Speaking of Taki Udon’s video, it looks like a fantastic overview of the handheld, so I recommend checking it out, and this second vid that shows off how well games like Cyberpunk 2077 and Sekiro play on his Founder’s model. It’s not enough to convince me to crowdfund a company I’ve never heard of, but it’s a good start.
You should also know that not all of these handhelds are going to look and play the same: the transparent Aya you’re seeing in the videos was a limited edition of 15,000 for early pre-orders in China, with final models launching in black and white instead when they ship in April. Aya will be launching its Indiegogo campaign in February with a “super early bird limited price” of $699, with no word on how much the rest of us might pay.
The GPD Win 3 is already on Indiegogo, where you’ll pay $799 for the Core i5-1135G7 version, with the more powerful i7 chip starting at $899, or $949 for a package with the optional USB, HDMI and Gigabit Ethernet docking station.
Between these handheld gaming PCs, the cute upcoming Playdate and the gorgeous Analogue Pocket, some of the squeaky clean mods we’ve seen of late, not to mention the popularity of the Switch itself and the march of ever smaller and more powerful chips, it feels like we might be entering a gaming handheld renaissance. Here’s hoping.
Introduction Dataminer Tum_Apisak has a series of Geekbench results posted to Twitter. It concerns different laptop processors from both Intel and AMD. Thanks to these new benchmarks, it is possible to compare the next generations of the major processor manufacturers.
Two new Intel Tiger Lake SKUs have emerged. These are processors from the presumed H 35 series, and will receive a maximum of 4 cores a tdp not exceeding 35 W. Intel is expected to announce this series at the CES show in January. The strongest H-series processors will probably have 8 cores, and a tdp of 45 watts. It is rumored that Intel is still working hard on these models. They are therefore expected at the earliest in the second quarter of next year.
In addition to AMD and Intel, Nvidia will also hold an event during the CES fair of 2021.
In addition, the next generation of laptop chips has been emerging from the red camp for some time now, in the form of product pages that appear at retailers or spotted benchmark results. Now that the lower segmented Ryzen 5 5600 H has surfaced, it becomes more clear what the Cezanne lineup looks like. Also AMD would be frugal Ryzen 5000 U and high end 5000 To announce H processors at the CES trade show, which takes place in three weeks time.
As both processor series ( have not yet been officially announced, there is no guarantee that the surfaced specifications are final. These figures are thus always susceptible to change. Yet they give an indication of the processor landscape in the field of laptops in 2021.
During the CES trade fair 2021, ASUS presented a lot of new and refreshed laptops based on mainly on NVIDIA GeForce RTX cards 3000 and AMD Ryzen series processors 5000. In addition to gaming news, there are also announcements of cheaper TUF Gaming devices and 14 – an inch ZenBook ultrabook Duo 14 with Intel Tiger Lake processors. This time we will focus on one of the slimmest laptops of the Taiwanese manufacturer – ZenBook 13 UM 325. Last year, the laptop was launched for the first time, but then it was based on Intel Ice Lake-U processors. This year’s version is going to the AMD Cezanne-U APU, while heading towards OLED screens and not with 4K resolution, which for many people is absurd in this diagonal.
ASUS presented new version of ZenBook laptop 13 UM 325. It will be based on AMD Ryzen 5 5600 U, AMD Ryzen 7 5800 U processors and an OLED Full HD screen.
ASUS ROG Flow X 13, ROG Zephyrus, ROG Strix – gaming laptops with AMD Cezanne-H and NVIDIA GeForce RTX 3060, RTX 3070 and RTX 3080
New ASUS ZenBook 13 UM 325 (2021) will be equipped with the following APU processors: AMD Ryzen 5 5600 U (6C / 12 T, Zen 3) and AMD Ryzen 7 5800 U (8C / 16 T, Zen 3). This is a big change, because last year’s version had a processor with up to 4 cores and 8 threads. Another change is the matrix – instead of an IPS screen, ASUS offers an OLED panel with a diagonal 13 , 3 “and resolution 1920 x 1080 pixels This is one of the newest OLED screens from Samsung that we heard about at CES 2021. 100% DCI-P3 color coverage and luminance of 400 rivets.
