Michael Driscoll, the creator of a script that scrapes sold items on eBay, has shared his latest market analysis on the Ryzen 5000 (codename Vermeer) scalping situation. Given their place on the top of our best CPUs and CPU benchmarks, it’s no surprise. Although pricing has stabilized over the past month, AMD’s chips are still selling for well over their MSRP.
In a quick summary, Driscoll confirmed that scalpers have sold a grand total of 8,729 Zen 3 processors on eBay alone. To put the number into perspective, it’s equivalent to $5,880,472 in sales. The data showed that scalpers made up to $946,259 in earnings from flipping Zen 3 processors on eBay. Nonetheless, the scalpers weren’t the only party benefiting from sales as eBay and PayPal raked in a juicy profit of $625,665 as well.
In terms of sheer volume, the Ryzen 5 5600X was the easiest Zen 3 chip to move for scalpers, thanks to the hexa-core part’s lower price tag. Driscoll’s numbers revealed that scalpers sold up to 3,204 pieces of Ryzen 5 5600X with a participation of 36.7% in the total number of sold processors on eBay. If we look at lucrativeness, however, the Ryzen 9 5900X is the real belle of the ball. Despite only selling 1,962 units, the Ryzen 9 5900X helped scalpers make up to $459,256, which equals to 48.5% of the total profit.
AMD Ryzen 5000 Sales at eBay
Processor
MSRP
Total Sold
Median Price
Past Week Median Price
Casual Scalper Break Even
Sophisticated Scalper Break Even
Total Sales
Estimated Scalper Profits
Estimated eBay/PayPal Profits
Ryzen 5 5600X
$299
3204
$405
$375
$375
$304
$1,303,102
$117,760
$135,431
Ryzen 7 5800X
$449
2126
$553
$538
$558
$457
$1,203,970
$39,604
$128,891
Ryzen 9 5900X
$549
1962
$800
$785
$682
$558
$1,626,043
$459,256
$180,146
Ryzen 9 5950X
$799
1437
$1,187
$1,110
$987
$812
$1,747,357
$329,639
$181,197
Driscoll noted that the pricing for Ryzen 5000 processors has improved over the course of the previous month, but it’s far from returning to normal. Currently, the Ryzen 9 5950X and Ryzen 9 5900X are still 40% more expensive than their respective MSRPs. The Ryzen 7 5800X typically sells for 25% over its MSRP, while the Ryzen 5 5600X costs 30% more than its MSRP. In the case of the latter, Driscoll hightlighted a slight descend in its pricing trend.
Whether you consider scalpers as entrepreneurs or not, they have started to expand their horizons past eBay. Apparently, scalpers have taken their business to another venue, more specifically StockX. It certainly seems like an unorthodox marketplace to sell a processor since StockX is more widely known for stuff like sneakers, streetwear and bags. However, StockX only has a 3% selling fee, making it a lot more appealing than eBay that wants 13% of your profit.
AMD Ryzen 5000 Sales at StockX
Processor
MSRP
Total Sold
Average Sales Price
Last Week Average Price
Total Sales Volume
Estimated StockX Profits
Estimated Scalper Profits
Ryzen 9 5900X
$549
507
$758
$749
$384,306
$11,529
$83,496
Ryzen 9 5950X
$799
298
$1,098
$1,030
$325,416
$9,762
$69,452
Admittedly, the sample size at StockX is still pretty small since scalpers have only sold 805 units of Zen 3 chips so far, distributed between the Ryzen 9 5900X and Ryzen 9 5950X. The general tendency remains the same though, and it’s that the Ryzen 9 5900X continues to be the moneymaker for scalpers.
Furthermore, scalpers are reselling Ryzen 5000 processors on StockX at lower prices due to the smaller fee. For comparison, the average price for the Ryzen 9 5900X on StockX is $758, while the median price for the same processor on eBay is $800.
Lamentably, the repercussions of the Ryzen 5000 scalping mess have trickled down to AMD’s previous generations of Ryzen desktop processors. Driscoll discovered that Zen+ and Zen 2 processors have generally increased in price by approximately 33% and 25%, respectively. More explicitly, the Ryzen 3 3100 and Ryzen 3 3300X saw a rise in prices up to 45%. Consumers are potentially picking up cheap Ryzen processors as a stopgap solution until the Ryzen 5000 chips get back in stock at retailers. Zen pricing, on the other hand, remains unaffected.
AMD whipped the covers off of its Ryzen 5000 ‘Cezanne’ mobile chips at CES 2021, but today marks the official launch and AMD has unveiled the deep-dive details of the SoC that brings the Zen 3 architecture to the notebook market for the first time. The new chips will power a large range of notebooks, like the Asus ROG Flow X13 that we reviewed today, and finally bring Ryzen to the highest-end gaming notebooks to compete with Intel’s Tiger Lake chips.
On the surface, the Ryzen 5000 chips look like an iterative update to existing Ryzen 4000 Renoir processors, but there’s a surprising amount of ingenuity under the hood. AMD’s Ryzen 5000 Mobile chips bring the 7nm process paired with Zen 3’s 19% IPC increase to notebooks for the first time, largely by replacing the Zen 2 CPU cores with faster Zen 3 cores while leveraging much of the Ryzen 4000 design (like the 7nm Vega graphics cores and existing I/O accommodations) to minimize time to market.
And time is of the essence. For now, Intel will fend off the Ryzen 5000 chips with its Tiger Lake lineup that’s currently capped at four cores and eight threads with its 35W H35 series chips. Intel says its long-awaited eight-core 45W H-series chips are still in development, with headline specs including a 5.0 GHz boost on multiple CPU cores, but the company’s first eight-core 10nm processors won’t come to market until later this quarter.
Meanwhile, AMD is shipping Ryzen 5000 and has wrung out extra performance through clever modifications to its existing Ryzen 4000 SoC design, which we’ll cover below, culminating in a 23% overall improvement in single-threaded work and a 17% increase in multi-threaded performance for the 5000 series.
AMD says the improvements open up new levels of performance and set a new standard for battery life in x86 notebooks, with up to a 20-hour increase in standby life and an additional two hours during general productivity work, all while remaining the only 8-core x86 chips for ultrathin laptops.
The Ryzen 5000 Mobile series looks promising. Provided that AMD can provide sufficient quantities, they could mark yet another escalation in the increasingly-competitive notebook market. Let’s take a closer look.
AMD Ryzen 5000 Series Mobile Processors 35W – 45W+ H-Series
Cores / Threads
Base / Boost
TDP
GPU CU / Boost
Cache
Ryzen 9 5980HX
8 / 16
3.3 / 4.8
45W+
8 / 2.1 GHz
20MB
Ryzen 9 5980HS
8 / 16
3.0 / 4.8
35W
8 / 2.1 GHz
20MB
Ryzen 9 5900HX
8 / 16
3.3 / 4.6
45W+
8 / 2.1 GHz
20MB
Ryzen 9 5900HS
8 / 16
3.0 / 4.6
35W
8 / 2.1 GHz
20MB
Ryzen 9 4900H
8 / 16
3.3 / 4.3
45W
8 / 1.75 GHz
12MB
Ryzen 9 4900HS
8 / 16
3.0 / 4.3
35W
8 / 1.75 GHz
12MB
Ryzen 7 5800H
8 / 16
3.2 / 4.4
45W
8 / 2.0 GHz
20MB
Ryzen 7 4800H
8 / 16
2.9 / 4.2
45W
7 / 1.6 GHz
12MB
Ryzen 7 5800HS
8 / 16
2.8 / 4.4
35W
8 / 2.0 GHz
20MB
Ryzen 7 4800HS
8 / 16
2.9 / 4.2
35W
7 / 1.6 GHz
12MB
Ryzen 5 5600H
6 / 12
3.3 / 4.2
45W
7 / 1.8 GHz
19MB
Ryzen 5 4600H
6 / 12
3.0 / 4.0
45W
6 / 1.5 GHz
11MB
Ryzen 5 5600HS
6 / 12
3.0 / 4.2
35W
7 / 1.8 GHz
19MB
Ryzen 5 4600HS
6 / 12
3.0 / 4.0
35W
6 / 1.5 GHz
11MB
The 13 new processors span from low-power 15W chips up to two new overclockable 45W+ HX-series models designed to bring desktop PC-like gaming performance to notebooks. The Ryzen 5000 mobile processors all come with threading enabled, the 7nm Vega graphics engine with higher graphics boost clocks than the prior-gen models, support CPPC (Collaborative Power and Performance Control) technology, which we’ll dive into shortly, and have higher CPU boost clocks than the previous-gen.
