MediaTek, which became the world’s largest supplier of smartphone system circuits in the third quarter of last year, has released its new flagship system circuits. The company’s Dimensity series grows with two new top models at once.

Dimensity 1200 is equipped with eight processor cores, divided into three performance classes according to current trends. The most efficient core of the system circuit is the 3 GHz pulsed Cortex-A 78 and below it are the three 2.6 GHz Cortex-A 78 – core and four 2 GHz Cortex-A 77 core processor clusters

The Dimensity 1100 model has, as in the past, stuck to kernels divided into two categories. The four Cortex-A 78 cores of the system circuit operate at 2.6 GHz and the four Cortex-A core at a clock frequency of 2 GHz. Both system circuits are manufactured by TSMC’s 6-nanometer process.

The graphics side of both system circuits is handled by Armin’s 9-core Mali-G 77 MC9 graphics controller, and the AI ​​side is handled by a six-core APU 3.0 AI. System chips support LPDDR4X 4266 memory and UFS 3.1 storage.

The new Dimensity supports 2520 × 1080 resolution displays at their best. Dimensity 1200 has a maximum refresh rate of 168 Hz and 1100 1200 Hz. On the camera side, both support 32 + 32 megapixel composite cameras, but with one sensor Dimensity 1200 supports up to 200 megapixels and 1100 108 megapixel camera sensor.

An integrated 5G modem is responsible for the connections of the system circuits, which supports e.g. 5G carrier aggregation (2CC) technology with FDD, TDD and DSS (Frequency Division Duplex, Time Division Duplex, Dynamic Spectrum Sharing) technologies. System circuits also support Wi-Fi 6 and Bluetooth 5.2 standards.

At this point, MediaTek did not say on which phones the new system chips will be seen first, but they should appear on the market around the turn of the first and second quarters. At least Xiaomi, Vivo, Oppo and Realme have indicated that they will release phones with new Dimensity system chips.

Source: MediaTek