AMD Ryzen 5000 – premiere of Cezanne processors for laptops. Zen 3 architecture enters top notebooks
Like last year’s version, the new ASUS ZenBook 13 UM 325 has an integrated NumberPad with a touchpad. Inside the laptop you will also find 16 GB of LPDDR4x RAM clocked at 3733 MHz and a single PCIe 3.0 x4 SSD with a capacity of 1 TB. Among shared These ports can be found: 1x USB 3.2 type C Gen.2 (DP 1.4, Power Delivery), 1x USB 3.2 type A Gen.2, full HDMI 2.0b and a microSD memory card reader. As in the predecessor from 2020, there will be no 3.5 mm audio-jack socket (the adapter will be included in the set). Built-in battery with a capacity 67 Wh is supposed to allow a maximum of 16 operating hours away from a power outlet. The weight of the laptop is 1. 14 kg. Unfortunately, we do not know the price of the ASUS ZenBook 13 OLED or the date it was introduced to the store. However, by combining efficient and energy-saving AMD Ryzen processors 5000 and a Full HD OLED screen, we will certainly get one of the most interesting laptops with such a small size.
Taiwan Semiconductor Manufacturing Co. said this week that it would significantly increase its capital expenditures this year as it needs to build and equip new fabs to ramp up its existing and next-generation leading-edge process technologies. Demand for advanced fabrication nodes is on the rise. In Q4 2020, revenue for N5 (5 nm) and N7 (7 nm) technologies accounted for nearly half of TSMC’s revenue, so it makes a great sense for the manufacturer to continue investing in leading-edge capacities. Furthermore, as Apple and Intel plan to increase orders to TSMC, the foundry will also need more capacity.
TSMC to Spend Up to $28 Billion on Production Facilities in 2021
TSMC’s management plans to spend from $25 billion to $28 billion on capital expenditures in 2021, the world’s largest contract maker of semiconductor announced this week.
(Image credit: TSMC)
If TSMC’s board approves all the investments proposed by the management, then TSMC’s CapEx will rise by 45% ~ 62% year-over-year from $17.2 billion in 2020. The lion’s share of TSMC’s capital budget will be spent on expanding production capacities for the company’s N5 and N7 nodes as well as equipping a leading-edge fab for its N3 (3 nm) node that will be used starting from the second half of 2022.
“Out of the $25 to $28 billion CapEx for 2021, about 80% of the capital budget will be allocated for advanced process technologies, including 3 nm, 5 nm and 7 nm,” said Wendell Huang, chief financial officer at TSMC, during this week’s earnings call with analysts and investors. “About 10% will be spent for advanced packaging and mask making and about 10% will be spent for speciality technologies.”
“The 2021 CapEx is largely for N5 expansion (at least 2x its current 55-60k WPM capacity), and N3 build is limited to pilot line/initial production (+10-15k WPM, though we expect N3’s capacity to be similar to N5’s upon full ramp-up),” Szeho Ng, an analyst with China Renaissance Securities, wrote in a note to clients on Friday.
Production of semiconductors is an extremely capital-intensive business and as process technologies get more advanced and manufacturing tools get more expensive, chipmakers have to increase their CapEx budgets to build fabs that cost as much as $20 billion or even more. Because of increasingly high R&D and fab costs, numerous contract makers of semiconductors had to pull out from the leading-edge and focus on specialized technologies in the recent years.
N5 & N7 Accounted for 49% of TSMC’s Revenue in Q4 2020
But with a number of rivals out of the game, TSMC now has more clients than ever. And considering the fact that there are a number of ongoing megatrends — such as 5G, AI, high-performance computing (HPC), and edge computing — that require advanced chips produced using the most sophisticated technologies possible, demand for TSMC’s higher-end production services is on the rise today and will continue growing in the coming years.
(Image credit: TSMC)
In the fourth quarter, sales of wafers processed using N5 accounted for 20% of TSMC’s total wafer revenue, whereas sales of N7 and 12 nm/16 nm accounted for 29% and 13% respectively. In general, leading-edge N5 and N7 nodes commanded 49% of TSMC’s wafer revenue, whereas advanced nodes (N5, N7, N12/N16) accounted for 62% of the company’s total wafer revenue.
TSMC’s N5 process technology in Q4 2020 was primarily used by Apple, which uses it for its A14 system-on-chips for smartphones and tablets as well as M1 SoCs for its latest PCs. The company’s N7 is used more widely by companies like AMD, Apple, Nvidia, Qualcomm, and Xilinx, whereas N12/N16 is used by dozens of companies for all kinds of applications.
“Our fourth quarter business was supported by strong demand for our industry-leading 5 nm technology, driven by 5G smartphone launches and HPC-related applications,” said Mr. Huang. “Moving into first quarter 2021, we expect our business to be supported by HPC-related demand, recovery in the automotive segment, and a milder smartphone seasonality than in recent years.”