As before, the H-series models are designed for notebooks that will use discrete graphics. The two 45W+ eight-core HX models carve out a new high-performance niche by bringing CPU, memory, and fabric overclocking to AMD-powered notebooks for the first time, but overclocking headroom will largely be dictated by the thermal and power characteristics of each notebook. Naturally, bulkier notebooks with more robust cooling and power delivery will unlock better overclockability.
The two H models slot in with eight- and six-core variants and a 45W TDP rating, with the former having eight CUs that boost to 2.0 GHz, while the latter has seven CUs that stretch up to 1.8 GHz.
AMD also expanded its HS series with four chips with boost clocks that reach up to 4.8 GHz within the 35W TDP envelope. AMD segments the HS stack with three eight-core models with varying base and boost clocks, but these models have lower base clocks than the H-series models to accommodate the 35W TDP envelope. AMD also has a lone six-core twelve-thread model to round out the bottom of the H-Series stack. AMD also segments the HS models with either seven or eight Vega CUs, with peak boost clocks weighing in at 2.1 GHz.
AMD Ryzen 5000 Series Mobile Processors 15W U-Series
Cores / Threads
Base / Boost
GPU CU / Boost
Cache
Ryzen 7 5800U – Zen 3
8 / 16
1.9 / 4.4
8 / 2.0 GHz
20MB
Ryzen 7 4800U
8 / 16
1.8 / 4.1
8 / 1.75 GHz
8MB
Ryzen 7 5700U – Zen 2
8 / 16
1.8 / 4.3
8 / 1.9 GHz
12MB
Ryzen 7 4700U
8 / 16
2.0 / 4.1
7 / 1.6 GHz
8MB
Ryzen 5 5600U – Zen 3
6 / 12
2.3 / 4.2
7 / 1.8 GHz
19MB
Ryzen 5 4600U
6 / 12
2.1 / 4.0
6 / 1.5 GHz
8MB
Ryzen 5 5500U – Zen 2
6 / 12
2.1 / 4.0
7 / 1.8 GHz
11MB
Ryzen 5 4500U
6 / 6
2.3 / 4.0
6 / 1.5 GHz
8MB
Ryzen 3 5400U – Zen 3
4 / 8
2.6 / 4.0
6 / 1.6 GHz
10MB
Ryzen 3 4300U
4 / 4
2.7 / 3.7
5 / 1.4 GHz
4MB
Ryzen 3 5300U – Zen 2
4 / 8
2.6 / 3.8
6 / 1.5 GHz
6MB
The 15W U-Series models slot in for thin and light devices and will often lean on the integrated graphics units. AMD recently chose to unify its Ryzen Mobile branding under the same Ryzen 5000 umbrella as its desktop chips to clear up the confusion with the Ryzen 4000 series processors that came with an older architecture than desktop Ryzen 3000 models.
However, AMD also sprinkled in three Zen 2 ‘Lucienne’ chips in the Ryzen 5000 Mobile stack, muddying the waters. AMD says this approach meets specific pricing criteria and customer (OEM) demand on the lower end of its product stack. These Zen 2-powered Ryzen 3, 5, and 7 models slot into the lowest-end 15W U-series category.
The Zen 2 variants come with the same design as their predecessors, but again, the targeted enhancements to the SoC (all of the same modifications listed below apply) and increased clock rates result in higher performance.
The Ryzen 7, 5, and 3 families also include one Zen 3 model apiece with either eight cores and 16 threads, or four cores and eight threads. Unlike the previous-gen Ryzen 4000 chips, all of the 15W models come threading enabled.
AMD Ryzen 5000 Mobile Architecture Deep Dive – Design Goals
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AMD’s performance claims for the Ryzen 5000 chips are quite impressive, with a 23% generational improvement in single-threaded performance being the highlight feature. The increased single-threaded performance over the Zen 2-powered Ryzen 4000 chips stems from the 19% IPC improvement borne of the Zen 3 microarchitecture and more fine-grained SoC-level optimizations that optimize power delivery, among other factors. AMD also claims two additional hours of battery life and a 108% advantage in multi-threaded work over Intel’s 11th-gen mobile processors.
AMD’s design goals focused on three key areas: Performance (particularly in IPC and per-core performance), latency improvements that come via the unified L3 cache and eight-core CCX, and improved power efficiency.
Zen 3 Unification
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The Ryzen 5000 Mobile chips come with all the hallmarks of the Zen 3 microarchitecture, which you can read more about here. Like the desktop chips, AMD increased the L3 cache to 16MB over the prior gen’s 8MB and unified the eight cores and cache into one contiguous cluster inside the CCX (Core Complex). In contrast, Zen 2 had two four-core clusters, each with 4MB of cache.
This new arrangement improves both core-to-cache and core-to-core latency. For highly-threaded applications, this new design imparts a 2X cache increase, and lightly-threaded workloads now have access to a full 16MB of cache, which is equivalent to a 4X increase in directly-accessible cache.
Ryzen 5000’s monolithic die, meaning it is one large die instead of the multi-die arrangements on desktop chips, allows for tighter control of power efficiency. The company also improved performance-per-watt (power efficiency) by targeting the highest-end of the frequency/voltage curve it could maintain while controlling thermal density. That’s a key consideration for thin-and-light devices with limited cooling capability. By sustaining the highest clocks possible while the chip is still in the thermal and power efficiency sweet spot, the company increased single-threaded performance beyond Zen 3’s 19% IPC uplift to a 23% improvement in per-core performance.
The Ryzen 5000 Mobile Die
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In many respects, AMD simply replaced the Zen 2 cores with Zen 3 cores, leaving the rest of the design untouched. AMD’s re-use scheme allowed the company to accelerate time to market; AMD introduced the mobile variants a mere 90 days after the desktop models, which is the fastest transition of a new architecture to mobile in the company’s history (it typically takes a year).
The company’s forward-thinking modular design eased the process: AMD planned for this eventuality when it designed the Ryzen 4000 SoC. AMD also preserved the same pinout (BGA mounting scheme) for the Ryzen 5000 processors, meaning they are backward compatible with existing designs. This also allows OEMs to use the same motherboards and componentry for both existing and future products, speeds the design of new laptops, and allows OEMs to leverage existing supply chains. However, while these design elements largely remain the same, AMD fine-tuned the various elements to extract more performance, which we’ll dive into below.
Although it doesn’t equate directly to the physical layout on the die, the topology in the second slide shows us the design’s basic outlay. Here we can see the eight threaded cores clustered around the central 16MB slice of L3 cache, two DDR4-3200 / LPDDR4x-4266 controllers, and the 7nm Vega GPU with 1MB of L2 cache and eight CUs.
The SoC also has a host of other fixed-function acceleration blocks for multimedia, the System Management Unit (SMU) for power delivery control, Fusion Controller Hub (FCH) for external sensors, audio engine, Platform Security Processor (which comes into play in the Pro models), and the usual external interfaces, like NVMe and three flavors of USB (Type-C, 3.1, 2.0).
As before, the chips have 16 lanes of PCIe 3.0 connectivity, meaning Cezanne will not have PCIe 4.0 support. AMD allocates eight lanes to the graphics, while the remaining eight lanes are split between two NVMe interfaces for storage.
The Ryzen 5000 mobile die spreads 10.7 billion 7nm TSMC transistors across 180mm2 of silicon, with the core complexes, L3 cache, and GPU in the center of the die, while the I/O componentry lines the periphery. This is slightly larger (~15%) than Renoir’s 156mm2 die and comes with 900,000 more transistors (the larger caches contribute to the higher transistor count).
Die Size
Transistor Count
Transistor Density
Ryzen 5000 Mobile Cezanne
180mm2
10.7 billion
59.44 MTr/mm2
Ryzen 4000 Mobile Renoir
156mm2
9.8 billion
62.82 MTr/mm2
Ryzen 5000 Mobile Memory Controller Enhancements
(Image credit: AMD)
AMD’s engineers turned their eye to optimizing the memory PHY to reduce the overall SoC power draw. With Ryzen 4000, the PHY remained fully ‘on’ if the SoC wasn’t in a standby power state, consuming a significant amount of power draw. Ryzen 5000 introduces a deep power state that the SMU engages when the PHY is in a lower-activity state (but not idle). This shifts the digital portion of the PHY into a lower power state, bypassing it to reduce supply voltage. This technique engages a new low-dropout (LDO) power regulator and turns off the primary on-chip voltage regulator for the memory PHY during low usage. This approach reduces power consumption from the PHY and the power delivery network as well.
