Qualcomm announced at the CES 2021 the new sensors 3D Sonic which will equip high-end smartphones and will be used for fingerprint scanning for biometric authentication systems: l ‘company promises outstanding performance with high reliability and responsiveness and also the ability to identify fingerprints even with wet fingers.

Qualcomm’s second generation Sonic 3D sensors, as the name suggests, rely on ultrasonic emissions to perform the scan the three-dimensional characteristics of fingerprints , ridges and valleys, as well as the pores of a user’s finger and thus trace an extremely accurate image. It is this technology that allows fingerprints to be scanned even through solid surfaces such as glass or metal and also in case the fingertips are wet.

The 3D Sonic sensor presented today by Qualcomm also features one thickness of just 0.2 mm , for an integration without particular compromises even in the case in which the smartphone manufacturers should decide to use them inside devices with flexible edge-to-edge OLED panels.

2nd Generation 3D Sonic: Larger surface to read more information

Qualcomm declares a speed of 50% higher than the first generation sensors and a larger surface area: 8×8 mm compared to the 4×9 mm of the previous versions. The larger surface allows you to position the finger more easily and to collect the 70% more information .

The debut of the second generation Qualcomm 3D Sonic sensors will coincide with the launch of the first high-end mobile devices which will take place over the next few months.