TSMC’s N5 is a major improvement over N7 node that enables a 15% higher performance (at the same power and complexity) or a 30% lower power consumption (at the same frequency and complexity), and an up to 1.8X higher transistor density (not for all structures). In addition, N5 uses extreme ultraviolet (EUV) lithography on more than 10 layers to reduce mask count to 81 as well as reduce or even avoid usage of multipatterning, which optimizes yields and costs. Considering all the advantages that N5 has over N7, the majority of TSMC’s clients that use N7 now will migrate to N5 over time.
Later this year TSMC will offer its customers a performance-enhanced version of N5 that is called N5P. The latter is projected to enable a 5% performance gain and/or a 10% power reduction over N5 while staying generally compatible. Yet, N5P will be used by select chip designers only as next year TSMC will offer N4 that will provide further PPA (power, performance, area) enhancements while being compatible with N5 on design rules, IPs, and SPICE levels. TSMC’s fabs that currently process wafers using its N5 technology will also be able to use N5P as well as N4, so any investments going there will be used for years.
N3 Could Be More Successful Than N5 and N7
TSMC’s next major step after N5 will be N3 (3 nm). This technology promises an up to 15% performance gain (at the same power and transistor count), or an up to 30% power reduction (at the same speed and transistor count), along with an up to 20% higher SRAM density as well as an up to 70% higher logic density. This technology is still in development and will be used starting from the second half of 2022.
(Image credit: TSMC)
TSMC says that it sees more interest in N3 from potential clients in the HPC (TSMC considers ‘HPC’ all CPUs, GPUs, FPGAs, non-mobile SoCs, special-purpose accelerators, etc.) and smartphone spaces than it did with N5 and N7 when they were at a similar stage of development.
“We are seeing a much higher level of customer engagement for both HPC and smartphone application at N3 as compared with N5 and N7 at a similar stage,” said C. C. Wei, Chief Executive Officer of TSMC. “Risk production is scheduled in 2021, and volume production is targeted in the second half of 2022.”
TSMC does not disclose any actual numbers that would quantify interest for N3 from its clients, but since many new applications are going to emerge in the coming years, it is not surprising that more players with more designs will be opting for a leading-edge process technology in 2022 ~ 2025 than they did several years ago. Furthermore, since N3 continues to rely on FinFET transistor structures with predictable performance and costs, the fabrication process will be a very long node as its successors will move to GAAFETs (gate-all-around field effect transistors), which is going to have a significant impact on design costs. For example, TSMC’s 28 nm node that relies on planar transistors accounted for 11% of its wafer revenue in Q4 2020, nine years after the fabrication process was introduced.
“We note the bold expansion reflects N3-5 as long- lasting big nodes with expected robust future demand beyond the initial wave from key clients,” Szeho Ng, an analyst with China Renaissance Securities, wrote in a note to clients on Friday.
While eventually dozens of companies will use TSMC’s N3 and N5, there are two customers that are going to have a significant impact on TSMC’s CapEx budgets in the coming years: Apple and Intel.
Apple: More Chips Needed
Traditionally, the bulk of Apple’s orders to TSMC have been its SoCs for smartphones and tablets. Many of its suppliers produce their chips at TSMC as well, but those semiconductors are not made under Apple’s orders and are not made exclusively for the company. As Apple transits its PCs to its own SoCs, starts to use its own modems inside its smartphones and tablets, and increases sales of its accessories that rely on its own system-in-packages (SiPs), it will significantly increase its orders to TSMC.
(Image credit: TSMC)
Apple is the world’s No. 4 PC supplier that shipped 23.102 million computers last year and commanded about 7.6% of the PC market. Sales of PCs in 2020 totalled 302.6 million units, according to IDC. Once the technology giant completes transition of Macs from Intel CPUs to its Apple Silicon SoCs, it will need at least 23.102 million fairly big chips (the M1 is at 120 sq. mm, which is 26 sq. mm smaller compared to Intel’s Tiger Lake-U) every year assuming that the market stays flat and Apple stops gaining market share (something that it has been doing for years).
Apple was also the third largest supplier of smartphones in 2019 with 191 million units shipped, based on IDC’s data. When the company ceases to use third-party 5G modems (which happen to be made using a leading-edge process technology) and transits to its own, it will increase its orders to TSMC by another ~200 million of chips every year.
Apple’s transitions to its PC SoCs and modems will be completed within the next couple of years. While it is hard to quantify Apple’s orders to TSMC in terms of wafers today, it is safe to say that the addition of ~25 million PC SoCs and ~200 million modems to around ~200 million smartphone SoCs that TSMC produces today will significantly increase the number of wafers that the foundry processes for Apple.