Of course, minimizing latency when the controller shifts back to its full-performance state is paramount. AMD leverages the data fabric’s hardware-assisted fast entry/exit mechanisms to shift into different power states, thus lowering latency.
Each memory controller supports a single 64b memory channel or dual 32b virtual channels. Each controller supports DDR4-3200 in single-channel (1DPC SR/DR) or two channels of LPDDR4x-4266.
Quad-channel LPDDR4x provides 33% more theoretical bandwidth than DDR4-3200 and has twice the density of standard DDR4, thus improving maximum capacity to 32GB of memory with a two-channel die.
Vega Rides Again
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As before, the Vega graphics unit comes with a maximum of 8 compute units (CU) and 1MB of L2 cache, but AMD increased the peak frequency by 20% (up to 2.1 GHz).
AMD fine-tuned the power management mechanisms, like the on-chip voltage regulator, to improve sustained performance. AMD also reduced Vmin (the minimum voltage required for operation) to improve power efficiency (performance-per-watt). These improvements enable higher-frequency operation in tandem with improved frequency-per-watt throughout the entire voltage/frequency range. That frees up additional power that’s used to sustain higher frequencies in either the CPU or GPU.
AMD’s new intelligent graphics Dynamic Energy Management (DEM) functionality steps in to detect which workloads are impacted heavily by graphics frequency, allowing the GPU to operate at lower frequencies when increasing the frequency wouldn’t result in tangible performance gains (for example, when the workload is primarily memory bound).
Ryzen 5000 uses the latest revision of the 7nm process, which has less leakage. It also marks the debut of per-core CPU voltage regulation to the Ryzen Mobile lineup, which reduces overall power consumption during gaming workloads. The saved power savings from these two factors can be directed to the GPU to boost gaming performance.
AMD also optimized its graphics drivers for enhanced memory management and tweaked anti-aliasing and other functions, with peak performance weighing in at 2.15 TFLOPS (FP32) and 4.30 TFLOPS (FP16). AMD used benchmark results from Timespy, a CPU intensive workload, to quantify the performance improvement, noting a 171% increase over the first-gen Ryzen processors. Notably, the Ryzen 5000 Vega iGPU is 15% faster than Ryzen 4000.
AMD carries all the security features present in the 4000 series to the 5000 series, with the addition of Control-flow Enforcement Technology (CET) that eliminates control flow attacks that hijack legitimate applications to run malicious code. As before, the chips also have other security features that serve as the bedrock of the Pro Security suite for Ryzen Pro processors.
Ryzen 5000 Mobile, Boosting Boosts
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AMD’s addition of its Collaborative Power Performance and Control (CPPC) interface was truly a watershed breakthrough for its Ryzen 3000 desktop chips. This tech tells the operating system which cores are the fastest, and the Windows scheduler then targets lightly-threaded workloads at those cores. This allows AMD to bin its chips into higher speed grades based on the fastest available cores on the chip, instead of the older technique of binning the chip based on the lowest common denominator (slowest core).
This technique discards the old paradigm of only having three power states, which provides more granular power control to improve both power efficiency (battery life) and performance. The CPPC interface also allows the operating system to dictate power state transitions on a per-core basis via a broader range of voltage and frequency settings. Now the processor can assign any voltage or frequency within its operating range on the fly. Additionally, this technique reduces transition latency from ~30ms when it is controlled by firmware down to 1-2 ms, which improves performance in bursty workloads and saves power.
AMD also added per-core power and frequency management to provide another layer of granularity. In the past, the CPU cores were tied to the same voltage plane as the GPU, resulting in a 1:1 relationship between CPU vCore and GPU Vgfx, regardless of load on either unit.
The illustration on the right of the second slide illustrates the impact – Ryzen 4000’s cores all ran at the same voltage regardless of voltage, matching that of the graphics unit, while Ryzen 5000 adjusts on a per-core basis regardless of GPU voltage.
During multi-threaded heterogeneous workloads, the chip can match frequency and voltage on all the cores running that specific workload, thus ensuring consistent operation. AMD’s on-chip power regulation also supports software quality of service (QoS) hooks that allow the operating system to more effectively identify higher- and lower-priority workloads, which then is used to dictate voltage and frequency of the affected cores to maximize power efficiency.
As you can see in the last slide, AMD says that the culmination of these technologies delivers significant reductions in SoC power draw, with a head-to-head comparison between the Ryzen 7 5800U and 4800U showing impressive reductions in a few different scenarios. That includes a 26% reduction in standby mode, an impressive 47% reduction at idle, a 33% reduction in video playback, and an 18% reduction when the chip is under load in the MobileMark 2018 benchmark.
Ryzen 5000 Mobile Battery Life
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AMD also made a host of other refinements at the system level to help reduce power draw, including working with audio codec vendors to increase the occurrence and duration of low-power/idle residency states for the audio codec. Likewise, AMD worked with hardware vendors for certain components, like DC-to-DC regulators and embedded controllers, to enable support for new ‘hints’ that trigger lower-power states.
AMD says it has increased standby state time by 20 hours, idle battery life by 3.9 hours, video playback by 1.1 hours, and MobileMark by 2 hours. The company also claims that the Ryzen 9 5900HX is 19% faster in single-threaded workloads than Intel’s flagship 10980HK.
AMD Ryzen 5000 Mobile Performance Benchmarks
AMD provided a host of performance benchmarks in three key areas: Mobile gaming, content creation, and ultrathin performance. As with all vendor-provided benchmarks, you should take these results with a grain of salt. We’re sharing the full slide deck for each category, but without commentary – take the results as you will. We also include the endnotes that contain the test configurations.
Today marks the launch of the chips, so there should be plenty of third-party reviews for another take on performance, like our Asus ROG Flow X13 review.
AMD Ryzen 5000 Mobile Cezanne Gaming Benchmarks
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AMD Ryzen 5000 Mobile Content Creation Benchmarks
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AMD Ryzen 5000 Mobile Ultrathin Benchmarks
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Thoughts
Ryzen 5000 Mobile brings a new level of competition to the laptop market through a more refined 7nm process, the Zen 3 architecture, and good old fashioned engineering. Some will see AMD’s decision to re-use key parts of the design, like the Vega graphics unit and PCIe 3.0 controllers, as a liability. Still, AMD managed to wring out enough extra performance and longer battery life to offset most of the downsides.
AMD’s re-use tactic allowed it to speed the chips to market and also simplify the design process for its OEM partners. That’s important in the face of a much larger and entrenched competitor like Intel. AMD’s deeper levels of engagement with ecosystem partners are emerging as it gains more market share and thus has access to more resources. And this is a virtuous cycle: AMD has made the types of adjustments and collaborations that OEMs appreciate, which should further deepen its partnerships.
AMD’s Ryzen 4000 series mobile processors have already taken the notebook market by storm, granting the company its biggest slice of the mobile market in history, and the Ryzen 5000 Mobile chips look to continue that momentum. AMD pulled off this feat in record time — the Raven Ridge chips didn’t come to the mobile market for a year after debuting on the desktop, while the Zen 3 transition should take roughly four months.
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Speaking of Raven Ridge, those chips came to market in 75 designs, while the next-gen Ryzen 4000 chips landed in 100 devices. AMD expects Ryzen 5000 to power over 150 notebooks by the end of the year, many with the highest-end graphics cards, a distinction that has long eluded the company. As you can see above, the chips will debut in a wide range of devices from leading OEMs.
For now, supply could be AMD’s biggest obstacle. Record demand, coupled with the trade war and conditions associated with the pandemic, has strangled the supply of chips for almost every segment, spanning from automobiles to the CPUs and GPUs craved by enthusiasts, which has lead to price gouging. Hopefully AMD can ensure enough supply to keep OEM pricing within reasonable bounds.
AMD’s partners do have Ryzen 5000 Mobile laptops on the market, but we’ll have to wait and see how long term supply pans out. Given what we’ve seen from the first reviews, it looks like AMD will have plenty of demand for its latest chips.
The first alleged independent benchmark results of AMD’s recently introduced eight-core Ryzen 9 5980HS “Cezanne” laptop processors have been published. AMD’s Zen 3-based chip uses integrated Radeon graphics, and, according to the new numbers, beats its predecessor and Intel 10th Gen Comet Lake in single- and multi-core workloads, as well as 11th Gen intel Tiger Lake in single-core. However, there is a processor that still beats AMD’s Cezanne.
