As previously announced, MediaTek today unveiled two new chips for mobile devices. The Dimensity chip 1200 is intended for the flagship models, but the same can be said for the slightly weaker Dimensity 1100 which used a slightly lower clock speed and core distribution. These systems will go to devices from brands such as realme, Xiaomi, vivo and OPPO, while the first smartphone equipped with Dimensity 1200 will be realme X9. The premieres of the hardware with the aforementioned processor are planned for the end of the first quarter 2021 of the year. Let’s check the most important differences from last year’s mobile layout for Dimensity smartphones 1000 +.

MediaTek presented two new flagships smartphones chips. Dimensity 1200 and Dimensity 1100 made in a 6 nm technological process is a significant progress in relation to Dimensity 1000.

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One important first case. Dimensity 1200 and Dimensity 1100 differ mainly in the timing of the cores and their arrangement. The first of the systems works on the basis of one Cortex-A core 78 (3 GHz), three Cortex-A cores 78 (2.6 GHz) and four Cortex-A cores 55 (2 GHz). Dimensity 1100 received four Cortex-A cores 78 (2.6 GHz) and four Cortex-A cores 55 (2 GHz) . Both chips support QHD + screens refreshed with frequency 90 Hz, while only Dimensity 1200 allows 168 Hz in FHD +. The weaker variant is compatible with 144 Hz for FHD +.

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The difference is also the resolution support of single main camera. Dimensity 1200 conforms to units up to 200 MP, Dimensity 1100 can handle the resolution up to 108 MP. Both SoCs allow 4K video recording at 60 fps. Common features of Dimensity 1200 and Dimensity 1100 include the Mali-G GPU 77 MP9, APU 3.0 six-core machine learning and Helio M modem 70 5G (Sub-6Ghz). MediaTek Dimensity’s predecessor 1000 + used Cortex-A cores 77 and Cortex-A 55, same graphics and modem, but offered support for cameras 80 MP. The chip was made in 7 nm lithography.

Source: MediaTek