Intel: A Wildcard
Intel already outsources manufacturing of multiple products to TSMC and has confirmed officially and unofficially that it would produce Atom and Xeon SoCs as well as GPUs at TSMC. What nobody knows at this point is whether Intel intends to make client and server CPUs at TSMC and if it has such plans, what percentage of its CPUs will be made at TSMC.
(Image credit: Intel)
Since Intel’s outsourcing plans are unclear and perhaps are even undecided, it is not good business to make too many assumptions at the moment. Yet, there are a couple of things to keep in mind. Intel sells hundreds of millions of processors and chipsets for client PCs every year and even if the company decides to outsource 10% ~ 15% of its client CPU/chipset output to TSMC, it will still be tens of millions of units added to Intel’s existing orders to the foundry.
Intel traditionally uses advanced nodes, so to land its orders, which are going to be significant, TSMC will need to have enough capacity to serve the CPU giant along with other customers.
Summary
TSMC’s management plans to increase its 2021 CapEx budget by 45% ~ 62% year-over-year to record $25 billion ~ $28 billion in a bid to expand its leading-edge production capacities and prepare to ramp up production using its N3 process technology in the second half of 2022.
(Image credit: TSMC)
The company sees the ongoing megatrends like 5G, artificial intelligence, high-performance computing (HPC), and edge computing as the main drivers for advanced semiconductors demand in the coming years.
Apple, which is already TSMC’s main customer for advanced nodes, will likely significantly increase its orders to the foundry in the coming years as it transits to its own Apple Silicon SoCs for PCs and in-house designed modems, which will further drive demand for TSMC’s leading-edge manufacturing technologies.
Intel is also going to outsource more of its products to TSMC in the coming years, which will be another factor that will increase demand for the foundry’s sophisticated fabrication processes.
Intel has updated its NUC series. This includes the Phantom Canyon models with dedicated graphics, but also the Tiger Canyon business solution, the simple home user solution Panther Canyon and finally the compute element intended for the industrial sector.
Overall equips Intel 44 NUC models with the new Tiger Lake processors, which differ in terms of the platform as such, or are simply equipped with different processors. Intel offers models that are already equipped with SSD and RAM, but also barebones, in which only the processor is located and the rest of the equipment has to be done by the user.
The NUC based of the Panther Canyon design, Intel packs a case with dimensions of 117 x 112 mm. Depending on the model, the height is 38, 51 or 56 mm. Intel packs either a Core i3 – 100 G4, Core i5- 1135 G7 or Core i7 – 1165 G7. Via two SO-DIMMs up to 58 GB DDR4 – 3200 can be installed. Depending on the height, a 2.5-inch hard drive can be installed in addition to an M.2 SSD. Three Thunderbolt 3 and three USB 3.2 Gen 2 are available for connecting peripherals. The integrated graphics unit is output via HDMI 2.0 and DisplayPort 1.4. Wireless charging with W possible.
NUCs based on the Tiger Canyon design are for business applications provided and therefore use the vPro variants of the Tiger Lake processors. In particular, these are the Core i3 – 1115 G4, Core i5 – 1135 G7, Core i5 – 1145 G7, Core i7 – 1165 G7 and Core i7 – 1185 G7. The integrated graphics unit is used exclusively here. For this, the user gets at least one of the Thunderbolt connections Thunderbolt 4 – Panther Canyon is artificially cropped to that effect.
The Phantom Canyon (NUC 08 Enthusiast) replaces the Hades Canyon, its core processor with Radeon-RX -Vega-M graphics will probably remain a unique collaboration between Intel and AMD. A Core i7 – 1145 G7 with four cores is always installed in the Phantom Canyon. In contrast to all other NUC 11 Intel installs a dedicated graphics card here. It is a GeForce RTX 2017 with 6 GB of graphics memory. Intel’s timing is a bit unfortunate here, because NVIDIA will launch the GeForce RTX 3060 at the end of February, which would certainly have offered better performance.
Additional features include two Thunderbolt 4 and five USB 3.2 Gen 2 as well as a display output via HDMI 2.0a and DisplayPort 1.4. There is also a card reader on the front.
It is currently unclear whether there will be another NUC Extreme (Intel NUC 9 Extreme in the test). It is also open from when and at what price the NUC – 11 – Series will be available.
Following Nvidia’s announcement of the mobile RTX 30 series GPUs, notebook manufacturers are quick to announce refreshes of their laptops with the new hardware. MSI, being one of the key players in performance category wasted no time announcing a bunch of updates across its lineup. The CPUs are still Intel’s older 10th Generation, except for the Stealth 15, which will employ the new H35-series.