Hardware enthusiast @Tum_Apisak found two Geekbench 5 results from the Asus ROG Flow X13. The gaming notebook runs the eight-core Ryzen 9 5980HS at a 3.30 GHz default clock speed and can boost it all the way to a 4.53 GHz. In one case, AMD’s Cezanne APU hit a 1,532 single-core score and 8,219 multi-core score. In another case, the processor finished with 1,541 single-core points and 8,224 multi-core points.
CPU
Single-Core
Multi-Core
Cores/Threads, uArch
Cache
Clocks
TDP
Link
AMD Ryzen 9 5980HS
1540
8,225
8C/16T, Zen 3
16MB
3.30 ~ 4.53 GHz
35W
https://browser.geekbench.com/v5/cpu/6027200
AMD Ryzen 9 4900H
1230
7,125
8C/16T, Zen 2
8MB
3.30 ~ 4.44 GHz
35~54W
https://browser.geekbench.com/v5/cpu/6028856
Intel Core i9-10885H
1335
7,900
8C/16T, Skylake
16MB
2.40 ~ 5.08 GHz
45W
https://browser.geekbench.com/v5/cpu/6006773
Intel Core i7-1185G7
1550
5,600
4C/8T, Willow Cove
12MB
3.0 ~ 4.80 GHz
28W
https://browser.geekbench.com/v5/cpu/5644005
Apple M1
1710
7,660
4C Firestorm + 4C Icestorm
12MB + 4MB
3.20 GHz
20~24W
https://browser.geekbench.com/v5/cpu/6038094
Typically, Cezanne looks very good compared to previous-generation AMD and Intel architectures. The most interesting comparison we can make with a Zen 3 APU is with an Intel Willow Cove processor. Since Intel hasn’t launched its eight-core Tiger Lake-H chips yet, quad-core Core i7 1100-series “Tiger Lake-U” processors are the only available CPUs featuring the Willow Cove microarchitecture. These CPUs are not quite meant for gaming machines and, therefore, come inside notebooks with less sophisticated cooling.
Generally, Intel Core i7-1185G7-based machines score 1,350-1450 single-core points on Geekbench 5. A well-cooled example can hit around 1,550 on a single core and about 5,600 on multi-cores.
Therefore, it looks like mobile CPUs featuring AMD’s Zen 3 and Intel’s Willow Cove cores have comparable single-core performance (assuming that both are cooled properly). Naturally, AMD’s eight-core gaming APU naturally beats Intel’s quad-core CPU in workloads leveraging multiple cores.
As far as Geekbench 5 results go, AMD’s Ryzen 9 5980HS looks like a very potent mobile APU with a 35W TDP. Yet, it’s not unbeatable.
Apple’s tiny M1 system-on-chip (SoC) running at 3.20 GHz scored 11% better than the Ryzen 9 5980HS in single-core workloads and 7% worse in multi-core workloads while consuming about 30% less power, assuming that its TDP is up to 24W.
AMD’s eight-core Ryzen 9 4900H “Renoir” APUs, based on the Zen 2 microarchitecture, scores about 1,230 single-core points and around 7,100 multi-core points when running at 3.30 / 4.44 GHz clocks in Geekbench 5. Therefore, the new Cezanne APU is apparently 25% faster than its Renoir predecessor in single-core tasks and about 15% faster in multi-core workloads.
Cezanne’s noticeably higher performance compared to its predecessor can be explained by microarchitectural improvements, as well as a two times larger L2 cache. The Ryzen 94900H is rated for up to a 54W TDP, whereas the new one has a default TDP of 35W.
A comparison of the new numbers for the Ryzen 9 5980HS to Intel’s eight-core Core i9-10885H, Intel’s fastest mobile Comet Lake CPU with a locked multiplier, suggests the Ryzen 9 5980HS is 15% faster in single-core workloads and 4% faster in multi-core tasks.
It should be noted that the Ryzen 9 5980HS numbers haven’t been confirmed, so you should take them with a grain of salt.
Hardware detective APISAK spotted Intel’s Rocket Lake Core i9-11900K running full blast at 5.3Ghz (single-core) in Geekbench 5 and PassMark. Surprisingly, the chip manages to beat all of AMD’s Zen 3 parts in the single-threaded tests. This somewhat verifies what we saw at CES 2021 where Intel showed its 11900K beating a Ryzen 9 5900X by roughly 5% in pure single-threaded workloads, portending a shakeup to our CPU Benchmark Hierarchy.
PassMark Single-Threaded Scores:
Core i9-11900K – 3764
Core i7-11700K – 3548
Ryzen 7 5800X – 3511
Ryzen 9 5900X – 3500
Ryzen 9 5950X – 3493
Ryzen 5 5600X – 3386
Core i9-10900K – 3173
Core i7-10700K – 3083
The i9-11900K scored 3764 points in Passmark, with the closest rival, the i7-11700K, landing at 3548 points. Meanwhile, the Ryzen 7 5800X weighs in with 3511 points. (Strangely, the higher-clocked Ryzen 9 5900X and 5950X scored lower than the 5800X.)
If we compare the best of Team Blue to Team Red, the 11900K is 6% faster than the 5800X — and even less if we compare it to the 11700K.
GeekBench 5 Scores:
Single Threaded Scores:
Core i9-11900K – 1892
Ryzen 9 5950X – 1682
Ryzen 7 5800X – 1669
Ryzen 9 5900X – 1664
Multi-Threaded Scores:
Ryzen 9 5950X – 16726
Ryzen 9 5900X – 14061
Core i9-11900K – 10934
Ryzen 7 5800X – 10427
Moving over to the Geekbench 5 results, the 11900K maintains its single-threaded performance lead, beating the 5950X by 12% (which in Geekbench is on top of the single-threaded chart for AMD).
But, of course, Rocket Lake’s higher frequency and backported cores won’t give the 11900K an advantage in the multi-core race, where the 5900X and 5950X easily beat Intel’s best. But if we compare just the eight-core models, the 11900K does come out
4% faster than the 5800X.
Conclusion:
If any of these benchmarks are representative of the Core i9-11900K’s real-world performance (spoiler alert, these benchmarks generally are not), then Intel will have beaten AMD in the single-threaded race and re-claimed that crown once again. But when it comes to multi-threaded performance, the Core i9-11900K really gets hit hard from being downgraded to eight cores.
We’ll have to see how this all plays out once Rocket Lake fully releases and we get our hands on these chips ourselves to benchmark. If the story for Rocket Lake is similar to the story here, Intel will have to price the 11900K aggressively to keep it competitive against AMD’s Ryzen 9 parts.
AMD recently introduced one of its new top models of the mobile Ryzen series, the Ryzen 9 5900 HX before. The first benchmark results are now available. And they can all be seen, both in single-core use and when using all cores, the Ryzen 9 lands 5900 HX ahead of the Intel competition and takes first place in the ranking. The APU has a total of 8 cores and 12 Threads at clock frequencies of up to 4.6 GHz and is manufactured in the 7 nm process based on the Zen 3 architecture. AMD gives the TDP with 45 Watts, but allows the processor to be overclocked in order to get even more performance.
In the PassMark entry, an Asus notebook with 32 GB of RAM and one NVIDIA GeForce RTX 3080. Overall, the Ryzen 9 4919 HX achieves a multi-core score of 24. 039 points and thus exceeds the formerly number one Ryzen 9 4900 HS by impressive 21%. The Intel Core i9 – 10980 is even increased by 44% exceeded.
The single core rating is 3. 365 Points, that’s enough for the top position on the list. The now in second place Intel Core i7 – 1165 G7 is given a Surcharge of 12% beaten. In the single-core area, the new AMD Ryzen 9 5900 HX is currently the only APU in the top 10 that does not come from competitor Intel. It remains to be seen to what extent the Ryzen 9 5900 HX will be able to hold its position, as the Ryzen 9 5980 HX and the Intel Core i7 – 11375 H strong competition will arise in the next few weeks and months.
News that AMD is bringing an unlocked processor to notebooks surfaced last year, starting with the the-topping 5900HX based on the new Zen 3 architecture. Now, it appears the chip is topping Passmark’s laptop CPU charts, and the results are promising.
Of course, Zen 3 needs no explanation — it’s already available on desktops with retail availability slowly improving, but it’s not come to notebooks yet. Of course, that will still take a while, and in the meantime, AMD’s Zen 2 based 4000 series mobile CPUs have topped the charts. Until today.