MSI Raider
Let’s start with the MSI Raider GE76. A big 17.3-inch gaming laptop with a choihce between 3840 x 2160px 60Hz display or a 240Hz one at 1080p resolution. The CPU options go up to 10th Gen Core i9 paired with an RTX 3080 (16GB GDDR6). RAM is configurable up to 64GB of DDR4-3200 while the storage relies on two M.2 PCIe NVMe slots. A smaller, 15.6-inch version of the same, called Raider GE66, is also available.
MSI Raider
There’s a special GE76 Dragon Edition version brings more premium looks and patterns and SteelSeries keyboard. It also comes with a 300Hz 1080p display.
Pricing starts at $2,199 for the 17-inch variant and $1,499 for the 15-inch one. Both launch in February.
MSI Stealth
The MSI Stealth GS66 is a 15-inch laptop with either a 1080p@300Hz display or 2160p@60Hz. CPUs go up to 10th Gen Core i9 aided by anything between RTX 3060 and RTX 3080 (16GB GDDR6). Storage and RAM are both the same as on the Raider-series.
MSI Stealth GS66
But there’s also the MSI Stealth 15M, which is the only one, for now, that offers the new Core i7-11375H Special Edition Tiger Lake-H35 CPU. It’s a more portable version of the GS66 with 15-inch 1080p screen at 144Hz and up to 64GB of RAM. Only one M.2 SSD slot, though, but since this is Intel’s 11th Gen platform, the laptop also supports Thunderbolt 4 and Wi-Fi 6/6E connectivity.
MSI Stealth 15M
The GS66’s price is yet unknown while the Stealth 15M will sell for $1,499 and will hit the stores in March.
MSI Leopard
MSI Leopard
The next in line are the MSI Leopard GP76 and GP66. The GP76 is a 17-incher and the GP66 is a 15.6-incherm, but the panels are 1080p@144Hz in either case. The available CPUs go up to Core i7 (again 10th Gen). You can select an RTX 3070 or RTX 3080. Dual M.2 PCIe NVMe SSD slots and up to 64GB RAM support are at hand as well.
The 15-inch model will ask $2,299 while the bigger iteration will start at $1,799. Sales begin in February.
MSI Thin
MSI Thin
Finally, we got the MSI Thin with price tags ranging from $999 to 1,499 depending on the configuration and the screen size. The 17-inch GF75 and 15-inch GF65 share the FullHD resolution and 144Hz refresh rate, but you can also get the the smaller version with a plain 60Hz panel.
Let’s be honest. This wasn’t the CES anyone wanted. We’ve been covering North America’s largest tech show for years, so we can definitively say that, without in-person booths and demos, it’s just not the same. The most interesting things at any show happen outside of the scripted press conferences where we get to see and touch products in person, talk to product managers off the record or wander the halls, looking for the unexpected.
However, even in a down year, there were some bright spots that give us hope for a tech-filled 2021. From a new generation of powerful AMD laptops to a super-sleek compact chassis and even an RGB mask, these are the hottest new products unveiled this week.
Best CPU: AMD Ryzen 5000 Mobile
(Image credit: Tom’s Hardware)
AMD’s Ryzen 5000 series granted the company the performance lead over Intel in desktop PCs for the first time in more than a decade, and now AMD has brought that same powerful Zen 3 architecture to laptops — and in record time.
The four-, six- and eight-core ‘Cezanne’ Ryzen 5000 Mobile series should bring the best of Zen 3 to laptops, granting the company the lead in single- and multi-threaded applications over Intel’s Tiger Lake chips that still top out at four cores. These powerful new chips will also find their way into gaming laptops hosting the fastest mobile GPUs, finally giving us high-end options for AMD’s mobile platforms.
The entire Ryzen 5000 Mobile lineup comes with threading enabled, higher clock speeds than their predecessors, and brings AMD’s innovative new boost technology to laptops for the first time, which promises higher performance in lightly-threaded work and longer battery life. AMD even threw in two new overclockable HX-series models that support core, memory, and fabric overclocking, which could be a potent combination with the company’s RDNA2 mobile GPUs that land later this year. — Paul Alcorn
Read more:AMD Announces Ryzen 5000 Mobile ‘Cezanne’ Processors, Zen 3 and Overclocking Comes to Laptops
Best GPU: Nvidia RTX 3060 12GB
(Image credit: Nvidia)
Nvidia effectively wins this one by default, because nothing else was really announced. Sure, GeForce RTX 30-series GPUs are coming to gaming laptops as well, but those are just power-optimized versions of the Ampere GPUs we already know and love — well, those of us who are lucky enough to have found one in stock, at any rate.
The GeForce RTX 3060 sounds like an amazing value proposition. Performance looks like it should come pretty close to matching the RTX 2070 Super, a card that launched at $500. What’s more, Nvidia has elected to go with a 12GB VRAM configuration, which is more memory than any of the other RTX cards outside of the RTX 3090 and Titan RTX. It’s about time, I say! Plenty of games won’t need 12GB, but there are enough that now creep past 8GB that it’s a welcome change, and 6GB definitely wouldn’t feel right on a $330 mainstream card that’s supposed to last a few years.
The real question: Is there a chance in hell that Nvidia and its partners will have enough RTX 3060 cards available at launch to satisfy the demand? My crystal ball is literally laughing at me for even asking, and suggesting I check back around Computex time to see if things have improved. — Jarred Walton
Read more:Nvidia RTX 3060 (12GB) Coming in Feb for $329
Best Laptop: Lenovo ThinkPad X1 Titanium Yoga
(Image credit: Lenovo)
In the ultraportable category, CES 2021 was dominated by business laptops to go with the launch of Intel’s 11th Gen vPro mobile processors. Lenovo’s ThinkPad X1 Titanium impressed with its looks and the thoughtfulness given to its design. The 3:2 aspect ratio on the 13.5-inch, 2K display is great for all types of work, as it provides a taller screen. It also makes for a much better tablet experience than a 16:9 laptop. That display also promises Dolby Vision HDR support, while the audio will come from Dolby Atmos speakers.
At 0.45 inches thick, the Titanium Yoga is the thinnest ThinkPad ever, but still tested to military standards. While we haven’t had hands-on due to the virtual nature of CES this year, it looks like it will be a stunning and lightweight convertible 2-in-1at just 2.54 pounds. — Andrew E. Freedman
Nvidia’s new RTX 30-series mobile GPUs and new processors from both Intel and AMD meant a slew of gaming notebooks at this year’s CES. But the MSI Stealth 15M was one of very few to utilize both a new processor and GPU. This laptop is, at 0.6 inches thick, somewhere in-between full-on gaming and an ultraportable. It’s combining a 35-watt Intel Core i7-11375H CPU with an Nvidia GeForce RTX 3060 Max-Q GPU, which should be somewhat formidable for most games.
The all-aluminum stylings and black and white color options appear quite slick. Some of MSI’s other ultraportable gaming options, like GF75, will offer a 45W processor and similar GPU, but it’s also a bit bulkier. For those who want it thin, the Stealth is one of a few laptops in an area we’ll keep a close eye on. — Andrew E. Freedman
Read more: MSI Debuts Stealth 15M With Tiger Lake H35, Powerhouse GE76 Raider
Best Case: iBuyPower Revolt 3 MK3
(Image credit: iBuyPower)
Taking credit for perhaps the most improved product at this year’s CES, iBuyPower’s Revolt 3 MK3 desktop is a drastic departure from the
Revolt 2
’s RGB and glass-heavy horizontal design. Instead, what we’ve got here is a compact tower with no glass or RGB but plenty of vents on all sides.
Not only does that give it a more understated look that’s easier to fit into your typical office and plenty more space for air to enter and escape the machine, but it’s also more equipped to take advantage of the small form factor footprint that unifies the Revolt line. A handle on the top makes this case easy to pick up for transport, plus it’s got a hook on either side for holding peripherals like headsets.
The side of the case also has a swing-out door for housing a 280mm radiator, plus you can also add on an optional 80mm exhaust fan at the top. The case also comes with a 700 W SFX-L power supply pre-installed alongside pre-routed cables, which makes for one less component you’ll need to buy and should make for less cable clutter.
The key drawback here is the potential for noise. We’ll have to get our hands on it ourselves to say anything definitive, but all those holes do mean you’re probably not going to have much sound dampening.
But that’s an easy tradeoff for such a step forward in usability and looks compared to the oddly-shaped Revolt 2. Plus, you’ll be can get the Revolt 3 MK3 in white too. — Michelle Ehrhardt
Read more: iBuyPower Goes Back to Basics (In a Good Way) With Revolt 3 MK3 SFF PC and Case
Best Motherboard: EVGA Z590 Dark
(Image credit: EVGA)
Intel’s Rocket Lake-S CPUs may not quite be here yet, but motherboard makers rarely let a CES go by without a cadre of new boards to show. And over the last couple of days, we’ve seen details of nearly 50 Z590 motherboards land in our inboxes. While many are intriguing, the EVGA Z590 Dark stands out.