Spotted by VideoCardz, the 5900HX now tops the Passmark top 10 Common Laptop CPUs list, jotting down an impressive multi-core score of 24,039. This is significantly higher than the previous chart-topper, the Ryzen 7 4800H, which has a score of 19,176 points — that difference absolutely accounts for AMD’s promises of a 19% IPC uplift.
Image 1 of 2
(Image credit: Passmark)
Image 2 of 2
(Image credit: Passmark)
Compared to Intel’s top 45W chip, the 5900HX offers significantly higher performance, too. The blue team’s closest competition is the Core i9-10980HK at the same TDP, but that chip ‘only’ scores 16,594 points — which is a bit concerning considering it packs the same number of cores and threads and operates at the same TDP.
AMD’s ‘Cezanne’ 5900HX is the company’s most powerful upcoming laptop CPU, featuring 8 cores, 16 threads, and an unlocked multiplier for mobile overclocking. The chip was previously also spotted besting even Intel’s desktop-class i7-10700K, which is no accomplishment to scoff at. The chips’ base clock sits at 3.3 GHz, with single-core boost clocks up to 4.6 GHz, and it packs a 45W TDP.
It’s not clear exactly when AMD’s Ryzen 9 5900HX will come to laptops, but we expect sightings to be rare and expensive when they do. AMD is currently suffering from manufacturing shortages through TSMC, and that situation isn’t expected to improve anytime soon.
We already expected something like this after the presentation of the new line of processors for AMD laptops, the Ryzen 4800 H. The AMD Ryzen 9 5900 HX is one of the most powerful models in the new range based on the Zen 3 architecture, and Now, according to the data leaked in the PassMark benchmark, it becomes the most powerful notebook processor in the world.
The Ryzen 9 5800 HX placed first in the Passmark ranking with 24. 039 points
Does it after getting a score of 21. 039 points, significantly higher than that of the AMD Ryzen 9 4800 H with his 19, 176 points and away from Intel solutions, where a Core i9 – 10980 HK stayed at 16594 points.
The Ryzen 9 5900 HX is one of the most powerful models, but on top it has the Ryzen 9 5980 HX which maintains all 8 cores and 16 threads along with Boost speeds of up to 4.8 GHz, and even the bass variant consumption 5980 HS should show a similar or even higher performance, since it has a somewhat lower base speed but the Boost is also higher.
AMD RYZEN 5000 H Series
PROCESSOR
ARCHITECTURE
CORES / WIRE
GHZ BASE
GHZ BOOST
CACHE
TDP
AMD Ryzen 9 5980 HX
Zen 3
8 / 16
3.3 GHz
4.8 GHz
21 MB
45 W +
AMD Ryzen 9 5980 HS
Zen 3
8 / 16
3.0 GHz
4.8 GHz
20 MB
35 W
AMD Ryzen 9 5900 HX
Zen 3
8 / 19
3.3 GHz
4.6 GHz
20 MB
45 W +
AMD Ryzen 9 5900 HS
Zen 3
8 / 16
3.0 GHz
4.6 GHz
20 MB
039 W
AMD Ryzen 7 5600 H
Zen 3
8 / 16
3.2 GHz
4.4 GHz
21 MB
45 W
AMD Ryzen 7 5800 HS
Zen 3
8 / 16
2.8 GHz
4.4 GHz
20 MB
35 W
AMD Ryzen 5 5600 H
Zen 3
6 /
3.3 GHz
4.2 GHz
19 MB
45 W
AMD Ryzen 5 5600 HS
Zen 3
6 / 12
3.0 GHz
4.2 GHz
19 MB
35 W
End of Article. Tell us something in the Comments or come to our Forum!
Antonio Delgado
Computer Engineer by training, writer and hardware analyst at Geeknetic since 2011. I love gutting everything that comes my way, especially the latest hardware that we get here for reviews. In my spare time I fiddle with 3d printers, drones and other gadgets. For anything here you have me.
Recently introduced AMD Ryzen mobile processors 5000, belonging to the fourth generation Cezanne APU. In our editorial office, we have already started testing one of the flagship Cezanne-H units and we are very curious how it will finally present a new system based on Zen 3 architecture. Meanwhile, AMD is preparing another premiere, which will be Cezanne desktop APU processors, belonging to the Ryzen series 5000 G. We still don’t know much about the processors themselves, as their debut is expected in the summer. The flagship model is to be 8-core and 16 – threaded AMD Ryzen 7 5800 G, which, according to the current information, is to be more efficient than the AMD Ryzen 7 5800 X unit. The GPU-Z database, in turn, provides some new information about the APU.
According to the information provided by the GPU-Z software, the AMD Ryzen 7 processor 5800 G will have 16 PCIe 3.0 line for the graphics card and integrated Radeon Graphics (Vega 8).
AMD Ryzen 9 5900 HX – New APU from Reds, the most efficient mobile chip in the PassMark test
AMD Ryzen 7 5800 The G is the most efficient representative of the new generation APU Cezanne. Contrary to last year’s models, this time the processors are based on the Zen 3 architecture. Nevertheless, we will still be “stuck” to the Vega graphics chips. This is confirmed by the entry from the GPU-Z software, which states the use of iGPU Radeon Vega 8 in the Ryzen 7 system 5800 G. This is the same Vega 8 that was already available in APU Renoir. Although the program reports the clock speed at 1800 MHz, we are sure that it will eventually be a higher frequency. Vega 8 in the top APU Cezanne-H reaches 2100 MHz, so for the desktop version with a higher TDP (65 W), we expect an even higher clock.
AMD Ryzen 5000 – premiere of Cezanne processors for laptops. Zen 3 architecture enters top notebooks
The processor still has a DDR4 memory controller clocked at 3200 MHz. The test platform on which the processor was installed had DDR4 memory 3600 MHz, which at 128 – the iGPU bit memory bus gives a bandwidth of 57, 6 GB / s. The new Cezanne APU, as in the mobile version, uses the PCIe 3.0 interface to connect to the graphics card. Unlike the Cezanne-H, however, the desktop APU has 16 PCIe 3.0 lanes for the GPU. For comparison, Ryzen series mobile processors 5000 only have 8 PCIe 3.0 lanes for dGPU.
Just a few days ago, during the CES conference 2021, AMD has officially unveiled the fourth generation of APUs from the Cezzane family. It is a family based on the new Zen 3 architecture, which boasts, among other things, doubled the amount of L3 cache and reduced latency. The new AMD Cezanne-H processors are to hit machines from different price and performance shelves, also to top gaming laptops. We have already learned the performance of one of the leading models in the form of AMD Ryzen 9 5900 HX. To the delight of fans of the “red power side”, the new chip takes the top place in the multithreading test in PassMark, beating Intel processors.
AMD Ryzen 9 5900 HX scores 7 in the PassMark multithreading test 445 points more than last year’s Intel Core i9 10980 HK.
AMD Ryzen 5000 – premiere of Cezanne processors for laptops Zen 3 architecture enters the top notebook
AMD Ryzen 9 5900 HX is 8- core and 16 – threaded, unlocked processor with TDP 45 W + which works with clocks from 3.3 to 4.7 GHz. This is the second the best chip from the AMD Cezanne family, and only AMD Ryzen 9 5980 HX with 100 MHz with higher boost clock. The system went to the ASUS ROG Strix SCAR laptop 17 G 733 (32 GB of RAM + GeForce R TX 3080), and this one was tested in PassMark in the multi-threaded performance test. Currently from 24 039 he takes first place with points. For comparison, the top chip from the competition, Intel Core i9 10980 HK, has only in the same test) 594 points.
New test procedure for gaming laptops with Intel Tiger Lake-H, AMD Cezanne-H and NVIDIA GeForce RTX 3000
For the sake of fairness, however, it must be emphasized that the CPU from the Blue was tested at 2.4 GHz. So let’s take a look at the performance against the previous generation mobile chips from AMD. Here AMD Ryzen 9 5900 HX drops by 21% better than AMD Ryzen 9 4900 HS (19 854 points) and 25% better than AMD Ryzen 7 4800 H (19 180 points). The question is, what will the performance of the upcoming Intel Tiger Lake mobile chipsets, which are expected to be released in the second half of the year 2021, look like?
In the video, we show you different ways to overclock AMD’s new 6-core Ryzen 5 5600 X processor based on Zen 3 architecture for better performance
Commercial cooperation with Asus
The video teaches you the basics of overclocking AMD’s 6-core Ryzen 5 5600 X processor. The same basic stories apply to all of the Ryzen 5000 series and the 5000 series and older Ryzen processors. With a larger number of cores, heat may be encountered earlier.