The design of the E-ATX board has an understated aggressiveness, with its large copper heatsinks and black…well, pretty much everything else. The board backs up its aesthetics with a crazy overbuilt 22-phase VRM and a 10-layer PCB. Most of the connectors are angled, to help in hiding cables, which is aided by a cutout in the area of the 24-pin power and USB header connectors.
The board’s primary oddity is a CPU socket that’s rotated 90 degrees. That could complicate some cooler setups, and you only get two RAM slots. But the latter is a nod to memory overclockers, who often get better results on two-slot Mini-ITX boards. No word yet on rated supported RAM speeds, but you can bet they’re going to be among the fastest on the market. And while you lose RAM slots, the board ships with an extra pair of SATA ports (8 total), so you can probably plug in every functional SATA drive you’ve got in a drawer or a box in the back of your closet. For faster storage, the EVGA Z590 Dark has three M.2 slots. And if 11 drives isn’t enough for you, you may want to consider a drive storage rack, or perhaps talking to a professional about your digital hoarding disorder. — Matt Safford
Read more:
EVGA’s New Z590 Dark Motherboard Offers The Meanest Look
Best Monitor: LG UltraFine 32EP950
(Image credit: LG)
There’s no denying the image quality boost offered by OLED, with its deliciously deep blacks. When it comes to PC monitors though, finding an OLED screen in a size that can comfortably sit atop a desk has been virtually impossible. Enter the LG UltraFine 32EP950, an OLED stunner in an eye-pleasing 31.5-inch form factor.
LG’s 4K OLED monitor targets professionals with a lot of color (a claimed 99% of DCI-P3). But enthusiasts of any kind will appreciate the bevy of ports, which includes DisplayPort, HDMI and even USB-C with 90W charging.
But what really makes this UltraFine ultra fine is that it brings us closer to being able to put the amazing contrast of OLED right in our home office without necessarily breaking the bank — or desk like you would with the more common, larger OLED TV alternatives. — Scharon Harding
Read more:LG Debuts 31.5-Inch OLED Monitor At CES 2021
Best Concept: Razer Project Hazel
(Image credit: Razer)
CES 2021 was different this year, for all the reasons our lives are different right now. But we certainly didn’t expect to see Razer, a gaming-focused company, make a concept mask that might even make the category kind of cool.
Project Hazel is not for sale — and may never be. But the ideas make sense. It’s clear to allow you to see others’ emotions, as well as for the hard of hearing to be able to read lips. There are voice amplifiers so that you aren’t muffled by the mask. The case is also a charger, and it has UV lights to disinfect the mask. The whole thing would be an N95 respirator, and oh, yeah, there are two Chroma RGB rings.
There are some questions we have, like if the mask’s ability to let in fresh air and expel CO2 would completely protect against an airborne virus like the one that causes COVID-19. But the thoughtful ideas could make for an improved mask in a world where it looks like we’ll be wearing them more often. — Andrew E. Freedman
Read more: Razer’s Project Hazel Is an RGB Face Mask for Our New Normal
Best Keyboard: Asus ROG Claymore II
(Image credit: Asus)
Tenkeyless (aka TKL) keyboards are very popular with gamers, because they save space by doing away with the numeric keypad many people only use for work. However, there are times when you really need those extra keys and Asus’ new ROG Claymore II keyboard has the answer: a numpad that slides on and snaps into its right side.
The Claymore II works in both wired and high-speed 2.4 GHz wireless modes. You can also swap out the USB-C cable with one of your own.
This keyboard also uses Asus’s own opto-mechanical keys in either Blue or Red style. This allows for less key wobble than traditional mechanical keys and lets more RGB light through. — Avram Piltch
Read more:Chop off Your Numpad with the Asus ROG Claymore II
Best Mouse: Thermaltake Argent M5 RGB Gaming Mouse
(Image credit: Thermaltake)
We didn’t see a lot of mice at this year’s CES, but that doesn’t mean that there isn’t still a clear winner. Thermaltake’s peripherals have been less than beautiful in the past, but this year’s CES saw a change in direction for the company with its new Argent line. Meaning “silver,” the idea behind Argent is to pair Thermaltake’s impressive technical features with premium build quality and silver finishes.
Take the Argent M5 RGB Gaming Mouse, our favorite mouse from this year’s show. While it does separate itself from the rest of the Argent line with a black main body, it’s still got a slick, symmetrical look that’s highlighted by RGB alongside its sides and bottom and a textured metallic silver scroll wheel on top. Achieving that symmetrical look means that the design here is ambidextrous, which can be a mixed bag for right-handed gamers, but lefties will be sure to appreciate the extra usability.
On the inside, the Argent M5 is packing DPI support from 100 to 16,000, plus a polling rate under 1ms and 64Kb of memory. The mouse’s 8 programmable buttons also use Omron switches, and the wired version’s cable is both braided and detachable.
That’s right- the Argent M5 also comes in both wired and wireless options, which gives it plenty of versatility. The wireless version of the mouse does lose RGB along its bottom and sides, likely to save battery life, but in exchange, it can connect over either Bluetooth 5.0 or 2.4GHz using a USB adapter.
All of this leaves us with a powerful, versatile Thermaltake pointer that finally looks the part. — Michelle Ehrhardt
Read more: Thermaltake’s Attractive Argent Peripherals Pair Silver and RGB Elements
Best Headset: Lenovo Legion H600
(Image credit: Lenovo)
It’s hard for a headset to stand out in an all-virtual CES. After all, we can’t test the audio quality, comfort or even durability. But what makes the Lenovo Legion H600 innovative actually has nothing to do with any of those characteristics. The standout feature is the wireless headset’s ability to charge wirelessly. But unlike other wireless charging gaming headsets we’ve seen, the Legion H600 gets its charge all while hanging attractively in its headset stand.
Sadly, you’ll need a specific headset stand to make this happen. The Legion S600 Gaming Station comes at an additional cost but also brings its own Qi wireless charger, as well as two USB Type-A passthrough ports. We’d rather the cans and headset stand/charger come bundled together. But if you’re willing to make the investment this looks like a clean, clever way to charge and store your cans, as well as other devices. — Scharon Harding
Read more:Lenovo’s Legion H600 Is a Wireless Charging Headset That May Actually Make Sense
Parallel to the Galaxy S smartphone generation 21 Samsung’s mobile division has also presented its first own notebook with 5G mobile communications in the sub-6 GHz network. The Galaxy Book Flex2 5G is a 2-in-1 device with a bright touchscreen and 360 – Degree hinges with which the display can be folded down on the underside. With the included S Pen, users can draw and write on the screen.
Inside the Galaxy Book Flex2 5G are processors from Intel 11. Core-i-Generation alias Tiger Lake-U up to the four-core Core i7 – 1165 G7. Always added 16 GByte soldered LPDDR4X- SDRAM in dual-channel operation and a PCI Express SSD with either 256 or 360 GByte capacity including pre-installed Windows 10 Home.
The 13, 3 inch QLED display represents 1920 × 1080 pixels (Full HD) and lights up to 600 cd / m² – a high value for a notebook display. The trend towards higher 16: 10 – or even 3 : Samsung does not work with 2 screens.
13 – Megapixel camera With an all-aluminum housing and a weight of almost 1.3 kg, the Galaxy belongs Book Flex2 5G in the premium class. The built-in battery has a capacity of almost 70 Wh and should be up to to hold 20 hours; it is charged via the USB-C port. Besides the typical 720 p-webcam above the display, Samsung has installed a second 13 – Megapixel camera above the keyboard. If the user folds the screen, snapshots can be taken like a tablet.
Samsung Galaxy Book Flex2 5G (10 Pictures) (Image: Samsung) Thunderbolt 4 with USB 4 are used as connections and Type-C socket, one USB type C (version number not mentioned), one HDMI (version number also not mentioned), USB 3.2 Gen 1 (5 GBit / s) type A, an audio combo jack and a micro SD card reader that can also handle UFS storage.
The Galaxy Book Flex2 5G should be shipped on 28. January 2021 begin. The cheapest version with Core i5 CPU (probably Core i5 – 1135 G7), 16 GByte RAM and 256 – GByte SSD costs 1750 Euro. For an SSD that is twice as large, Samsung calls for a proud 100 euros extra charge the Core i7 – 1165 G7 again additional 100 Euro.
(mma)
We use cookies on our website to give you the most relevant experience. By clicking “Accept”, you consent to the use of ALL the cookies.
This website uses cookies to improve your experience while you navigate through the website. Out of these, the cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. We also use third-party cookies that help us analyze and understand how you use this website. These cookies will be stored in your browser only with your consent. You also have the option to opt-out of these cookies. But opting out of some of these cookies may affect your browsing experience.
Necessary cookies are absolutely essential for the website to function properly. This category only includes cookies that ensures basic functionalities and security features of the website. These cookies do not store any personal information.
Any cookies that may not be particularly necessary for the website to function and is used specifically to collect user personal data via analytics, ads, other embedded contents are termed as non-necessary cookies. It is mandatory to procure user consent prior to running these cookies on your website.