The video goes through different methods to improve performance:
02: 46 Tests as standard
07: 21 Precision Boost Overdrive (PBO)
) 07:
Auto Overclocking + 200 MHz
09: 50 Manual overclocking (4.7 GHz)
12: 50 PBO + Max CPU Boost Clock Override + 400 MHz
13: 46 Curve Optimiz er (undervoltage)
16: 21 Tightening the memory settings (DRAM Calculator)
An example is the Asus ROG Strix B 550 – F Gaming (Wi-Fi) motherboard, but the instructions apply to motherboards from all manufacturers. BIOS menus look different and some features may have different names.
Asus, ROG Strix B 550 – F Gaming (Wi-Fi) Motherboard Product Page
.fi, Search: Asus ROG Strix B 840 – F Gaming (Wi-Fi)
If you liked the video, subscribe to io-Tech’s YouTube channel for free, thanks!
Zen 3 for laptops AMD has new laptop processors featuring Zen 3 architecture were unveiled at the CES trade show. In addition to the U models for thin notebooks, the company has also unveiled the new HX sku for gaming laptops. The new video cards for both laptops and the desktop were also discussed. In addition, there is a hint to the new generation of Epyc server chips.
De Ryzen 7 5800 U is the top model of the economical U-series. With 8 cores and 16 threads will be the title of the only x 86 – octacore claimed in the ‘ultrathin’ class . According to AMD CEO Lisa Su, the new apu performs 7 to 44% better than Intel Core i7 – 1185 G7, depending on the workload. In addition to better performance, the U-line must also ensure a longer battery life. Up to 21 hours claimed when playing video.
In addition, two HX processors have been unveiled, the Ryzen 9 5900 HX and 5980 HX. They feature 8 cores and 16 threads, and a total of 20 MB of L2 and L3 cache. The difference is in the clock speed. The 5900 HX boost up to 4.6 GHz , the 5980 HX achieves a maximum frequency of 4 , 8 GHz. Both SKUs have a tdp of ‘ according to AMD W + ‘, as it is possible to overclock them.
During the presentation the 5900 HX is compared to the Core i9 – 10980 HK, the best Intel has to offer in the field of mobile gaming processors. The Ryzen chip performs better in all areas. For example, he scores 15% higher in Cinebench R’s single-threaded test 20, the 5900 HX performs 19% better than its Intel counterpart in 3DMark Fire Strike Physics.
The first laptops with Ryzen 5000 – CPUs must already will be available from February. AMD expects such a 250 different models are coming. At the 4000- and 3000 – ranges this was respectively 150 and 70.
After the end of the presentation, AMD will full lineup of laptop processors posted on its website. It can again be deduced that the 5000 – series consists of both Zen 2 and Zen 3 chips, confirming previous rumors.
Processor Cores / Threads Base Clock Boost Clock Cache TDP Architecture AMD Ryzen 9 5980 HX 8C / 17 T 3.3 GHz 4.8 GHz 20 MB 45 + W Zen 3 AMD Ryzen 9 5980 HS 8C / 16 T 3.0 GHz 4.8 GHz 20 MB 35 W Zen 3 AMD Ryzen 9 5900 HX 8C / 16 T 3.3 GHz 4.6 GHz 20 MB 45 + W Zen 3 AMD Ryzen 9 5900 HS 8C / 17 T 3.0 GHz 4.6 GHz 21 MB 35 W Zen 3 AMD Ryzen 7 5800 H 8C / 16 T 3.2 GHz 4.4 GHz 20 MB 45 W Zen 3 AMD Ryzen 7 5800 HS 8C / 16 T 2.8 GHz 4.4 GHz 20 MB 35 W Zen 3 AMD Ryzen 5 5600 H 6C / 12 T 3.3 GHz 4.2 GHz 19 MB 45 W Zen 3 AMD Ryzen 5 5600 HS 6C / 12 T 3.0 GHz 4.2 GHz 19 MB 35 W Zen 3 AMD Ryzen 7 5900 U 8C / 16 T 1.9 GHz 4.4 GHz 20 MB 15 W Zen 3 AMD Ryzen 7 5700YOU 8C / 16 T 1.8 GHz 4.3 GHz 12 MB 15 W Zen 2 AMD Ryzen 5 5600YOU 6C / 12 T 2.3 GHz 4.2 GHz 19 MB 15 W Zen 3 AMD Ryzen 5 5500YOU 6 C / 13 T 2.1G Hz 4.0 GHz 11 MB 16 W Zen 2 AMD Ryzen 3 5300 You 4C / 8T 2.6 GHz 3.8 GHz 6MB 15 W Zen 2
This week, too, numerous exciting articles went online at Hardwareluxx.de. We not only subjected the MSI MPG Sekira 30 R to a detailed practical test , but also the ZOTAC Gaming GeForce RTX 3070 AMP Holo, the AVerMedia GC 311 Live Gamer Mini, the HP P 700 or the WD_Black SN 850 in the RAID extensively tested. The highlight of the week was of course the presentation of the mobile GeForce RTX – 30 – graphics cards and Ryzen – 5000 – processors. Also on the test program were the SpotCam Eva 2 and the Corsair 5000 D Airflow.
At this point we have summarized all articles from the last week and provided them with a small extract. With this in mind: Have fun reading!
Friday, 08. January 2021: MSI MPG Sekira 100 R in the test: A-RGB-Schick at a tempting price
The MPG Sekira 100 R is one of the most attractive gaming cases from MSI. The E-ATX model is presented with glass and aluminum and illuminates both a strip in the front and four fans with A-RGB LEDs. Nevertheless, the price is pleasantly moderate at around 120 euros …
Friday, 08. January 2021: The smallest of the bunch: AVerMedias GC 311 Live Gamer MINI Streaming Capture Box in the test
If you believe the manufacturer AVerMedia, the GC 311 Live gamer MINI game streaming capture box fast and easy streaming -Calculate the Olympics. In addition to an HDMI input and passthrough for full HD gameplay, said box should transmit the image without latency and also have PC and Mac connectivity. After we already got the Live Gamer EXTREME 2 GC 551 and the streaming capture box Live Gamer Ultra GC 553 from AVerMedia, we are now also taking a look the cheapest model of the trio …
Sunday, 10. January 2021: HP P 700 in the test: Two-part external SSD with integrated connection cable
For the HP P 700 SSD with a capacity of 1 TB, it is a two-part external SSD, which with its unusual concept approaches the topic of external SSD a little differently than usual. In addition to a clever way of storing the cable and a connection adapter, you also get a wealth of technical data on the SSD. Whether the HP P 553 their 1. MB / s maximum transfer rate and at which points the two-part concept can be improved again, you can find out from us in the article …
Monday, 11. January 2021: ZOTAC Gaming GeForce RTX 3070 AMP Holo in the test: More RGB and cooling
The ZOTAC Gaming GeForce RTX 3070 AMP Holo is the top model among the GeForce RTX – 3070 – graphics cards from ZOTAC and makes with an extra large cooling system, a chic RGB lighting and of course one strong, factory overclocking. How the 700 Euro expensive top model performs in practice, you can find out in this Hardwareluxx article on the following pages …
Tuesday, 12. January 2021: Ampere goes into the notebook: NVIDIA unveils new GeForce RTX -GPUs
Already in the run-up to CES and also before today’s keynote from NVIDIA It was clear: There will be a new batch of GPUs for notebooks and the Ampere architecture will be transferred to the mobile segment. So far the manufacturers were only allowed to speak of “the next GeForce generation” or something similar …
Tuesday, 12. January 2021: Record hunt with the WD_Black SN 850 in RAID: To the limits of PCIe4
At Hardwareluxx we like to keep an eye out for unusual and particularly powerful hardware that goes to the limits of current standards – or beyond. The Western Digital WD_Black SN 850 was able to convince us in the individual test, after all, the limit was PCIe4 x4 tangible. So what could be faster than an SN 850? Right: four …
Tuesday, 12. January 2021: SpotCam Eva 2 in the test: For a look from the Cloud
Even if nationwide there was recently a historic low in burglaries there were, the reasons for video surveillance of your own four walls are quite diverse. But not every system with IP cameras makes sense for home use. The administrative effort often exceeds the benefits of such an installation. SpotCam tries to remedy this with the Eva 2 by using easy integration and cloud connection. How well this works, we clarify with our test …
Tuesday, 12. January 2021: Ryzen Mobile 5000: AMD pushes Zen 3 to more than 45 W
After AMD launched its first Zen 3 processors in the desktop in September, the move into the notebook follows today. As expected, AMD announced its mobile Ryzen processors of the 5000 generation in the evening. Many details about the individual models were not revealed, but were optimistic about the future of the notebook market …
Thursday, 14. January 2021: Corsair 5000 D Airflow and iCUE 5000 X RGB in double test: Optionally Airflow or A-RGB-Show
The newly introduced Corsair 5000 As a generous midi tower, D is intended to appeal primarily to users for whom the 4000 D is not big enough. Again there are three completely different variants. In a double test we find out where the strengths and weaknesses of the airy 5000 D Airflow and the colorfully illuminated iCUE 5000 X RGB lie …
Friday, 15. January 2015: HP S 700 Pros in the test: A lot of pros, but also cons
An SSD that appears with the addition “Pro” in its name always makes you sit up and take notice. In the case of the HP SSD S 700 Pro, the IT giant can come up with solid key data, the at least underpin a certain expectation. A proven memory controller, sufficient DRAM and TLC-NAND underline the pro approach. As always, we will clarify whether this can be found in everyday life or whether there is also a contra to be discovered with our test course …
AMD’s Threadripper Pro models offer multiple entry points to eight-channel memory and 128 lanes of PCIe 4.0 support, setting a new bar for professional-class performance in the process.
For
Excellent rendering performance
Competitive performance in GPU-accelerated applications
Eight-Channel memory interface
128 Lanes of PCIe 4.0
Fully-validated ECC memory support
Against
Pricing isn’t available yet
Some workloads don’t benefit from 128 threads
AMD’s Threadripper 3000 processors are best known for wreaking complete devastation on Intel’s HEDT lineup, easily outclassing the incumbent Cascade Lake-X processors in key areas, and upsetting our CPU Benchmark Hierarchy and Best CPUs for Workstations rankings in one fell swoop. While we certainly weren’t accustomed to seeing Intel so utterly trounced in a segment it has traditionally ruled with pricing impunity, the Threadripper 3000 processors did fall short in one area – they didn’t enable all eight memory channels or the full complement of PCIe lanes. AMD’s Threadripper Pro fixes that, and the chips are coming to retail outlets soon.
The ludicrously-appointed 64-core 128-thread 3995WX serves as the head of AMD’s new four-pronged Threadripper Pro lineup, which extends down to 12-core models. At launch, all of the chips were exclusive to Lenovo’s ThinkStation P620 workstations. However, AMD recently announced that it was bringing the top three models to retail outlets, and the company’s partners announced several new motherboards, like the ASUS Pro WS Sage SE and the Gigabyte WRX80-SU8. Unfortunately, AMD hasn’t shared retail pricing details yet.
The consumer Threadripper models also weren’t designed to fully address the needs of the high-volume and high-margin OEM workstation market, which is key as AMD looks to expand its market share-stealing streak. AMD never specifically designed or marketed its Threadripper lineup for the workstation market, but the new Threadripper Pro chips are designed to allow the company to penetrate the lucrative OEM workstation segment for the first time in 15 years, opening a new front in AMDs battle against Intel’s highest-end chips.
AMD Threadripper Pro Series
Cores / Threads
Base / Boost (GHz)
L3 Cache (MB)
PCIe
DRAM
TDP
Threadripper Pro 3995WX
64 / 128
2.7 / 4.2
256 MB
128 Gen 4
Eight-Channel DDR4-3200
280W
Threadripper Pro 3975WX
32 / 64
3.5 / 4.2
128
128 Gen 4
Eight-Channel DDR4-3200
280W
Threadripper Pro 3955WX
16 / 32
3.9 / 4.3
64
128 Gen 4
Eight-Channel DDR4-3200
280W
Threadripper Pro 3945WX
12 / 24
4.0 / 4.3
62
128 Gen 4
Eight-Channel DDR4-3200
280W
Given that AMD’s Threadripper 3990X has already entirely redefined the high end desktop (HEDT) on the consumer side of the equation, it’s natural to expect AMD to eventually bring the advantages of its Zen 2 microarchitecture and the 7nm process to the workstation market – but that hasn’t been a quick and easy path. Fielding OEM-class systems requires passage through strict validation procedures. In the past, AMD’s customers with a strict need for OEM systems either went with the Ryzen Pro or EPYC server models instead, or chose a consumer-focused Threaddripper system from smaller custom system makers. That’s a gap that the new Threadripper Pro series aims to fill, and it certainly also helps AMD build OEM relationships and readies them for AMD’s future chips, like the Zen 3 Threadripper models that will undoubtedly come in due course.
The Threadripper Pro 3995WX comes with plenty of additives to earn the distinction of the most powerful workstation chip on the market – it’s 64 cores easily outweigh Intel’s maximum of 28 cores in a single-socket workstation. In threaded workloads, the 3995WX can even outperform dual-socket Intel systems that come with up to 56 cores.
Aside from the class-leading core counts, AMD’s Threadripper Pro also comes with other features that give it a leg up over competing chips. In many respects, the 3995WX is akin to AMD’s consumer-focused Threadripper 3990X – but on steroids. While both chips feature the same overall design with 64 cores and 128 threads, the Pro series brings eight DDR4-3200 memory channels to bear, thus providing increased memory throughput over AMD’s quad-channel Threadripper models, not to mention Intel’s six-channel Xeon W models that top out at DDR4-2933. You’ll have to step up to a dual-socket Intel-powered workstation to find more available memory channels.
The expanded memory throughput also addresses a key weakness that limits AMD’s consumer Threadripper processors in some applications – memory throughput per core – while also handily serving up more total memory bandwidth than a single Intel Xeon W chip.
AMD also bumped maximum memory capacity up to 2TB in systems that support two DIMMs per channel, a big jump over the 256GB supported with the company’s own consumer models, not to mention Intel’s competing Xeon W chips that have a 1TB limit. You’ll have to step up to Intel’s Xeon Scalable lineup, which is largely meant for servers instead of workstations, to match Threadripper Pro’s 2TB of memory capacity.
AMD also increased PCIe 4.0 support from 72 lanes with the standard Threadripper models to 128 with every chip in the Pro series, all while Intel’s Xeon W remains mired on the PCIe 3.0 interface with 64 lanes. The doubled throughput of each PCIe 4.0 lane, not to mention that the 3995WX has 2.5X more lanes, is a boon for professional users that want to use the fastest high-performance storage and networking additives, or have the ability to connect four Quadro GPUs in a single-socket chassis.
AMD positions the Threadripper Pro chips for professional studios, designers, engineers, and data scientists, all of which can benefit from increased connectivity. We put the chips to the test in professional-class applications and our standard desktop PC test suite. And yes, we took the chip for a spin through our gaming suite to see how the extra four memory channels impact gaming performance.
AMD Threadripper Pro Specifications
The Threadripper Pro chips come with the ‘WX’ suffix to denote they are designed specifically for the professional workstation market and drop into specialized single-socket WRX80 motherboards featuring the sWRX8 socket. The LGA4094 socket is physically identical to the Threadripper consumer and EPYC data center platforms. Still, it features different pin assignments: AMD enabled some pins to support more memory channels and PCIe lanes than are available on the Threadripper consumer chips, and disabled certain pins used to support multiple sockets on EPYC platforms. The chips feature the same internal chiplet-based architecture as the desktop variants, albeit with a fully-enabled I/O Die (IOD) that activates the extra PCIe lanes and two additional dual-channel memory controllers.
Cores / Threads
Base / Boost (GHz)
L3 Cache (MB)
PCIe
DRAM
TDP
MSRP/RCP
Threadripper Pro 3995WX
64 / 128
2.7 / 4.2
256
128 Gen 4
Eight-Channel DDR4-3200
280W
N/A
Threadripper 3990X
64 / 128
2.9 / 4.3
256
88 Gen 4 (72 Usable)
Quad DDR4-3200
280W
$3,990
EPYC 7442
64 / 128
2.25 / 3.4
256
128 Gen 4
Eight-Channel DDR4-3200
225W
$6,950
EPYC 7542
32 / 64
3.9 / 3.4
128
128 Gen 4
Eight-Channel DDR4-3200
225W
$3,400
Threadripper Pro 3975WX
32 / 64
3.5 / 4.2
128
128 Gen 4
Eight-Channel DDR4-3200
280W
N/A
Xeon 8280
28 / 56
2.7 / 4.0
38.5
48 Gen 3
Six-Channel DDR4-2933
205W
$10,009
Intel W-3175X
28 / 56
3.1 / 4.8
38.5
48 Gen 3
Six-Channel DDR4-2666
255W
$2999
Threadripper 3970X
32 / 64
3.7 / 4.5
*128
88 Gen 4 (72 Usable)
Quad DDR4-3200
280W
$1999
Xeon W-3275
28 / 56
2.5 / 4.6
38.5
64 Gen3
Six-Channel DDR4-2933
205W
$4,449
Threadripper 3960X
24 / 48
3.8 / 4.5
*128
88 Gen 4 (72 Usable)
Quad DDR4-3200
280W
$1,399
Xeon W-3265
24 / 48
2.7 / 4.6
33
64 Gen 3
Six-Channel DDR4-2933
205W
$3,349
Threadripper Pro 3955WX
16 / 32
3.9 / 4.3
64
128 Gen 4
Eight-Channel DDR4-3200
280W
N/A
Ryzen 9 3950X
16 / 32
3.5 / 4.7
64
64
Dual DDR4-3200
105W
$749
Threadripper Pro 3945WX
12 / 24
4.0 / 4.3
62
128 Gen 4
Eight-Channel DDR4-3200
280W
N/A
All Threadripper Pro models also support 128 lanes of PCIe 4.0 connectivity. The chips also feature a 280W TDP rating that matches the consumer models but stretches beyond the maximum 250W TDP found with the EPYC frequency-optimized series of processors.
All of the Threadripper Pro processors feature a maximum frequency over 4.0 GHz, which is important not only for lightly-threaded workloads but also for applications that are licensed on a per-core basis, meaning you pay higher licensing fees based on the number of cores present in the system. Naturally, faster cores equate to more value for your software licensing dollar.
The 280W Threadripper Pro 3995WX is AMD’s first 64-core workstation processor and, like it’s comparable EPYC and Threadripper models, comes with 256MB of L3 cache. Base frequencies weigh in at 2.7 GHz, which is much higher than EPYC’s maximum of 2.25 GHz for a 64-core processor, and 4.2 GHz for the single-core boost, which also outstrips EPYC’s 3.4 GHz boost. However, the 3995WX’s boost is 100 MHz lower than the consumer-focused Threadripper 3990X.
The 280W Threadripper Pro 3975WX weighs in at 32 cores and 64 threads that run at a 3.5 GHz base and 4.2 GHz boost, which is significantly lower than the Threadripper 3970X’s 3.7/4.5 GHz base/boost. The chip has a significantly higher boost frequency than its 32-core EPYC 7542 comparable (+800MHZ) but a lower base frequency.
Meanwhile, the 16-core 32-thread Threadripper 3955WX offers the same core counts as the Zen 2-powered Ryzen 9 3950X that drops into mainstream desktop platforms but has quadruple the memory throughput with eight memory channels along with 128 lanes of the PCIe 4.0 interface. The chip features much lower peak frequencies of 4.3 GHz than the 3950X’s 4.7 GHz, but a 400 MHz higher base clock of 3.9 GHz.
Finally, the Threadripper Pro 3945WX slots in as AMD’s first 12-core processor that surpasses a 4.0 GHz boost speed, weighing in with 4.0/4.3 GHz base/boost frequencies. This processor also comes with the full complement of eight memory channels and 128 lanes of PCIe 4.0, with high clock rates positioning the chip for applications that prize per-core performance.
AMD says its four Threadripper Pro chips compete with Intel’s entire confusing stack of workstation chips, which includes three families (W-3200, W-2200, and Xeon Scalable) that have varying features, sockets, and memory support. Even with a huge product stack that spans 85 chips, Intel’s systems top out at six channels of DDR4-2933, meaning that AMD has the memory throughput advantage that is key for large-scale simulations and models.
AMD stepped up Threadripper Pro’s ECC memory support to include UDIMMs, RDIMMs, LRDIMMs, and 3DS RDIMMs (3D stacked memory). AMD’s consumer-focused Threadripper platforms ‘unofficially’ support ECC memory, meaning true full support is spotty. As you can imagine, all Threadripper Pro workstations will come fully-validated for ECC memory. The processors also support AMD’s Memory Guard memory encryption. AMD says that comes with a slight performance penalty (a few percent) that is offset by the security advantages.
During the CES trade fair 2021, ASUS presented a lot of new and refreshed laptops based on mainly on NVIDIA GeForce RTX cards 3000 and AMD Ryzen series processors 5000. In addition to gaming news, there are also announcements of cheaper TUF Gaming devices and 14 – an inch ZenBook ultrabook Duo 14 with Intel Tiger Lake processors. This time we will focus on one of the slimmest laptops of the Taiwanese manufacturer – ZenBook 13 UM 325. Last year, the laptop was launched for the first time, but then it was based on Intel Ice Lake-U processors. This year’s version is going to the AMD Cezanne-U APU, while heading towards OLED screens and not with 4K resolution, which for many people is absurd in this diagonal.
ASUS presented new version of ZenBook laptop 13 UM 325. It will be based on AMD Ryzen 5 5600 U, AMD Ryzen 7 5800 U processors and an OLED Full HD screen.
ASUS ROG Flow X 13, ROG Zephyrus, ROG Strix – gaming laptops with AMD Cezanne-H and NVIDIA GeForce RTX 3060, RTX 3070 and RTX 3080
New ASUS ZenBook 13 UM 325 (2021) will be equipped with the following APU processors: AMD Ryzen 5 5600 U (6C / 12 T, Zen 3) and AMD Ryzen 7 5800 U (8C / 16 T, Zen 3). This is a big change, because last year’s version had a processor with up to 4 cores and 8 threads. Another change is the matrix – instead of an IPS screen, ASUS offers an OLED panel with a diagonal 13 , 3 “and resolution 1920 x 1080 pixels This is one of the newest OLED screens from Samsung that we heard about at CES 2021. 100% DCI-P3 color coverage and luminance of 400 rivets.
AMD Ryzen 5000 – premiere of Cezanne processors for laptops. Zen 3 architecture enters top notebooks
Like last year’s version, the new ASUS ZenBook 13 UM 325 has an integrated NumberPad with a touchpad. Inside the laptop you will also find 16 GB of LPDDR4x RAM clocked at 3733 MHz and a single PCIe 3.0 x4 SSD with a capacity of 1 TB. Among shared These ports can be found: 1x USB 3.2 type C Gen.2 (DP 1.4, Power Delivery), 1x USB 3.2 type A Gen.2, full HDMI 2.0b and a microSD memory card reader. As in the predecessor from 2020, there will be no 3.5 mm audio-jack socket (the adapter will be included in the set). Built-in battery with a capacity 67 Wh is supposed to allow a maximum of 16 operating hours away from a power outlet. The weight of the laptop is 1. 14 kg. Unfortunately, we do not know the price of the ASUS ZenBook 13 OLED or the date it was introduced to the store. However, by combining efficient and energy-saving AMD Ryzen processors 5000 and a Full HD OLED screen, we will certainly get one of the most interesting laptops with such a small size.
Home/Component/CPU/AMD Zen4/5 “extremely competitive”, RDNA3 to bring similar perf-per-watt improvements as RDNA2
João Silva 14 mins ago CPU, Featured Tech News, Graphics
Now that Zen 3 processors and Navi 2x GPUs have been released, we can expect AMD will be hard at work on the company’s upcoming CPU and GPU architectures. Thankfully, AMD has provided us with some details by discussing what’s coming next from Team Red.
Continuing its journey of delivering significant performance upgrades over each new generation of CPUs and GPUs, AMD’s generational leap to Zen 4 and Zen 5 should come with a similar IPC improvement as the jump from Zen 2 to Zen 3.
According to Rick Bergman, as interviewed by TheStreet, Zen 4’s improvements come from a “long list of things”. The executive vice president of AMD’s computing and graphics group said that the gains come from multiple small upgrades that, when accumulated up, offer a significant performance boost. Additionally, Bergman stated that the 5nm process node used to power Zen 4 will also allow AMD “to [obtain] better performance per watt and so on”.
RDNA3 also seems quite promising, with AMD planning to bring the same 50% performance-per-watt increase that RDNA2 delivered last year. Bergman also mentioned AMD’s DLSS equivalent, named FidelityFX Super Resolution. Right now, AMD is working with ISVs (independent software vendors) to ensure “broad platform support” without using proprietary technology. More details will be unveiled about this technology during 2021.
In different conversation between Lisa Su and Anandtech, AMD’s CEO stated that the company will be “focusing on Zen 4 and Zen 5 to be extremely competitive”. Moreover, Dr. Su made clear that the teams behind Zen 4, Zen 5, and RDNA 3 are going full-throttle on the development of the new architectures.
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